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INTEGRATED CIRCUITS
DATA SHEET
TDA9901 Wideband differential digital controlled variable gain amplifier
Product specification Supersedes data of 1998 Apr 15 File under Integrated Circuits, IC02 1999 Oct 08
Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
FEATURES · 130 MHz, -3 dB small signal bandwidth · Digitally controlled gain · TTL/CMOS compatible digital inputs (3.3 or 5 V) · TTL single ended or differential clock input with PECL compatibility · 24 dB gain control range · Five steps of 6 dB plus 6 dB fixed gain · 30 dB gain maximum · High impedance differential inputs · Low impedance differential outputs · High power supply rejection · 125 nV/Hz output voltage noise density at 30 dB gain · Fast gain settling · Dual control modes: transparent or latched. APPLICATIONS · Linear AGC systems · IF amplifier in IF conversion systems (e.g. base stations or satellite receivers) · Instrumentation · Multi-purpose amplifier · Driver for differential ADCs (e.g. TDA8768). QUICK REFERENCE DATA SYMBOL VDDA VDDD IDDA IDDD Gdif B-3dB Ptot PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current differential gain -3 dB small signal bandwidth total power dissipation minimum gain maximum gain Vo(dif)(p-p) = 0.125 V; Tamb = 25 °C CONDITIONS MIN. 4.75 3.0 - - 5.7 29.3 110 - TYP. 5.0 3.3 30 3.0 6.11 30.5 130 160 GENERAL DESCRIPTION
TDA9901
The TDA9901 is a wideband, low noise amplifier with differential inputs and outputs. The TDA9901 incorporates an AGC function with digital control. The TDA9901 is optimized for fast switching between different gain settings, preserving small phase and amplitude error. The TDA9901 presents an excellent combination of low noise and good linearity for a wide input frequency range. The TDA9901 is optimized for processing IF signals in GSM base stations. It is also suited for many other applications as a general purpose digitally controlled variable gain amplifier. The TDA9901 is able to operate from 4.75 to 5.25 V supply for the analog part and from 3.0 to 5.25 V for the digital part.
MAX. 5.25 5.25 36 5.0 6.46 31.5 - 216 V V
UNIT
mA mA dB dB MHz mW
ORDERING INFORMATION TYPE NUMBER TDA9901TS PACKAGE NAME SSOP20 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm VERSION SOT266-1
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
BLOCK DIAGRAM
TDA9901
handbook, full pagewidth
VDDD TE 18 2
GRAY2 19
GRAY1 20
GRAY0 CLK CLKN VSSD 1 3 4 17
DECODER
LATCHES
TDA9901
IN INN 6 7 0, 6, 12, 18 or 24 dB 5 REFERENCE GENERATOR 11 VDDA 8, 9, 10, 13 n.c. 6 dB REFERENCE GENERATOR 12
MGM962
15 14
OUT OUTN
CMVGA
16
CMADC
VSSA
Fig.1 Block diagram.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
PINNING SYMBOL GRAY0 TE CLK CLKN CMVGA IN INN n.c. n.c. n.c. VDDA VSSA n.c. OUTN OUT CMADC VSSD VDDD GRAY2 GRAY1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION digital control signal bit 0 input (LSB) transparent enable input clock input for gain control setting inverting clock input for gain control setting (active low) regulator output common mode VGA input non-inverting analog input inverting analog input (active low) not connected not connected not connected analog supply voltage analog ground not connected inverting analog output (active low) non-inverting analog output
MGM963
TDA9901
handbook, halfpage
GRAY0 1 TE 2 CLK 3 CLKN 4 CMVGA 5
20 GRAY1 19 GRAY2 18 VDDD 17 VSSD 16 CMADC
TDA9901TS
IN 6 INN 7 n.c. 8 n.c. 9 n.c. 10 15 OUT 14 OUTN 13 n.c. 12 VSSA 11 VDDA
