Sony XM2100GTX free download

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XM-2100GTX SERVICE MANUAL Ver 1.0 2004. 01 US Model Canadian Model AEP Model UK Model E Model SPECIFICATIONS AUDIO POWER SPECIFICATIONS (US MODEL) POWER OUTPUT AND TOTAL HARMONIC DISTORTION 100 watts per channel minimum continuous average power into 4 ohms, both channels driven from 20 Hz to 20 kHz with no more than 0.04% total harmonic distortion per Car Audio Ad Hoc Committee standards. Other Specifications OTL (output transformerless) circuit Pulse power supply Inputs RCA pin jacks High level input connector Outputs Speaker terminals Through out pin jacks Suitable speaker impedance 2 ­ 8 (stereo) 4 ­ 8 (when used as a bridging amplifier) Maximum outputs 200 W Ч 2 (at 4 ) 275 W Ч 2 (at 2 ) 550 W (monaural) (at 4 ) Rated outputs (supply voltage at 14.4 V) 100 W Ч 2 (20 Hz ­ 20 kHz, 0.04% THD, at 4 ) 300 W Ч 2 (20 Hz ­ 20 kHz, 0.1% THD, at 2 ) 600 W (monaural) (20 Hz ­ 20 kHz, 0.1% THD, at 4 ) Frequency response 5 Hz ­ 50 kHz ( +0 dB) ­3 Harmonic distortion 0.008% or less (at 1 kHz, 4 ) Circuit system Input level adjustment range 0.2 ­ 6.0 V (RCA pin jacks) 1.2 ­ 12.0 V (High level input) Low-pass filter 50 ­ 300 Hz, ­12 dB/oct Low boost 0 ­ 10 dB (40 Hz) Power requirements 12 V DC car battery (negative ground) Power supply voltage 10.5 ­ 16 V Current drain at rated output : 25 A (4 ) Remote input : 1 mA Dimensions Approx. 307 Ч 55 Ч 200 mm (12 1/8 Ч 2 1/4 Ч 7 7/8 in.) (w/h/d) not incl. projecting parts and controls Mass Approx. 2.7 kg (6 lb.) not incl. accessories Supplied accessories Mounting screws (4) High level input cord (1) Protection cap (1) Design and specif ications are subject to c hange without notice . Notes on Chip Component Replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. STEREO POWER AMPLIFIER 9-877-516-01 2004A04-1 © 2004. 01 Sony Corporation e Vehicle Company Published by Sony Engineering Corporation 1 XM-2100GTX TABLE OF CONTENTS 1. GENERAL Location and Function of Controls ... 3 Connections ... 4 2. DISASSEMBLY 2-1. Bottom Plate ... 7 2-2. Main Board Section ... 8 2-3. Main Board ... 8 3. DIAGRAMS 3-1. 3-2. 3-3. 3-4. 3-5. Note for Printed Wiring Board and Schematic Diagram ... 9 Waveform ... 9 IC Block Diagram ... 9 Printed Wiring Board ­Main Section­ ... 10 Schematic Diagram ­Main Section­ ... 11 4. EXPLODED VIEWS 4-1. Heat Sink (Main) Section ... 13 4-2. Main Board Section ...