AMD 32531 gx bgu vs bgd free download

File name 32531_gx_bgu_vs_bgd.pdf

AMD GeodeTM GX Processors BGU and BGD Package Differences 1.0 Scope Table 2-1. Display Mode Bits Description The purpose of this document is to summarize the differ- ences between the BGU (Ball Grid Array Cavity Up) and Bit Name Description BGD (Ball Grid Array Cavity Down) packages of the AMD GeodeTM GX processors (i.e., Geode GX [email protected] pro- 7:6 DM (RO) Display Mode (Read Only). cessor*, Geode GX [email protected] processor*, and Geode GX Affects reset value. [email protected] processor*). Hence, providing the system 00: CRT. designer with the necessary information to make the right 01: Flat Panel. choice for their application. Each difference notes if there 10: Reserved. are any hardware or software implications specifically 11: Reserved. related to one choice over the other. Note: For the BGD package, these bits identify which BGD device is in the system (i.e., CRT or 2.0 Discussion TFT). With respect to the BGU The following subsections summarize the functional and package, these bits are set by the mechanical differences between the BGU (plastic) and FP/CRT# signal (ball U24) BGD (metal top) packages. For a complete description of the ball assignments, thermal specifications, part number order information, and mechanical package outlines refer 2.2 Ball Assignment to the AMD GeodeTM GX Processors Data Book (publica- The same die is used in both packages. In the case of the tion #31505). BGD the die is facing down, and for the BGU it is facing up. However, the ball assignments are different. This means that each package requires a unique layout. A common lay- 2.1 Display Options out that can accept either package is not feasible. The BGD package has two functionally different SKUs: CRT version and TFT version. Theref