LG B1200 10 free download

File name LG B1200 10.pdf

5. TEST POINT DATA 5. TEST POINT DATA Component Side (1-1) 1 2 3 13 4 11 5 6 7 14 12 8 16 9 15 10 - 35 - 5. TEST POINT DATA Location Component Side (1-1) 1 J103 Battery connector : For damage or cold soldering cause power on failure 2 Q101 P-channel MOSFET with schottky diode : For damage or cold soldering cause charger function failure 3 U202 Nausica_CS : analog baseband chipset (ABB) 4 U201 Hercrom20 : digital baseband chipset (DBB) 5 U301 16Mbit flash ROM : For damage or cold soldering cause power on failure 6 U101 3V, 200mA LDO regulator : For damage or cold soldering cause accessory power failure. 7 Q301 Isolated dual transistors : For damage or cold soldering Q301A cause vibration motor Failure, Q301B cause keypad back-light failure 8 Q302 Isolated dual transistors : For damage or cold soldering Q302A cause pre-charger indication failure, Q302B cause the LCD back-light failure 9 J301 Vibration motor : For damage or bad connection cause vibrator failure. 10 J104 System connector : For damage or cold soldering cause headset failure, trace/debug /SW download failure 11 J102 SIM connector : For damage or bad connection cause SIM card failure. 12 U302 Audio amplifier : For damage cause speaker function failure. 13 Y201 32.768kHz crystal : For damage cause RTC function failure. 14 R104 8P4R resistor network : For damage or cold soldering cause trace/debug R105 /SW download failure R109 15 D313 Switching diode array : For damage or cold soldering cause the surge noise by Vibrator 16 D102 Switching diode array : For damage or cold soldering cause the flash fast program function failure - 36 - 5. TEST POINT DATA Component Side (1-2) 23 19 33 18 29 21 20 26 22 25 24 32 30 28 31 27 - 37 - 5. TEST POINT DATA Location Component Side (1-2) 18 C223 VR2B regulator