File information: | |
File name: | ts500le.zip [preview KX-TS500LEW] |
Size: | 455 kB |
Extension: | RAR |
Mfg: | Panasonic |
Model: | KX-TS500LEW 🔎 KXTS500LEW |
Original: | |
Descr: | È KX-TS500LEB |
Group: | Electronics > Consumer electronics > Telephones |
Uploaded: | 04-10-2008 |
User: | mitachi |
Multipart: | No multipart |
Information about the files in archive: | ||
Decompress result: | OK | |
Extracted files: | 1 | |
File name ts500le.pdf ORDER NO. KM40607123CE Telephone Equipment KX-TS500LEB KX-TS500LEW Integrated Telephone System Black Version White Version (for Caribbean States) © 2006 Panasonic Communications Co., Ltd. All rights reserved. Unauthorized copying and distribution is a violation of law. KX-TS500LEB / KX-TS500LEW Note: Because section 3 of this manual is an extract from the operating instructions for this model, it is subject to change without notice. You can download and refer to the original operating instructions on TSN Server for further information. CONTENTS Page 1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 1.1. Suggested PbF Solder 1.2. How to Recognize that Pb Free Solder is Used 2 FOR SERVICE TECHNICIANS 3 OPERATING INSTRUCTIONS 3.1. Location of Controls 3.2. Connection 3.3. Troubleshooting 4 DISASSEMBLY INSTRUCTIONS 5 TROUBLESHOOTING GUIDE 5.1. Service Hints 5.2. Pulse Dialing Problems 5.3. Problems With the Handset 5.4. Tone Dialing Problems 5.5. Problems With Ringer 5.6. How to Check IC1 (Scanning to the key) 6 BLOCK DIAGRAM 7 CIRCUIT OPERATIONS 3 3 4 5 6 6 6 6 7 8 8 8 9 9 10 11 12 13 7.1. Telephone Line Interface and Pulse Dial Circuit 7.2. Tone Dial Circuit 7.3. Power Circuit and Redial Back-up Circuit 8 OPTION JUMPER TABLE 9 CPU DATA 10 CABINET AND ELECTRICAL PARTS LOCATION 11 ACCESSORY AND PACKING MATERIALS 12 TERMINAL GUIDE OF ICs TRANSISTORS AND DIODES 13 REPLACEMENT PARTS LIST 13.1. Base Unit 13.2. Accessories and Packing Materials 14 FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM) 15 SCHEMATIC DIAGRAM 16 CIRCUIT BOARD 16.1. Main (Component View) 16.2. Main (Flow Solder Side View) 16.3. Operation (Flow Solder Side View) Page 13 13 14 15 16 17 18 19 20 20 21 23 24 27 27 28 29 2 KX-TS500LEB / KX-TS500LEW 1 ABOUT LEAD FREE SOLDER (PbF: Pb free) Note: In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead. We will use PbF Solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), Silver (Ag), and Copper (Cu). This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder. Caution · PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). · Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. · PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C). · When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the opposite side (See the figure below). 1.1. Suggested PbF Solder There are several types of PbF solder available commercially. While this product is manufactured |
Date | User | Rating | Comment |