Intel ch 09 free download

File name ch_09.pdf

9 SMT Board Assembly Process Recommendations 9 SMT Board Assembly Process Recommendations ...9-1 9.1 Introduction...9-2 9.2 Solder Paste Printing...9-2 9.3 Component Placement ...9-2 9.4 Reflow Soldering ...9-3 9.4.1 Pb-free vs SnPb Reflow Soldering ...9-3 9.4.2 Reflow Profile Development Considerations ...9-3 9.4.2.1 Reflow Profile Board Preparation ...9-4 9.4.2.2 Minimum Solder Joint Peak Temperature...9-5 9.4.2.3 Maximum Solder Joint Peak Temperature ...9-5 9.4.2.4 Time Above (Initial) Melting Point...9-5 9.4.2.5 Rising and Falling Ramp Rate...9-6 9.4.2.6 Reflow Equipment ...9-6 9.4.2.7 Reflow Atmosphere ...9-6 9.4.2.8 Board Warpage ...9-7 9.4.2.9 Double Sided SMT Board Assembly ...9-7 9.4.3 Sample Reflow Parameters...9-7 9.4.4 Sample Reflow Profiles ...9-8 9.4.4.1 Sample Desktop Reflow Profile ...9-9 9.4.4.2 Sample Mobile Reflow Profile ...9-9 9.4.4.3 Sample Server Reflow Profile ...9-10 9.5 Rework...