Text preview for : 5_Schematic_Diagram (1).pdf part of . Various 5 Schematic Diagram (1) . Various 5_Schematic_Diagram (1).pdf



Back to : 5_Schematic_Diagram (1).p | Home

4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.




D D


Tianjin


g l
CPU :Intel Penryn-6M (1067/800) MHz



n a
Chip Set :Intel Cantiga & ICH9M



u ti
Remarks : Montevina Platform
C C




Model Name
PBA Name
:
: MAIN s n
TIANJIN_EXT


m e BLOCK DESIGN
PCB Code
Dev. Step
Revision
:
:
:
BA41-00897A/898A
PR

S f
1.0
a id
n
B T.R. Date : 2008.06.03 B




Design

XIAOHONG ZHANG
CHECK


Co
RUJIN ZHENG
APPROVAL

BC LEE




A A
Owner : SESC Mobile R & D Signature : X
SAMSUNG
ELECTRONICS




4 3 2 1
# Mobile Intel Santa Rosa Platform Design Guide 0.5 (Dec, 2005) # Mobile Intel Crestline Platform Checklist TBD (TBD)
SRP Sheet Number: 1 of 70
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU Smart
Charging
Clocking Mobile Processor DC/DC Battery DC/DC
PG 19 Circuit Module
CK-505 IMVP-6
D
Penryn-6M D
PG18 CPU PG 66 PG 65 PG 65 PG 70
Thermistor FSB 1067
(TBD) 478pin ON BOARD
PG 19
PG 20,21,22 L2 Cache : 6/3MB
Termination VCCP / DC-DC
FSB
PG 28,29
667/800 MT/S PG 64


HDMI Channel A (Reverse) DDR II 667/800 DDR II PG 28

MCH-M SODIMM 0




g l
Dual channel DDR II Power
HDMI Cantiga-PM DDR II PG 29 PG 68
Channel B (Reverse) DDR II 667/800
Ext. PEG SODIMM 1




n a
PG 30 LCD PG 30
PEG x16 External Graphics PM45
LCD NB9M_GE
1299 FCBGA
PG 36 - 40
CRT PG 23 - 27




u ti
PG 33 CRT

Direct Media Interface CLINK




s n
C x4, 1.5V
C
SPDIF PG 13,50 USB 0,2,6 USB 0,2,6
8055 RJ45 PG 46
PCIE x1 Lane 4
PG 45
ANT




m e
USB 5 52P
PG 57 Bluetooth PCIE x1 Lane 1 ANT

ICH9-M USB 1 PG 11 Mini Card 1 (WLAN)




a id
676 BGA
PCIE x1 Lane 2 52P
HDAUDIO USB 8
High Definition Audio PG 59 Camera
Mini Card 2 (ROBSON)




S f
USB 3
PG 30 - 34
PG 11
PG 42 Aud. Audio HD Primary
AMP
ALC262 12P
PCIE x1 Lane 3
HD Secondary Express Card
PG 41 RJ11 MDC USB 4
PG 12




n
Modem
PG 13
B PG 51 B
PG 43
INT MIC




o
USB 10
SPI
HP PG 35 SPI ROM 7 IN 1
PG 14
MIC-IN LPC AU6372




C
SATA 0 PG 15

2P 2P PG 48 SATA HDD
PG 42 SATA 1
PG 49 SATA ODD

Touch
MICOM PAD PG 58
3.3V LPC, 33MHz
SPKR R
H8S-2110B
PG 47 TMKBC (TBD) KBD PG 56


SPKR L

80 Port
A LED PG 60 A


PG 52 SAMSUNG
ELECTRONICS




4 3 2 1

SRP Sheet Number: 2 of 70
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D
SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D




Crystal / Oscillator
Voltage Rails




g l
TYPE FREQUENCY DEVICE USAGE

Crystal 32.768KHz ICH9-M Real Time Clock
VDC Primary DC system power supply (7 to 21V) Crystal 10MHz MICOM HD64F2169/2160




n a
CPU_CORE Core Voltage for CPU Crystal 14.318MHz CLOCK-Generator CK-505
EGFX_CORE Core Voltage for GPU Crystal 25MHz LAN Intel LAN
P1.05V VTT for CPU, Cantiga & ICH9-M Crystal 12M nostuff R5U880 7 IN 1
P1.1 VTT for NB9M_GE
P3.3V_MICOM 3.3V always power rail (for Micom)




