Text preview for : X-HM50-K_X-HM50-S_RRV4145.pdf part of Pioneer X-HM50-K X-HM50-S RRV4145 Pioneer Audio X-HM50-K X-HM50-K_X-HM50-S_RRV4145.pdf
Back to : X-HM50-K_X-HM50-S_RRV4145 | Home
ORDER NO.
RRV4145
X-HM50-K
CD Receiver System
X-HM50-K
X-HM50-S
THIS MANUAL IS APPLICABLE TO THE FOLLOWING MODEL(S) AND TYPE(S).
Model Type Power Requirement Remarks
X-HM50-K SYXJ5 AC 220 V to 230 V
X-HM50-S SYXJ5 AC 220 V to 230 V
For details, refer to "Important Check Points for good servicing".
PIONEER CORPORATION 1-1, Shin-ogura, Saiwai-ku, Kawasaki-shi, Kanagawa 212-0031, Japan
PIONEER ELECTRONICS (USA) INC. P.O. Box 1760, Long Beach, CA 90801-1760, U.S.A.
PIONEER EUROPE NV Haven 1087, Keetberglaan 1, 9120 Melsele, Belgium
PIONEER ELECTRONICS ASIACENTRE PTE. LTD. 253 Alexandra Road, #04-01, Singapore 159936
PIONEER CORPORATION 2010
K-IZV OCT. 2010 Printed in Japan
1 2 3 4
SAFETY INFORMATION
A
This service manual is intended for qualified service technicians ; it is not meant for the casual do-it-
yourselfer. Qualified technicians have the necessary test equipment and tools, and have been trained
to properly and safely repair complex products such as those covered by this manual.
Improperly performed repairs can adversely affect the safety and reliability of the product and may
void the warranty. If you are not qualified to perform the repair of this product properly and safely, you
should not risk trying to do so and refer the repair to a qualified service technician.
WARNING
B This product may contain a chemical known to the State of California to cause cancer, or birth defects or other reproductive
harm.
Health & Safety Code Section 25249.6 - Proposition 65
CAUTION
This product is a class 1 laser product classified
under the Safety of laser products, IEC 60825-1:2007.
C CLASS 1 LASER PRODUCT
WARNING !
The laser component is capable of emitting radiation exceeding the limit for CLASS 1.
D58-5-2-2a_A1_En Aspecially instructed person should do servicing operation of the apparatus.
IMPORTANT
Laser Pickup specifications and Laser characteristics
THIS PIONEER APPARATUS CONTAINS
LASER OF CLASS 1. For CD Wave length (typ) : 790 nm
SERVICING OPERATION OF THE APPARATUS Operation output : 4 mW CW, Class 1
S H O U L D B E D O N E B Y A S P E C I A L LY Maximum output : Class 1 (Under fault condition)
INSTRUCTED PERSON.
D
LABEL CHECK
E
F
2 X-HM50-K
1 2 3 4
5 6 7 8
A
[Important Check Points for Good Servicing]
In this manual, procedures that must be performed during repairs are marked with the below symbol.
Please be sure to confirm and follow these procedures.
1. Product safety
Please conform to product regulations (such as safety and radiation regulations), and maintain a safe servicing environment by
following the safety instructions described in this manual.
1 Use specified parts for repair.
Use genuine parts. Be sure to use important parts for safety.
2 Do not perform modifications without proper instructions.
B
Please follow the specified safety methods when modification(addition/change of parts) is required due to interferences such as
radio/TV interference and foreign noise.
3 Make sure the soldering of repaired locations is properly performed.
When you solder while repairing, please be sure that there are no cold solder and other debris.
Soldering should be finished with the proper quantity. (Refer to the example)
4 Make sure the screws are tightly fastened.
Please be sure that all screws are fastened, and that there are no loose screws.
5 Make sure each connectors are correctly inserted.
Please be sure that all connectors are inserted, and that there are no imperfect insertion.
C
6 Make sure the wiring cables are set to their original state.
Please replace the wiring and cables to the original state after repairs.
In addition, be sure that there are no pinched wires, etc.
7 Make sure screws and soldering scraps do not remain inside the product.
Please check that neither solder debris nor screws remain inside the product.
8 There should be no semi-broken wires, scratches, melting, etc. on the coating of the power cord.
Damaged power cords may lead to fire accidents, so please be sure that there are no damages.
