File information: | |
File name: | NSM3-013.PDF [preview NSM3-013] |
Size: | 8 kB |
Extension: | |
Mfg: | NOKIA |
Model: | NSM3-013 🔎 NSM3013 |
Original: | NSM3-013 🔎 |
Descr: | NOKIA Mobile Phone Nokia_8210 NSM3-013.PDF |
Group: | Electronics > GSM Mobile Phones |
Uploaded: | 13-07-2022 |
User: | Anonymous |
Multipart: | No multipart |
Information about the files in archive: | ||
Decompress result: | OK | |
Extracted files: | 1 | |
File name NSM3-013.PDF CONFIDENTIAL 1 (1) Nokia Mobile Phones Service Bulletin No. SB-013/15.02.00 Technical Support, Europe & Africa NSM-3 HARDWARE CHANGES HW version changed from HW1120 to HW1210 New PCB version RM7L_12 has been released for NSM-3, this improves the fitting of PCB to phone mechanics. HW version changed from HW1210 to HW1220 - C132 is changed from ceramic to tantalum type (reduces the possibility of noise caused by mechanical vibration of ceramic capacitor) - C861 is added and L505 is changed to improve GSM1800 band TX quality CODE ITEM DESCRIPTION Deleted 2310793 C132 CHIPCAP X5R 2U2 K 10V 0805 Added 2611741 C132 CHIPTCAP 4U7 M 10V 2.0X1.3X1.2 Added 2320621 C861 CHIPCAP NPO 0P5 C 50V 0402 Added 3646051 L505 CHIP COIL 3N9+-0N3 Q28/800M 0402 Deleted 3646053 L505 CHIP COIL 4N7+-0N3 Q28/800M 0402 Note: No changes are needed for phones coming to service. NSM-3 SB-013 |
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