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ADVANCED MICRO DEVICES INC December 6, 2004 One AMD Place P.O. Box 3453 Sunnyvale, CA 94088-3453 Advanced Change Notification No: 2437 Subject: Change in the AU1100 Package Materials AMD is announcing new materials in the package for the AU1100 device. See below for details: Product Identification: AU1100 Device Version: A1100BF Package Types: LBA399 AMD Product Line: Personal Connectivity Solutions Group (PCSG) Description of Change: New package materials have been qualified for the AU1100 device. See attached. Reason for Change: To improve product quality, and enhance manufacturing flexibility. Application Impact: There is no change to the electrical datasheet or electrical functionality/performance specification of these products. The MSL temperature rating is actually improved as a result of this change. Qual Description: As part of the Pb-Free qualification process, a new substrate supplier, die attach and mold compound have been qualified. These materials will now also be used on the AU1100 package, resulting in enhanced SMT performance. ACN No. 2437 04/29/05 Data Availability Date: Attached Samples Available Date: Now Production Shipment Date: December 15, 2004 Products Affected By This Change (AMD part numbers): AU1100-333MBC BF AU1100-400MBC BF AU1100-500MBC BF AU1100-333MBI BF Factory Contact: Dan Miller Contact Phone: (512) 602-4754 Contact Email Address: [email protected] Samples Requests: Please contact your local sales office for samples requests. Even though the above date projections are based on the most current product development status information at the time this ACN was issued, they may change due to unforeseen circumstances. For the latest schedule and any other information, please contact your local AMD sales office or your local distributor. THIS ADVANCED CHANGE NOTICE IS CONFIDENTI

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