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Various electronics service manuals| File information: | |
| File name: | ch_05.pdf [preview ch 05] |
| Size: | 100 kB |
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| Mfg: | Intel |
| Model: | ch 05 🔎 |
| Original: | ch 05 🔎 |
| Descr: | Intel Legacy Package_databook_1999 ch_05.pdf |
| Group: | Electronics > Other |
| Uploaded: | 28-01-2020 |
| User: | Anonymous |
| Multipart: | No multipart |
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| Decompress result: | OK | |
| Extracted files: | 1 | |
File name ch_05.pdf Physical Constants of IC Package Materials 5 Table 5-1 through Table 5-9 list typical values for selected properties of materials used in IC packages. Table 5-1. Case Material Characteristics Alumina Molding Sealing Cu-W Cu Properties Units (92%) Kovar Compound Glass (90%) Density kg/m3 3600- 8400 1790-1850 4700 17000 8900 (g/cc) 3700 (8.4) (1.79-1.85) (4.7) (17) (8.9) (3.6-3.7) Modulus of Elasticity GPa 55 138 E1 = 11.7 5.7 255 125 E2 = 0.1 Tensile Strength MPa 157 627 19.98 270 Thermal Conductivity W/mK 18 17.5 0.58 -0.67 0.6 180 - 200 (20 | ||
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