File information: | |
File name: | hfe_harman_kardon_avr7200_service.pdf [preview hfe harman kardon avr7200 service] |
Size: | 17849 kB |
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Mfg: | DENON |
Model: | hfe harman kardon avr7200 service 🔎 |
Original: | hfe harman kardon avr7200 service 🔎 |
Descr: | DENON Audio AVR7200 hfe_harman_kardon_avr7200_service.pdf |
Group: | Electronics > Consumer electronics > Audio |
Uploaded: | 21-11-2019 |
User: | Anonymous |
Multipart: | No multipart |
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Decompress result: | OK | |
Extracted files: | 1 | |
File name hfe_harman_kardon_avr7200_service.pdf harman/kardon AVR7200 A/V DOLBY DIGITAL RECEIVER SERVICE MANUAL CONTENTS ESD WARNING...2 EXPLODED VIEW PARTS LIST...19 LEAKAGE TESTING...3 BLOCK DIAGRAM...22 BASIC SPECIFICATIONS...4 DC OFFSET/IDLE CURRENT ADJ...23 FRONT PANEL CONTROLS...5 BULLETIN HK2003-04...24 INFORMATION DISPLAY...7 TECH TIP HKTT2003-01...25 REAR PANEL CONNECTIONS...8 ELECTRICAL PARTS LIST...26 REMOTE CONTROL FUNCTIONS...11 PCB DRAWINGS...74 INSTALLATION/CONNECTIONS...14 SEMICONDUCTOR PINOUTS...99 TROUBLESHOOTING GUIDE...17 SCHEMATICS...158 PROCESSOR RESET...17 WIRING DIAGRAM...183 UNIT EXPLODED VIEW...18 PACKAGING PARTS LIST...184 harman/kardon, Inc. 250 Crossways Park Dr. Woodbury, New York 11797 Rev1 7/2005 AVR7200 harman/kardon Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge build-up or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to |
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