File information: | |
File name: | GIGABYTE 8SR533P - REV 3.0.pdf [preview GIGABYTE 8SR533P - REV 3.0] |
Size: | 743 kB |
Extension: | |
Mfg: | Gigabyte |
Model: | GIGABYTE 8SR533P - REV 3.0 🔎 |
Original: | GIGABYTE 8SR533P - REV 3.0 🔎 |
Descr: | Gigabyte GIGABYTE GIGABYTE 8SR533P - REV 3.0.pdf |
Group: | Electronics > Other |
Uploaded: | 27-01-2020 |
User: | Anonymous |
Multipart: | No multipart |
Information about the files in archive: | ||
Decompress result: | OK | |
Extracted files: | 1 | |
File name GIGABYTE 8SR533P - REV 3.0.pdf 5 4 3 2 1 8SR533P Schematics Revision 3.0 SHEET TITLE D D 1 COVER SHEET 2 BOM & PCB MODIFY HISTORY 3 BLOCK DIAGRAM 4,5,6 INTEL CPU_WMT_478 7-10 SIS645 (NORTH BRIDGE) HOST; DDR; AGP,HYPER ZIP 11-14 SIS961 (SOUTH BIRDGE) 15 CLOCK GENERATOR (ICS952001) C C 16,17 DDR SDRAM DIMMS 1,2,3 18 AGP SLOT 19,20 PCI SLOT 1,2,3,4,5,6 21 IDE,FRONT USB,PCIRST# 22 LPCIO_IT8705 23 BIOS 24 COM,PRT,FDD,KB/MS,IR B B 25 AUDIO (CT5880)/AC 97 26 AUDIO JACK,GAME PORT 27 FAN, SMB PORT 28 PANEL,STR LED,FANS ,CPU GN 29 VCORE PHASE PWM HIP 6302 + 6602 30 DDR POWER,3VDUAL,VDDQ DC POWER PCB Size: 294*200 mm COMPONENT SIDE (1 oz. Copper) 31 ATX CONN, GPIO LIST VCC LAYER (1 oz. Copper) A GND LAYER A (1 oz. Copper) 32 RTL8100BL SOLDER SIDE (1 oz. Copper) GIGABYTE Title COVER SHEET |
Date | User | Rating | Comment |