Harman Kardon AVR-247 & 230 free download

File name AVR-247 & 230.pdf

harman/kardon AVR247/230 Service Manual harman/kardon Service Manual AVR247/230 5 x 50W 7.1 CHANNEL A/V RECEIVER CONTENTS ESD WARNING...2 ELECTRICAL PARTS LIST...12 BASIC SPECIFICATIONS...3 SEMICONDUCTOR PINOUTS...54 TROUBLESHOOTING GUIDE...4 PCB DRAWINGS...110 PROCESSOR RESET...4 BLOCK DIAGRAM...119 PACKAGE LIST AND PARTS...5 WIRING DIAGRAM...120 DISASSEMBLY...6 AMP BIAS ADJUSTMENT...121 UNIT EXPLODED VIEW AND PARTS...11 SCHEMATIC DIAGRAMS...122 Released EU2008 harman/kardon, Inc. Rev 0, 05/2008 250 Crossways Park Dr. Woodbury, New York, 11797 Page 1 of 131 harman/kardon AVR247/230 Service Manual Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to