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Agilent Investigating Microvia Technology for 10 Gbps and Higher Telecommunications Systems White Paper Contents Introduction ...2 Telecom Physical Layer Overview ...3 Signal Integrity and Differential Spacing ...9 Four Port Microvia Measurements...14 Microvia Construction...17 Modeling and Simulation Case Study...22 Summary and Conclusions ...27 Acknowledgements ...28 Introduction Today's telecommunication platforms depend upon high-speed serial data transmission. Leading edge digital designers push the performance limit of what is possible to achieve on copper. The proliferation of serial links beyond 10 Gbps has exposed signal integrity issues not typically encountered in the standard digital design laboratory. Optimization of signal integrity by focusing on the physical layer structures within these high-speed channels can produce astonishing results. The fundamental insight of how signals propagate can be clearly understood with the proper design tools and methodologies. Network switches and routers have recently employed advanced backplane technology to break the terabit barrier. This accomplishment is in part due to sophisticated design techniques within the physical layer components. A major portion of this design cycle is geared toward modeling, simulation, and measurement validation. Reflections, crosstalk, impedance mismatch, and loss can be visualized. These complex phenomenon become intuitive through the use of design tools that allow both time and frequency domain analysis. Real estate constraints of high-speed digital systems necessitate the use of microvia technology to allow more components to be placed on a single circuit board. With more companies using microvia technology, the process has been able to advance rapidly from controlled depth drilling to more advanced laser ablation techniques. Printed circuit board manufactures are tasked with developing processes for microvias that meet the aspect ratio requirements of today's multilayer backplanes. Implementing microvias opens the door for SMT board to backplane connectors and the overall system performance improvements inherent in these connector systems. 2 Telecom System Physical Layer Overview Typical 10 Gbps Telecom System During the late 1990s and early 2000s the focus of network OEMs was the delivery of high-performance technology-leading communication syst