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Technical Description Ericsson Handheld Telephone 1341-B Technical Description 2 Technical Description Contents Design ________________________________________________ 6 Mechanical ______________________________________________ 6 Electronics ______________________________________________ 6 Functional Overview __________________________________ 7 Reception _______________________________________________ 7 Transmission_____________________________________________ 8 Automatic Frequency Control (AFC)__________________________ 8 Low Frequency (Audio) Processing ___________________________ 8 Companding _____________________________________________ 9 Logic ___________________________________________________ 9 Power Supply ___________________________________________ 9 Functional Blocks and Units Description ____________ 10 Frequency Generation_____________________________________ 10 VCTCXO____________________________________________ 10 Rx Frequency Synthesizer_______________________________ 10 Tx Frequency Synthesizer _______________________________ 12 Transmitter _____________________________________________ 12 Driver Stage__________________________________________ 13 Control of Output Power ________________________________ 13 Receiver _______________________________________________ 13 RF-Stage ____________________________________________ 13 IF Stage _____________________________________________ 13 Power Supply Monitoring _________________________________ 14 Power Supply: Charging __________________________________ 15 Control Logic ___________________________________________ 15 System Interface ______________________________________ 16 Processor ____________________________________________ 16 Display _____________________________________________ 16 Keyboard ____________________________________________ 16 Audio Processing ________________________________________ 17 Audio Circuits in Transmission___________________________ 17 Audio Circuits in Reception _____________________________ 18 ON/OFF-Button _________________________________________ 18 Continued on next page 3 Technical Description The Major IC Packages ______________________________ 19 CARL ________________________________________________ 19 Built-in Microprocessor _______________________________ 19 Serial Port (in Processor) _______________________________ 20 ROM ______________________________________________ 20 RAM ______________________________________________ 20 Clock Generator _____________________________________ 20 Modem ____________________________________________ 20 SAT ____________________________________