Intel ch 11 free download

File name ch_11.pdf

International Packaging Specifications 11 11.1 Electronic Industries Association of Japan (EIAJ) EIAJ publishes the following rules and standards as they apply to the preparation of outline drawings of integrated circuits. Number Nomenclature ED -7300 Recommended practice on standard for the preparation of outline drawings of semiconductor packages ED -7301 Manual or the standard of integrated circuits package ED -7302 Manual for integrated circuits package design guideline ED -7303 Name and code for integrated circuits package ED -7304 Measuring method for package dimensions of ball grid array (BGA) ED -7304-1 Measuring method for package dimensions of Small Outline Package (SOP) ED -7304-2 Measuring method for package dimensions of Small Outline J-leaded package (SOJ) ED -7305 Unit design guide for the preparation of package outline drawing of integrated circuits (gullwing-lead) ED -7311 Standards of integrated circuits package ED -7311-1 Standard of integrated circuits package [TSOP(1)] ED -7311-2 Standard of integrated circuits package [TSOP(2)] ED -7311-3 Standard of integrated circuits package [Tape Ball Grid Array 1.0mm pitch (T-BGA)] ED -7311-4 Standard of integrated circuits package [Tape Ball Grid Array 1.27mm pitch (T-BGA)] ED -7311-5 Standard of integrated circuits package [32/48 pins Fine-pitch Ball Grid Array (FBGA)] ED -7311-6 Standard of integrated circuits package [60/90 pins Fine-pitch Ball Grid Array (FBGA)] ED -7311-7 Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array (P-FBGA)] ED -7311-8 Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array 0.8mm pitch (P- FBGA)] ED -7311-9A Standard of integrated circuits package [P-BGA (Cavity up type)] ED -7311-10A Standard of integrated circuits package [P-BGA (Cavity down type)] ED -7311-11A Standard of integrated circuits package (119/153 pins P-BGA) ED -7311-12 Standard of integrated circuits package (52 pins 64 pins 80 pins and 100 pins low-profile quad flat package with exposed heatsink) ED -7400 Standards for the dimensions of semiconductor devices (integrated circuits) ED -7400-1 Standards for the