File information: | |
File name: | Sony-M430 micro cass.pdf [preview M430] |
Size: | 596 kB |
Extension: | |
Mfg: | Sony |
Model: | M430 🔎 |
Original: | |
Descr: | microcassette recorder |
Group: | Electronics > Consumer electronics > Audio |
Uploaded: | 09-04-2010 |
User: | AndyMn |
Multipart: | No multipart |
Information about the files in archive: | ||
Decompress result: | OK | |
Extracted files: | 1 | |
File name Sony-M430 micro cass.pdf M-430 SERVICE MANUAL Ver 1.0 1999. 02 US Model AEP Model E Model Model Name Using Similar Mechanism Tape Transport Mechanism Type NEW MZ-430-99 SPECIFICATIONS Tape y (normal position type) Recording system 2-track 1-channel monaural Speaker Approx. 3.6 cm (1 7/16 in.) dia. Tape speed 2.4 cm/s (15/16 ips), 1.2 cm/s (15/32 ips) Frequency range 250 - 4,000 Hz (with TAPE SPEED switch at 2.4 cm/s) Output Earphone jack (minijack) for 8 - 300 ohms earphone Power output (at 10% harmonic distortion) 160 mW Power requirements 3 V DC batteries size AA (R6) × 2/External DC 3 V power sources Dimensions (w/h/d) Approx. 62.2 × 121.5 × 24.3 mm (2 1/2 × 4 7/8 × 31/32 in.) incl. projecting parts and controls Mass Approx. 125 g (4.5 oz.) Supplied accessory Microcassette tape MC-30 (1) Design and specifications are subject to change without notice. MICROCASSETTETM-CORDER MICROFILM 1 TABLE OF CONTENTS 1. GENERAL ... 3 2. DISASSEMBLY 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. Lid Assy, Cassette ... 4 Lid, Battery Case ... 5 Cabinet (Rear) Assy ... 5 Main Board ... 6 Mechanism Deck ... 6 Head, Ceramic ... 7 3. MECHANICAL ADJUSTMENTS ... 8 4. ELECTRICAL ADJUSTMENTS ... 8 5. DIAGRAMS 5-1. Block Diagram ... 10 5-2. Printed Wiring Board ... 11 5-3. Schematic Diagram ... 13 6. EXPLODED VIEWS 6-1. Cabinet Section ... 15 6-2. Mechanism Deck Section ... 16 7. ELECTRICAL PARTS LIST ... 17 Notes on Chip Component Replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around 270°C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). · Be careful not to apply force on the conductor when soldering or unsoldering. 2 SECTION 1 GENERAL This section is extracted from instruction manual. 3 SECTION 2 DISASSEMBLY · The equipment can be removed using the following procedure. Set Lid assy, cassette Lid, battery case Cabinet (rear) assy Main board Mechanism deck Head, ceramic Note : Follow the disassembly procedure in the numerical order given. 2-1. LID ASSY, CASSETT |
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