File information: | |
File name: | 02_warning.pdf [preview 02 warning] |
Size: | 31 kB |
Extension: | |
Mfg: | panasonic |
Model: | 02 warning 🔎 |
Original: | 02 warning 🔎 |
Descr: | panasonic LED TX-42AX500E PCZ1402033CE doc 02_warning.pdf |
Group: | Electronics > Documentation |
Uploaded: | 20-04-2020 |
User: | Anonymous |
Multipart: | No multipart |
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Decompress result: | OK | |
Extracted files: | 1 | |
File name 02_warning.pdf Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD). 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Caution Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device). IMPORTANT SAFETY NOTICE There are special components used in this equipment which are important for safety. These parts are marked by in schematic diagrams, exploded views and replacement parts list. It is essential that these critical parts should be replaced with manufacturer's specified parts to prevent shock, fire, or other hazards. Do not modify the original design without permission of manufacturer. About lead free solder (PbF) Note: Lead is listed as (Pb) in the periodic table of elements. |
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