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ORDER NO.
RRV4401
XDJ-R1
DJ SYSTEM
XDJ-R1
THIS MANUAL IS APPLICABLE TO THE FOLLOWING MODEL(S) AND TYPE(S).
Model Type Power Requirement Remarks
XDJ-R1 SVWYXE8 AC 220 V to 240 V
XDJ-R1 CUXE AC 120 V
XDJ-R1 FLWPWXE AC 110 V to 120 V or 220 V to 240 V
XDJ-R1 KXE5 AC 220 V
XDJ-R1 AXE5 AC 220 V to 240 V
PIONEER CORPORATION 1-1, Shin-ogura, Saiwai-ku, Kawasaki-shi, Kanagawa 212-0031, Japan
PIONEER ELECTRONICS (USA) INC. P.O. Box 1760, Long Beach, CA 90801-1760, U.S.A.
PIONEER EUROPE NV Haven 1087, Keetberglaan 1, 9120 Melsele, Belgium
PIONEER ELECTRONICS ASIACENTRE PTE. LTD. 253 Alexandra Road, #04-01, Singapore 159936
PIONEER CORPORATION 2013
K-MZV JUNE 2013 Printed in Japan
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SAFETY INFORMATION
A
This service manual is intended for qualified service technicians; it is not meant for the casual do-it-
yourselfer. Qualified technicians have the necessary test equipment and tools, and have been trained
to properly and safely repair complex products such as those covered by this manual.
Improperly performed repairs can adversely affect the safety and reliability of the product and may
void the warranty. If you are not qualified to perform the repair of this product properly and safely, you
should not risk trying to do so and refer the repair to a qualified service technician.
WARNING
B This product may contain a chemical known to the State of California to cause cancer, or birth defects or other reproductive
harm.
Health & Safety Code Section 25249.6 - Proposition 65
WARNING !
THE AEL (ACCESSIBLE EMISSION LEVEL) OF THE LASER POWER OUTPUT IS LESS THAN CLASS 1
BUT THE LASER COMPONENT IS CAPABLE OF EMITTING RADIATION EXCEEDING THE LIMIT FOR
CLASS 1.
A SPECIALLY INSTRUCTED PERSON SHOULD DO SERVICING OPERATION OF THE APPARATUS.
C LASER DIODE CHARACTERISTICS
For CD Wave length : 775 - 800 nm
Output Power : Less than Class 1
LABEL CHECK
for SVWYXE8 for CUXE for FLWPWXE
D
for KXE5 for AXE5
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2 XDJ-R1
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CONTENTS
SAFETY INFORMATION.......................................................................................................................................................... 2
1. SERVICE PRECAUTIONS .................................................................................................................................................... 4
1.1 NOTES ON SOLDERING ............................................................................................................................................... 4 A
2. SPECIFICATIONS................................................................................................................................................................. 5
3. BASIC ITEMS FOR SERVICE .............................................................................................................................................. 6
3.1 CHECK POINTS AFTER SERVICING ........................................................................................................................... 6
3.2 JIGS LIST ....................................................................................................................................................................... 6
3.3 PCB LOCATIONS ........................................................................................................................................................... 7
4. BLOCK DIAGRAM ................................................................................................................................................................ 8
4.1 OVERALL WIRING DIAGRAM ....................................................................................................................................... 8
4.2 OVERALL BLOCK DIAGRAM....................................................................................................................................... 10
4.3 SYSTEM BLOCK DIAGRAM ........................................................................................................................................ 12
4.4 LEVEL BLOCK DIAGRAM............................................................................................................................................ 14
5. DIAGNOSIS ........................................................................................................................................................................ 16
5.1 TROUBLESHOOTING.................................................................................................................................................. 16 B
5.2 CONFIMATION OF WIRELESS LAN COMMUNICATION............................................................................................ 19
5.3 ERROR CODE LIST ..................................................................................................................................................... 20
6. SERVICE MODE ................................................................................................................................................................. 21
6.1 SERVICE MODE .......................................................................................................................................................... 21
7. DISASSEMBLY ................................................................................................................................................................... 28
8. EACH SETTING AND ADJUSTMENT ................................................................................................................................ 39
8.1 NECESSARY ITEMS TO BE NOTED........................................................................................................................... 39
8.2 UPDATING OF THE FIRMWARE ................................................................................................................................. 40
8.3 USER SETABLE ITEMS ............................................................................................................................................... 41
9. EXPLODED VIEWS AND PARTS LIST............................................................................................................................... 42
9.1 PACKING SECTION ..................................................................................................................................................... 42
C
9.2 EXTERIOR SECTION .................................................................................................................................................. 44
10. SCHEMATIC DIAGRAM .................................................................................................................................................... 48
10.1 I/O ASSY .................................................................................................................................................................... 48
10.2 MIXER, CH, CROSS FADER, USB and PHONES ASSEMBLIES ............................................................................. 50
10.3 DSP & POWER ASSY (1/2) and Wi-Fi PCB ASSY .................................................................................................... 52
10.4 DSP & POWER ASSY (2/2)........................................................................................................................................ 54
10.5 CD1 and CD2 ASSEMBLIES...................................................................................................................................... 56
10.6 SERVO ASSY ............................................................................................................................................................. 58
10.7 SWITCHING POWER................................................................................................................................................. 60
10.8 WAVEFORMS............................................................................................................................................................. 62
11. PCB CONNECTION DIAGRAM ........................................................................................................................................ 64
11.1 I/O ASSY .................................................................................................................................................................... 64 D
11.2 MIXER ASSY.............................................................................................................................................................. 66
11.3 DSP & POWER ASSY ................................................................................................................................................ 68
11.4 CH, CROSS FADER, USB and PHONES ASSEMBLIES........................................................................................... 70
11.5 Wi-Fi PCB ASSY ........................................................................................................................................................ 71
11.6 CD1 and CD2 ASSEMBLIES...................................................................................................................................... 72
11.7 SERVO ASSY ............................................................................................................................................................. 74
11.8 SWITCHING POWER................................................................................................................................................. 75
12. PCB PARTS LIST .............................................................................................................................................................. 76
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XDJ-R1 3
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1. SERVICE PRECAUTIONS
1.1 NOTES ON SOLDERING
A