pioneer_sph-da100_sm.pdf part of Pioneer pioneer sph-da100 sm pioneer_sph-da100_sm.pdf, Pioneer Car Audio SPH-DA100 pioneer_sph-da100

Text preview for : pioneer_sph-da100_sm.pdf part of Pioneer pioneer sph-da100 sm Pioneer Car Audio SPH-DA100 pioneer_sph-da100_sm.pdf

Back to : pioneer_sph-da100_sm.pdf | Home

ORDER NO.
CRT4885
SPH-DA100/XUUC

APP RADIO

SPH-DA100 /XUUC

SPH-DA100 /XUEW5

PIONEER CORPORATION 1-1, Shin-ogura, Saiwai-ku, Kawasaki-shi, Kanagawa 212-0031, Japan
PIONEER ELECTRONICS (USA) INC. P.O. Box 1760, Long Beach, CA 90801-1760, U.S.A.
PIONEER EUROPE NV Haven 1087, Keetberglaan 1, 9120 Melsele, Belgium
PIONEER ELECTRONICS ASIACENTRE PTE. LTD. 253 Alexandra Road, #04-01, Singapore 159936
PIONEER CORPORATION 2012
K-ZZZ MAR. 2012 Printed in Japan
1 2 3 4

SAFETY INFORMATION

A CAUTION

This service manual is intended for qualified service technicians; it is not meant for the casual do-it-yourselfer.
Qualified technicians have the necessary test equipment and tools, and have been trained to properly and safely repair
complex products such as those covered by this manual.
Improperly performed repairs can adversely affect the safety and reliability of the product and may void the warranty.
If you are not qualified to perform the repair of this product properly and safely, you should not risk trying to do so
and refer the repair to a qualified service technician.

WARNING
B
This product may contain a chemical known to the State of California to cause cancer, or birth defects or other reproductive
harm.
Health & Safety Code Section 25249.6 - Proposition 65

Where in a manufacturer's service documentation, for example in circuit diagrams or lists
of components, a symbol is used to indicate that a specific component shall be replaced only
by the component specified in that documentation for safety reasons, the following symbol shall
be used:

C

D

E

F

SPH-DA100/XUUC
2
1 2 3 4
5 6 7 8

CONTENTS
SAFETY INFORMATION .....................................................................................................................................2
1. SERVICE PRECAUTIONS................................................................................................................................4
1.1 SERVICE PRECAUTIONS .........................................................................................................................4 A
1.2 NOTES ON SOLDERING...........................................................................................................................4
2. SPECIFICATIONS.............................................................................................................................................5
2.1 SPECIFICATIONS ......................................................................................................................................5
2.2 DISC/CONTENT FORMAT.........................................................................................................................7
3. BASIC ITEMS FOR SERVICE ..........................................................................................................................8
3.1 CHECK POINTS AFTER SERVICING .......................................................................................................8
3.2 PCB LOCATIONS.......................................................................................................................................9
3.3 JIGS LIST ...................................................................................................................................................9
4. BLOCK DIAGRAM ..........................................................................................................................................10
4.1 BLOCK DIAGRAM....................................................................................................................................10
4.2 POWER SUPPLY SYSTEM FIGURE.......................................................................................................16
5. DIAGNOSIS ....................................................................................................................................................22 B
5.1 OPERATIONAL FLOWCHART.................................................................................................................22
5.2 ERROR CODE LIST.................................................................................................................................23
5.3 CONNECTOR FUNCTION DESCRIPTION .............................................................................................24
6. SERVICE MODE.............................................................................................................................................25
6.1 TEST MODE.............................................................................................................................................25
7. DISASSEMBLY ...............................................................................................................................................31
8. EACH SETTING AND ADJUSTMENT............................................................................................................36
8.1 TOUCH PANEL CALIBRATION ADJUSTMENT.......................................................................................36
8.2 FLICKER ADJUSTMENT .........................................................................................................................37
9. EXPLODED VIEWS AND PARTS LIST ..........................................................................................................38
9.1 PACKING..................................................................................................................................................38
C
9.2 EXTERIOR (1) ..........................................................................................................................................42
9.3 EXTERIOR (2) ..........................................................................................................................................44
10. SCHEMATIC DIAGRAM................................................................................................................................46
10.1 MAIN UNIT (POWER/PCB IF)................................................................................................................46
10.2 MAIN UNIT (USB5V&iPod17/B-CAM) ....................................................................................................48
10.3 MAIN UNIT (R2R/iPod IC)) (GUIDE PAGE) ...........................................................................................50
10.4 MAIN UNIT (DDR/FLASH) (GUIDE PAGE) ............................................................................................56
10.5 MAIN UNIT (V-DEC) ...............................................................................................................................62
10.6 MAIN UNIT (HDIM/CPLD) (GUIDE PAGE).............................................................................................64
10.7 AV UNIT (POWER, VEHICLE IF, AMP) (GUIDE PAGE) ........................................................................70
10.8 AV UNIT (SYSTEM uCOM, INTERNAL IF) (GUIDE PAGE)...................................................................76
10.9 AV UNIT (AUDIO) (GUIDE PAGE) .........................................................................................................82 D
10.10 AV UNIT (TUNER) (GUIDE PAGE) ......................................................................................................88
10.11 AV UNIT (BT IF, SENSOR) (GUIDE PAGE)..........................................................................................94
10.12 AV UNIT (SIMUKE/GND CONNECTION) ..........................................................................................100
10.13 MONITOR PCB (GUIDE PAGE) .........................................................................................................102
10.14 KEY PCB ............................................................................................................................................108
11. PCB CONNECTION DIAGRAM .................................................................................................................. 110
11.1 MAIN UNIT............................................................................................................................................ 110
11.2 AV UNIT ................................................................................................................................................ 114
11.3 MONITOR PCB..................................................................................................................................... 118
11.4 KEY PCB ..............................................................................................................................................122
12. ELECTRICAL PARTS LIST.........................................................................................................................123
E