u ti
P1.5V 1.5V switched power rail (off in S3-S5)
P1.8V 1.8V switched power rail (off in S3-S5)
P1.8V_AUX 1.8V power rail for DDR (off in S4-S5)
P0.9V 0.9V power rail for DDR (off in S3-S5)




s n
C P3.3V 3.3V switched power rail (off in S3-S5) C
P3.3V_AUX 3.3V switched on power rail (off in S4-S5)
P5.0V 5.0V switched power rail (off in S3-S5)
P5.0V_AUX 5.0V switched on power rail (off in S4-S5)
P5.0V_ALW 5.0V always power rail
P12.0V_ALW 12.0V always power rail




m e
a id
2
I C / SMB Address
Devices
ICH9-M
Address
Master
Hex
-
Bus
SMBUS Master




S f
CPU Thermal Sensor 0111 101x 7Ah Thermal Sensor
SODIMM0 1010 000x A0h -
SODIMM1 1010 010x A4h -
Thermal Sensor on SODIMM0 0011 000x 30h -
Thermal Sensor on SODIMM1 0011 010x 34h -
CK-505M (Clock Generator) 1101 0010 D2h Clock, Unused Clock Output Disable



USB PORT Assign PCI Express Assign




n
B PORT # ASSIGNED TO PORT # ASSIGNED TO B
0 SYSTEM PORT 0
1 Mini PCI Express 2




o
2 SYSTEM PORT 1 1 Mini Card 1 (WLAN)
3 ROBSON 2 Mini Card 2 (ROBSON)
4 EXPRESS CARD 3 EXPRESS CARD
5 Bluetooth 4 LOM
6 SYSTEM PORT 2 5 NC




C
7 NC 6 NC
8 Camera
9 NC
10 7 IN 1




REVISION HISTORY
LCD Pannel Detect (TBD)

Devices Resolution PANNEL_DETECT_0(strap0)
See rev notes for more information.
A A


SAMSUNG
ELECTRONICS




4 3 2 1

SRP Sheet Number: 3 of 70
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS

POWER DIAGRAM
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Rev 0.1



D KBC3_SUSPWR KBC3_PWRON D
(CHP3_S4_STATE*) (CHP3_SLPS3*) KBC3_VRON

AC Adapter
PENRYN
P1.05V CANTIGA CPU_CORE PENRYN
ICH9-M



VDC P1.8V_AUX Cantiga




g l
Battery DC SODIMM (DDR II)
P1.1V NB9M_GE




n a
u ti
P0.9V DDR II-Termination
P1.8V NB9M_GE
GDDR-3 for NB9M_GE




s n
C C
P0.9V DDR II-Termination

P3.3V_MICOM
ICH9_M




m e
MICOM LED ICH9_M P5V_AUX USB connector THERMAL CRT HDMI
AUDIO
ICH9_M MICOM AUDIO
P5.0V ODD HDD CAMERA




a id
TOUCH PAD




S f EGFX_CORE
ICH9-M NB9M_GE
EXPRESS CARD
WLAN
P5.0V_ALW P3.3V_AUX ROBSON
LAN
MDC
THERMAL




n
LVDS CK505
LED CANTIGA
P1.5V ICH9_M
B WLAN B
ROBSON




o
EXPRESS CARD

P1.2V_LAN




C
LAN CK505 THERMAL CANTIGA
P12.0V_ALW DDR2 NB9M_GE CRT
LVDS HDMI ICH9_M
P3.3V SPI WLAN ROBSON
LAN AUDIO EXPRESS CARD
P1.8V_LAN HDD BT R5U880
P2.5V_LAN KBD LEDS

Power On/Off Table by S-state
LAN

Rail

State S0 S3 S4 S5

+V*A(LWS) S5-S4 S3 S0
ON ON ON ON
+V*LAN
A +1.8V_AUX
A
ON ON
+0.9V

+V*AUX ON ON
SAMSUNG
ELECTRONICS
+V ON

+V* (CORE) ON

4 3 2 1

SRP Sheet Number: 4 of 70
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER RAILS ANALYSIS
D 220V
Rev. 0.6 (060920) D
5.0V_AUX ( TBD A )




Adapter Battery
3.3V_AUX ( TBD A )




