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File | File in archive | Date | Context | Size | DLs | Mfg | Model |
Cyrix 6x86 Thermal Design Considerations.pdf | Cyrix 6x86 Thermal Design Considerations.pdf | 13/02/22 | Cyrix 6x86 Thermal | 296 kB | 2 | cyrix | 6x86 Thermal Design Considerations |
Them6x86.pdf | Them6x86.pdf | 28/04/05 | ... Cyrix 6x86 Thermal Design Considerations Revision 1.1, 12/17 ... | 296 kB | 203 | Cyrix | 6x86 |
HP 5517C CHAPTER 3 USER.pdf | HP 5517C CHAPTER 3 USER.pdf | 29/01/20 | 3 System Design Considerations Chapt | 796 kB | 5 | Agilent | HP 5517C CHAPTER 3 USER |
VIA Cyrix III Thermal Specifications.PDF | VIA Cyrix III Thermal Specifications.PDF | 24/03/22 | Application Note 126 Cyrix III CPU Therm | 54 kB | 0 | VIA | Cyrix III Thermal Specifications |
M1-2.pdf | M1-2.pdf | 11/09/22 | 573 kB | 0 | cyrix | M1-2 | |
M1-3.pdf | M1-3.pdf | 17/05/22 | 511 kB | 2 | cyrix | M1-3 | |
M1-6.pdf | M1-6.pdf | 25/08/22 | 398 kB | 0 | cyrix | M1-6 | |
M1-1.PDF | M1-1.PDF | 08/06/22 | 1- | 250 kB | 0 | cyrix | M1-1 |
M1-5.pdf | M1-5.pdf | 20/06/22 | 310 kB | 2 | cyrix | M1-5 | |
M1-4.pdf | M1-4.pdf | 10/09/22 | 252 kB | 0 | cyrix | M1-4 | |
cyr3_thermal.pdf | cyr3_thermal.pdf | 28/04/05 | Application Note 126 Cyrix III CPU Therm | 54 kB | 295 | VIA | Cyrix III |
a-121.pdf | a-121.pdf | 15/02/20 | Device Design and Process Conside | 3944 kB | 24 | HP | a-121 |
a-126.pdf | a-126.pdf | 22/02/20 | AN OVERVIEW OF MICROWAVE DESIGN CO | 4125 kB | 9 | HP | a-126 |
an_95-1.pdf | an_95-1.pdf | 06/03/20 | Test & Measurement | 1295 kB | 0 | HP | an 95-1 |
Application Note 127 Cyrix III CPU MotherBoard Design Considerations.PDF | Application Note 127 Cyrix III CPU MotherBoard Design Considerations.PDF | 03/06/22 | Application Note 127 Cyrix III CPU Mothe | 59 kB | 1 | cyrix | Application Note 127 III CPU MotherBoard Design Considerations |
Thermal Design Guide for the Intel® Pentium® III Processor with 512 Kbytes L2 Cache at 1.26 GHz.PDF | Thermal Design Guide for the Intel® Pentium® III Processor with 512 Kbytes L2 Cache at 1.26 GHz.PDF | 20/05/22 | Thermal Design Guideline for the Intel | 712 kB | 0 | Intel | Thermal Design Guide for the ® Pentium® III Processor with 512 Kbytes L2 Cache at 1.26 GHz |
Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease. [rev.3.00].[2004-04].pdf | Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease. [rev.3.00].[2004-04].pdf | 16/07/21 | Thermal Interface Material Comparis | 493 kB | 0 | AMD | Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease. [rev.3.00].[2004-04] |
26951 Thermal Interface Material Comparison.pdf | 26951 Thermal Interface Material Comparison.pdf | 14/03/20 | Thermal Interface Material Comparis | 496 kB | 0 | AMD | 26951 Thermal Interface Material Comparison |
Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease.pdf | Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease.pdf | 12/03/22 | Thermal Interface Material Comparis | 493 kB | 0 | . Various | Thermal Interface Material Comparison - Thermal Pads vs. Thermal Grease |
scanner.pdf | scanner.pdf | 28/07/20 | 89 kB | 6 | Data proof | scanner |