File name SONY HCD-DX80.PDFHCD-DX80
SERVICE MANUAL
Ver 1.0 2001.03
E Model
· HCD-DX80 is the tuner, deck, CD and amplifier section in MHC-DX80.
Model Name Using Similar Mechanism CD Section CD Mechanism Type Base Unit Name Optical Pick-up Name Tape deck Section Model Name Using Similar Mechanism Tape Transport Mechanism Type
HCD-DX50 CDM58E-30BD60 BU-30BD60 A-MAX.3 NEW TCM-230AWR41
SPECIFICATIONS
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MINI HI-FI COMPONENT SYSTEM
9-929-593-11
2001C0500-1 C 2001.3
Sony Corporation
Audio Entertainment Group General Engineering Dept.
HCD-DX80
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement · Never reuse a disconnected chip component. · Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing · Keep the temperature of soldering iron around 270°C during repairing. · Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). · Be careful not to apply force on the conductor when soldering or unsoldering.
SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
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HCD-DX80
TABLE OF CONTENTS
MODEL IDENTIFICATION
-- BACK PANEL --
1. 2.
2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. 2-8. 2-9.
GENERAL ... 4
7 7 8 8 9 9 10 10 11 11 12 12
PARTS No.
DISASSEMBLY ... Disassembly Flow ... Case (Top) ... Loading Panel ... CD Mechanism Deck (CDM |