MICOM 3V ( TBD A )
1.8V ( TBD A )




g l
1.05V 0.1 A (TBD) ITP

CPU CORE MICOM 3V
Penryn-6M




n a
CPU CORE ( TBD A ) 1.05V (VCCP) 41 A (TBD) 3.3V Thermal 3.3V 0.08 A (TBD) KBC
0.75 A (TBD) 0.08 A (TBD)
1.05V ( TBD A ) 4.5 A (TBD) Sensor
1.5V ( 35 W )
1.5V ( TBD A ) 0.13 A (TBD)
1.25V ( TBD A )




u ti
3.3V ( TBD A ) MICOM 3V
5.0V ( TBD A ) 1.05V (MCH CORE)
0.1 A (TBD) PWR LED
1.8V_AUX ( TBD A ) 1.05V (VCCP) 7.7 A (TBD)
0.9V( TBD A ) 4.48 A (TBD) Cantiga




s n
C 1.5V
0.125 A (TBD)
1.8V C
3.3V CLOCK
1.25V GMCH 0.25 A (TBD) 3.3V
VGA CORE (TBD A)




2.43A (TBD)
VDC INV ( TBD A )




3.3V
0.33 A (TBD)
PEX IO (TBD A)




1.8V_AUX
3.79 A (TBD) (8 - 8.5 W )
RTC_Battery




3.3V KeyBoard
0.2 A (TBD)




m e
3.3V_AUX
0.6 A (TBD) LAN
1.05V
1.13 A (TBD)
1.5V
2.4A (TBD) ICH9-M




a id
3.3V 3.3V KBD LED
0.374 A (TBD) 0.01 A (TBD) 3.3V_AUX
3.3V_AUX 0.1 A (TBD) SD Card
0.209 A (TBD)
5V
0.001 A (TBD)
5V_AUX
RTC_Battery
0.001 A (TBD) ( ~ 2.0 W ) 3.3V 3.3V




S f
0.006 A (TBD) 0.015 A (TBD) SPI
5V

1.0V-1.1V (EGFX CORE) 3.3V
17.75 A (TBD) 0.06 A (TBD) HD Audio 3.3V
5V 1.5 A (TBD)
0.07 A (TBD) 3.3V_AUX
1.8V 0.5 A (TBD) Mini Card X 2
6.53 A (TBD) PEG 1.5V 0.75A (TBD)
1.2V (PEX IO)




n
1.75 A (TBD) 5V
3.3V
1.5 A (TBD) ODD SATA
0.67 A (TBD)
B 3.3V_AUX B
1.8V_AUX
0.5 A (TBD) MDC




o
0.9V
3.1 A (TBD) DDR-2 5V 0.22 A (TBD) SATA HDD
1 A (TBD) (Dual slots)
( ~ 5.0 W )




C
1.8V 3.1 A (TBD) GDDR 5V 0.16 A (TBD) FAN

3.3V (LCD 3V)
0.67 A (TBD) 5V Audio AMP
19V (VDC INV)
0.5 A (TBD)
LCD 1.5 A (TBD)



P3.3V_AUX 5V
P1.2V_LAN
0.08 A (TBD) 2 A (TBD) USB (x 3)
P1.8V/2.5V_LAN
0.29 A (TBD) LAN (88E8055)
0.15 A (TBD)

5V 0.2 A (TBD) Touch Pad

A A


SAMSUNG
Value by Datasheet/Application notes (Value by measurement) ELECTRONICS




4 3 2 1

SRP Sheet Number: 5 of 70
4 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS Host Boot / ME Off
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS (SLPS4* = S4_STATE*) > (SLPM* = SLPS3*)
RTC PRTC_BAT
1 POWER SEQUENCE
EXCEPT AS AUTHORIZED BY SAMSUNG. Rev. 0.7
M-1) KBC3_DDR_PWRON (TBD) = 8) KBC3_SUSPWR Battery CHP3_RTCRST#




6) P3.3V_AUX
M-2) KBC3_ME_PWRON = 15) KBC3_PWRON CHP3_ME_RTCRST#
Host / ME Boot
(SLPS4* = S4_STATE*) > SLPM* > SLPS3*
15) VRM3_CPU_PWRGD
D PRTC PRTC
15 D
Host S5 / ME Boot 16
POWER 8
(SLPS4* = SLPM*) > S4_STATE* > SLPS3*
16) CLK3_PWRGD CK-505 16-1) Clock Running




LAN100_SLP


INTVRMEN
10-1) P1.05V
Sheet 8
S/W 8) CHP3_SLPS5#/4#/3#

11) VCCP3_PWRGD (GM-model)

7 7) KBC3_RSMRST# 7) P1.05V_AUX