File information: | |
File name: | HarmanKardon-HK3490 rec.part1.rar [preview HK3490] |
Size: | 3072 kB |
Extension: | |
Mfg: | Harman/Kardon |
Model: | HK3490 🔎 |
Original: | |
Descr: | receiver |
Group: | Electronics > Consumer electronics > Audio |
Uploaded: | 01-01-2010 |
User: | AndyMn |
Multipart: | 0 1 2 |
Information about the files in archive: | ||
Decompress result: | OK | |
Extracted files: | 1 | |
File name HarmanKardon-HK3490 rec.pdf harman/kardon HK3490 STEREO RECEIVER SERVICE MANUAL CONTENTS ESD WARNING...2 DISASSEMBLY...27 LEAKAGE TESTING...3 UNIT EXPLODED VIEW...30 BASIC SPECIFICATIONS...4 EXPLODED VIEW PARTS LIST...31 PACKAGING...5 AMP BIAS ADJUSTMENT...32 FRONT PANEL CONTROLS...6 BLOCK DIAGRAM...33 REAR PANEL CONNECTIONS...8 PCB DRAWINGS...34 REMOTE CONTROL FUNCTIONS...11 ELECTRICAL PARTS LIST...40 CONNECTIONS/INSTALLATION...14 SEMICONDUCTOR PINOUTS...63 OPERATION...21 SCHEMATICS...104 TROUBLESHOOTING GUIDE...26 WIRING DIAGRAM...108 PROCESSOR RESET...26 harman/kardon, Inc. 250 Crossways Park Dr. Released 2008 Woodbury, New York 11797 Rev0 6/2008 Discontinued XXXX HK3490 harman/kardon Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder remo |
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