Sony M730V, M830V free download

File name Sony-M730v_830v micro cass.pdf

M-730V/830V SERVICE MANUAL Ver 1.0 1999.04 Ver 1.1 1999. 01 US Model Canadian Model AEP Model E Model M-730V/830V Chinese Model M-730V Tourist Model M-830V Photo : M-830V Model Name Using Similar Mechanism Tape Transport Mechanism Type NEW MZ-730V-99 SPECIFICATIONS MICROCASSETTETM-CORDER MICROFILM ­1­ TABLE OF CONTENTS 1. GENERAL ... 3 2. DISASSEMBLY 2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. 2-8. Lid Assy, Cassette ... 4 Lid, Battery Case ... 4 Cabinet (Rear) Assy ... 5 Speaker Assy, Microphone ... 5 Main Board ... 6 Mechanism Deck ... 6 LED Unit ... 7 Head, Creamic (HRPE901, 902) ... 7 3. MECHANICAL ADJUSTMENTS ... 8 4. ELECTRICAL ADJUSTMENTS ... 8 5. DIAGRAMS 5-1. Block Diagram ... 11 5-2. Printed Wiring Board ... 13 5-3. Schematic Diagram ... 15 6. EXPLODED VIEWS 6-1. Cabinet Section ... 17 6-2. Mechanism Deck Section (1) ... 19 6-3. Mechanism Deck Section (2) ... 20 7. ELECTRICAL PARTS LIST ... 21 Notes on Chip Component Replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing · Keep the temperature of the soldering iron around 270°C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). · Be careful not to apply force on the conductor when soldering or unsoldering. ­2­ SECTION 1 GENERAL 1 2 3 4 5 6 7 8 9 0 VOL knob MIC jack EAR jack VOR switch REC/BATT lamp FAST PB switch (M-830V ONLY) DC IN 3V jack TAPE COUNTER CUE MARKER button (M-830V ONLY) i(Battery) lamp (M-830V ONLY) !Ў !TM !Ј !ў ! !§ !¶ !· !Є Microphone r(REC) button C PAUSE knob oe(Playback) button CUE/REVIEW knob TAPE SPEED select knob wp(Eject/Stop) button DIR c knob FWD/REV ­3­ SECTION 2 DISASSEMBLY · The equipment can be removed using the following procedure. Set Lid assy, cassette Lid, battery case Cabinet (rear) assy Speaker assy, Microphone Main board Mechanism deck Head, ceramic (HRPE901,902) LED unit Note : Follow the disassembly procedure in the numerical order gi