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Data sheet acquired from Harris Semiconductor SCHS083B ­ Revised March 2003 The CD4536B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (DW, DWR, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright 2003, Texas Instruments Incorporated MECHANICAL MPDI002C ­ JANUARY 1995 ­ REVISED DECEMBER 20002 N (R-PDIP-T**) 16 PINS SHOWN PLASTIC DUAL-IN-LINE PACKAGE PINS ** DIM A 16 9 A MAX 14 0.775 (19,69) 0.745 (18,92) 16 0.775 (19,69) 0.745 (18,92) 18 0.920 (23,37) 0.850 (21,59) 20 1.060 (26,92) 0.940 (23,88) A MIN 0.260 (6,60) 0.240 (6,10) C MS-100 VARIATION AA BB AC AD 1 0.070 (1,78) 0.045 (1,14) D 8 0.045 (1,14) 0.030 (0,76) D 0.020 (0,51) MIN 0.325 (8,26) 0.300 (7,62) 0.015 (0,38) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.010 (0,25) NOM Gauge Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M 0.430 (10,92) MAX 14/18 PIN ONLY 20 pin vendor option D 4040049/E 12/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A). D. The 20 pin end lead shoulder width is a vendor option, either half or full width. POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 MECHANICAL DATA MSOI003E ­ JANUARY 1995 ­ REVISED SEPTEMBER 2001 DW (R-PDSO-G**) 16 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 9 PLASTIC SMALL-OUTLINE PACKAGE 0.050 (1,27) 16 0.010 (0,25) 0.419 (10,65) 0.400 (10,15) 0.299 (7,59) 0.291 (7,39) 0.010 (0,25) NOM Gage Plane 0.010 (0,25) 1 A 8 0°­ 8° 0.050 (1,27) 0.016 (0,40) Seating Plane 0.104 (2,65) MAX 0.012 (0,30) 0.004 (0,10) PINS ** DIM A MAX 0.004 (0,10) 16 0.410 (10,41) 0.400 (10,16) 18 0.462 (11,73) 0.453 (11,51) 20 0.510 (12,95) 0.500 (12,70) 24 0.610 (15,49) 0.600 (15,24) 28 0.710 (18,03) 0.700 (17,78) 4040000/E 08/01 A MIN NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MS-013 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 MECHANICAL DATA MTSS001C ­ JANUARY 1995 ­ REVISED FEBRUARY 1999 PW (R-PDSO-G**) 14 PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 14 8 0,30 0,19 0,10 M 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0°­ 8° 0,75 0,50 Seating Plane 1,20 MAX 0,15 0,05 0,10 PINS ** DIM A MAX 8 14 16 20 24 28 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 · DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated a