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BSP16T1G

High Voltage Transistors
PNP Silicon
Features
These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant http://onsemi.com


PNP SILICON
HIGH VOLTAGE TRANSISTOR
MAXIMUM RATINGS
SURFACE MOUNT
Rating Symbol Value Unit
Collector-Emitter Voltage VCEO --300 Vdc
Collector-Base Voltage VCBO --350 Vdc COLLECTOR 2,4
Emitter-Base Voltage VEBO --6.0 Vdc
Collector Current IC --100 mAdc BASE
1
Total Device Dissipation @ TA = 25C PD 1.5 W
(Note 1)
Storage Temperature Range PD --65 to C EMITTER 3
+150

Junction Temperature TJ 150 C
MARKING
THERMAL CHARACTERISTICS
DIAGRAM
Characteristic Symbol Max Unit
Thermal Resistance, RJA 83.3 C/W AYW
TO--223
Junction--to--Ambient BT2G
CASE 318E
Stresses exceeding Maximum Ratings may damage the device. Maximum STYLE 1 G
Ratings are stress ratings only. Functional operation above the Recommended 1
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in x 1.575 in x A = Assembly Location
0.059 in; mounting pad for the collector lead min. 0.93 sq. in. Y = Year
W = Work Week
BT2 =Device Code
G = Pb--Free Package
(Note: Microdot may be in either location)


ORDERING INFORMATION
Device Package Shipping
BSP16T1G TO--223 1000/Tape & Reel
(Pb--Free)

For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.




Semiconductor Components Industries, LLC, 2010 1 Publication Order Number:
September, 2010 - Rev. 7
- BSP16T1/D
BSP16T1G

ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector -- Emitter Breakdown Voltage V(BR)CEO Vdc
(IC = --50 mAdc, IB = 0, L = 25 mH) --300 --
Collector -- Base Breakdown Voltage V(BR)CBO Vdc
(IC = --100 mAdc, IE = 0) --300 --
Collector--Emitter Cutoff Current ICES mAdc
(VCE = --250 Vdc, IB = 0) -- --50

Collector--Base Cutoff Current ICBO mAdc
(VCB = --280 Vdc, IE = 0) -- --1.0

Emitter--Base Cutoff Current IEBO mAdc
(VEB = --6.0 Vdc, IC = 0) -- --20
ON CHARACTERISTICS
DC Current Gain hFE
(VCE = -- 10 Vdc, IC = --50 mAdc) 30 120 --

Collector-Emitter Saturation Voltage VCE(sat) Vdc
(IC = -- 50 mAdc, IB = -- 5.0 mAdc) -- -- 2.0
DYNAMIC CHARACTERISTICS
Current Gain -- Bandwidth Product fT MHz
(VCE = -- 10 Vdc, IC = --10 mAdc, f = 30 MHz) 15 --
Collector--Base Capacitance Cobo pF
(VCB = -- 10 Vdc, IE = 0, f = 1.0 MHz) -- 15




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2
BSP16T1G

PACKAGE DIMENSIONS


SOT-
-223 (TO--261)
CASE 318E--04
ISSUE N


D
b1 NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.

4 MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
HE E A 1.50 1.63 1.75 0.060 0.064 0.068
1 2 3 A1 0.02 0.06 0.10 0.001 0.002 0.004
b 0.60 0.75 0.89 0.024 0.030 0.035
b1 2.90 3.06 3.20 0.115 0.121 0.126
c 0.24 0.29 0.35 0.009 0.012 0.014
b D 6.30 6.50 6.70 0.249 0.256 0.263
E 3.30 3.50 3.70 0.130 0.138 0.145
e1 e 2.20 2.30 2.40 0.087 0.091 0.094
e e1 0.85 0.94 1.05 0.033 0.037 0.041
L 0.20 ------ ------ 0.008 ------ ------
C L1 1.50 1.75 2.00 0.060 0.069 0.078
HE 6.70 7.00 7.30 0.264 0.276 0.287
A 0 -- 10 0 -- 10
0.08 (0003) STYLE 1:
A1 L PIN 1. BASE
L1
2. COLLECTOR
3. EMITTER
4. COLLECTOR

SOLDERING FOOTPRINT*
3.8
0.15

2.0
0.079




6.3
2.3 2.3
0.248
0.091 0.091



2.0
0.079


1.5 SCALE 6:1 inches
mm
0.059

*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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"Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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