F

SPH-DA100/XUUC
5 6 7 8
3
1 2 3 4

1. SERVICE PRECAUTIONS
1.1 SERVICE PRECAUTIONS
A

1. You should conform to the regulations governing the product (safety, radio and noise, and other regulations), and
should keep the safety during servicing by following the safety instructions described in this manual.
2. Be careful in handling ICs. Some ICs such as MOS type are so fragile that they can be damaged by electrostatic
induction.
3. Before disassembling the unit, be sure to turn off the power. Unplugging and plugging the connectors during power-on
mode may damage the ICs inside the unit.
4. During disassembly, be sure to turn the power off since an internal IC might be destroyed when a connector is plugged
or unplugged.
5. Please perform Touch Panel Calibration while installed in the product
6. The part listed below is difficult to replace as a discrete component part.
B
When the part listed in the table is defective, replace whole Assy.

IC51 AL2010 Heat pad
MAIN UNIT
IC168 R8A77240D500BG2 BGA
IC401, IC402 H5PS5162GFR-S5C BGA
IC571 MN864773A Heat pad
MONITOR PCB IC816 R1290K103A Heat pad
IC891 OZ527IRN Heat pad

C

D 1.2 NOTES ON SOLDERING
For environmental protection, lead-free solder is used on the printed circuit boards mounted in this unit.
Be sure to use lead-free solder and a soldering iron that can meet specifications for use with lead-free solders for repairs
accompanied by reworking of soldering.

Compared with conventional eutectic solders, lead-free solders have higher melting points, by approximately 40 C.
Therefore, for lead-free soldering, the tip temperature of a soldering iron must be set to around 373 C in general, although
the temperature depends on the heat capacity of the PC board on which reworking is required and the weight of the tip of
the soldering iron.

E
Compared with eutectic solders, lead-free solders have higher bond strengths but slower wetting times and higher melting
temperatures (hard to melt/easy to harden).

The following lead-free solders are available as service parts:
Parts numbers of lead-free solder:
GYP1006 1.0 in dia.
GYP1007 0.6 in dia.
GYP1008 0.3 in dia.

F

SPH-DA100/XUUC
4
1 2 3 4
5 6 7 8

2. SPECIFICATIONS
2.1 SPECIFICATIONS
SPH-DA100/XUUC A

General Subwoofer:
Rated power source ........... 14.4 V DC Frequency ................... 50 Hz/63 Hz/80 Hz/
(allowable voltage range: 100 Hz/125 Hz
10.8 V to 15.1 V DC) Slope ...........................-18 dB/oct
Grounding system ..............Negative type Gain.............................-24/+6 dB
Maximum current consumption Phase ..........................Normal/Reverse
....................................10.0 A Bass boost:
Backup current................... 3.0 mA or less Gain.............................0 dB to +12 dB
Dimensions (W