If you find a damaged power cord, please exchange it with a suitable one.
9 There should be no spark traces or similar marks on the power plug.
D
When spark traces or similar marks are found on the power supply plug, please check the connection and advise on secure
connections and suitable usage. Please exchange the power cord if necessary.
a Safe environment should be secured during servicing.
When you perform repairs, please pay attention to static electricity, furniture, household articles, etc. in order to prevent injuries.
Please pay attention to your surroundings and repair safely.
2. Adjustments
To keep the original performance of the products, optimum adjustments and confirmation of characteristics within specification.
Adjustments should be performed in accordance with the procedures/instructions described in this manual.
3. Lubricants, Glues, and Replacement parts E
Use grease and adhesives that are equal to the specified substance.
Make sure the proper amount is applied.
4. Cleaning
For parts that require cleaning, such as optical pickups, tape deck heads, lenses and mirrors used in projection monitors, proper
cleaning should be performed to restore their performances.
5. Shipping mode and Shipping screws
To protect products from damages or failures during transit, the shipping mode should be set or the shipping screws should be F
installed before shipment. Please be sure to follow this method especially if it is specified in this manual.
X-HM50-K 3
5 6 7 8
1 2 3 4
CONTENTS
SAFETY INFORMATION ..........................................................................................................................................................2
1. SERVICE PRECAUTIONS ....................................................................................................................................................5
A 1.1 NOTES ON SOLDERING ...............................................................................................................................................5
2. SPECIFICATIONS .................................................................................................................................................................6
2.1 SPECIFICATIONS...........................................................................................................................................................6
2.2 PANEL FACILITIES .........................................................................................................................................................7
3. BASIC ITEMS FOR SERVICE...............................................................................................................................................8
3.1 JIGS LIST........................................................................................................................................................................8
3.2 PCB LOCATIONS ...........................................................................................................................................................9
4. BLOCK DIAGRAM...............................................................................................................................................................10
4.1 OVERALL BLOCK DIAGRAM .......................................................................................................................................10
4.2 MICOM BLOCK DIAGRAM ...........................................................................................................................................11
4.3 POWER SUPPLY BLOCK DIAGRAM ...........................................................................................................................12
5. DIAGNOSIS.........................................................................................................................................................................13
B 5.1 TROUBLESHOOTING ..................................................................................................................................................13
5.2 PROTECTION CIRCUIT DESCRIPTION......................................................................................................................17
6. TEST MODE........................................................................................................................................................................20
7. DISASSEMBLY....................................................................................................................................................................21
8. EACH SETTING AND ADJUSTMENT ................................................................................................................................28
8.1 UPDATING OF THE MICOM SOFTWARE ...................................................................................................................28
8.2 UPDATING OF THE USB FIRMWARE .........................................................................................................................29
9. EXPLODED VIEWS AND PARTS LIST ...............................................................................................................................30
9.1 PACKING SECTION......................................................................................................................................................30
9.2 EXTERIOR SECTION...................................................................................................................................................32
9.3 SPEAKER SECTION ....................................................................................................................................................36
10. SCHEMATIC DIAGRAM ....................................................................................................................................................38
C
10.1 REAR IO, FRONTIN and USB ASSYS .......................................................................................................................38
10.2 AMP ASSY..................................................................................................................................................................40
10.3 MICOM ASSY .............................................................................................................................................................42
10.4 SERVO ASSY .............................................................................................................................................................44
10.5 SERVICE FL, SWITCH and IPOD ASSYS .................................................................................................................46
10.6 REG and POWER ASSYS ..........................................................................................................................................48
10.7 WAVEFORMS .............................................................................................................................................................50
11. PCB CONNECTION DIAGRAM ........................................................................................................................................52
11.1 REAR IO, FRONTIN and USB ASSYS .......................................................................................................................52
11.2 AMP ASSY..................................................................................................................................................................54
11.3 MICOM ASSY .............................................................................................................................................................56
D
11.4 SERVO ASSY .............................................................................................................................................................58
11.5 SERVICE FL and SWITCH ASSYS ............................................................................................................................60
11.6 IPOD ASSY.................................................................................................................................................................62
11.7 REG ASSY..................................................................................................................................................................63
11.8 POWER ASSY ............................................................................................................................................................64
12. PCB PARTS LIST ..............................................................................................................................................................65
E
F
4 X-HM50-K
1 2 3 4
5 6 7 8
1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING