Intel Thermal Design Guidelines free download

File name Thermal Design Guidelines.pdf

AP-480 APPLICATION NOTE Pentium PROCESSOR THERMAL DESIGN GUIDELINES REV 2 0 November 1995 Order Number 241575-003 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoev- er including infringement of any patent or copyright for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products Intel retains the right to make changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata Other brands and names are the property of their respective owners Since publication of documents referenced in this document registration of the Pentium OverDrive and iCOMP trademarks has been issued to Intel Corporation Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order Copies of documents which have an ordering number and are referenced in this document or other Intel literature may be obtained from Intel Corporation P O Box 7641 Mt Prospect IL 60056-7641 or call 1-800-879-4683 COPYRIGHT INTEL CORPORATION 1996 Pentium PROCESSOR THERMAL DESIGN GUIDELINES REV 2 0 CONTENTS PAGE CONTENTS PAGE 4 4 Thermal Resistance 7 1 0 INTRODUCTION 4 1 1 Document Goal 4 5 0 DESIGNING FOR THERMAL PERFORMANCE 8 2 0 IMPORTANCE OF THERMAL 5 1 Heat Sinks 9 MANAGEMENT 4 5 2 Airflow 13 3 0 Pentium PROCESSOR POWER 5 3 Fans 13 SPECIFICATIONS 5 5 4 Thermal Performance Validation 13 4 0 THERMAL PARAMETERS 5 6 0 CONCLUSION 13 4 1 Ambient Temperature 5 4 2 Case Temperature 6 APPENDIX A A-1 4 3 Junction Temperature 6 APPENDIX B B-1 AP-480 1 0 INTRODUCTION 1 1 Document Goal In a system environment the Pentium processor's The goal of this document is to provide thermal per- temperature is a function of both the system and com- formance information for the Pentium processor and ponent thermal characteristics The system level ther- recommendations for meeting the thermal requirements mal constraints imposed on the package are local ambi- imposed on systems This application note attempts to ent temperature and thermal conductivity (i e airflow