regulator output common mode ADC input digital ground digital supply voltage digital control signal bit 2 input (MSB) digital control signal bit 1 input Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION The TDA9901 provides a digitally controlled variable gain function for high-frequency applications. The TDA9901 can be operated in two different modes, depending on the value at pin TE. When TE is at logic 1, the gain can be instantly controlled when the clock signal is HIGH (transparent mode). The gain is fixed during the LOW period of the clock. When TE is at logic 0 the gain of the TDA9901 is changed at the rising edge of the clock signal.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD VDD VI IO Tstg Tamb Tj HANDLING analog supply voltage digital supply voltage supply voltage difference between VDDA and VDDD input voltage level output current storage temperature ambient temperature junction temperature PARAMETER MIN. -0.3 -0.3 -1.0 -0.3 - -55 -40 -
TDA9901
MAX. +7.0 +7.0 +4.0 +7.0 10 +150 +85 150 V V V V
UNIT
mA °C °C °C
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 120 UNIT K/W
CHARACTERISTICS VDDA = V11 to V12 = 4.75 to 5.25 V; VDDD = V18 to V17 = 3.0 to 5.25 V; VSSA and VSSD shorted together; Tamb = -40 to +85 °C; typical values measured at VDDA = 5.0 V; VDDD = 3.3 V and Tamb = 25 °C; unless otherwise specified; note 1. SYMBOL Supplies VDDA VDDD VDD IDDA IDDD B-3dB td(g) analog supply voltage digital supply voltage voltage difference between VDDA and VDDD analog supply current digital supply current -3 dB small signal bandwidth group delay time 4.75 3.0 -0.2 - - Vo(dif)(p-p) = 0.125 V; Tamb = 25 °C up to fi = 20 MHz; minimum gain; Tamb = 25 °C 6 dB gain step; Tamb = 25 °C 110 - 5.0 3.3 - 30 3.0 5.25 5.25 +2.5 36 5.0 - - V V V mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Variable gain amplifier transfer characteristics 130 2.5 MHz ns
td(g)
group delay difference
-
-
300
ps
1999 Oct 08
5
Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
SYMBOL tst PARAMETER settling time CONDITIONS 10 to 90% maximum - output transition; CL(max) = 5 pF on each output; Tamb = 25 °C DC input Tamb = 25 °C all temperatures G(min) minimum gain setting DC input Tamb = 25 °C all temperatures G(max) maximum gain setting DC input Tamb = 25 °C all temperatures G/T |G/VDD| Vi(offset) F gain stability as a function minimum gain of temperature maximum gain gain stability as a function minimum gain of power supply input offset voltage difference noise figure 6 dB gain step Rs = 100 ; fi = 20 MHz minimum gain maximum gain Vn(o)(eq) equivalent output noise voltage spectral density Rs = 100 ; fi = 20 MHz; Tamb = 25 °C G = 6 dB G = 12 dB G = 18 dB G = 24 dB G = 30 dB PSRR(VDDA) power supply ripple rejection of VDDA power supply ripple rejection of VDDD common mode rejection ratio minimum gain 0 to 20 MHz 20 to 100 MHz PSRR(VDDD) minimum gain 0 to 20 MHz 20 to 100 MHz CMRR 0 to 20 MHz 20 to 150 MHz - - - - 67 51 75 45 - - - - - - 57 39 - - - - - - - 75 82 97 91 124 - - - - - - - 29.1 9.9 - - 29.9 29.3 - - - - 30.5 30.5 -1.0 -7.5 15 0.8 30.9 31.5 - - 25 - 5.76 5.7 6.11 6.11 6.40 6.46 5.88 5.6 6.09 6.09 6.28 6.56 MIN. - TYP. 3.6
TDA9901
MAX.
UNIT ns
Gstep
gain step size
dB dB dB dB dB dB mdB/°C mdB/°C mdB/V mV
dB dB
nV/Hz nV/Hz nV/Hz nV/Hz nV/Hz dB dB dB dB dB dB dB
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
SYMBOL Analog inputs Vi(max)(p-p) Vi(cm) Ii Ri Ci Vo(max)(p-p) maximum input voltage (peak-to-peak value) common mode input voltage input current input resistance input capacitance Vi(cm) = 2.7 V minimum gain maximum gain - - 2.0 - 10 - maximum gain minimum gain referenced to VDDA; Tamb = 25 °C 2.0 2.0 1.0 60.4 2.7 55 - - - - - - PARAMETER CONDITIONS MIN. TYP.
TDA9901
MAX.
UNIT
V mV V µA k pF
VDDA - 1.9 - - 5 - -
Analog outputs; note 2 maximum differential output voltage (peak-to-peak value) common mode output voltage common mode output voltage variation with temperature single-ended output slew rate output resistance output capacitance V V
Vo(cm) Vo(cm)/T
VDDA - 2.56 VDDA - 2.42 VDDA - 2.29 V - -1.8 - mV/°C
SRo(se) Ro Co
- - -
275 15 3
- 26 -
V/µs pF
Variable gain amplifier dynamic performance; CL = 5 pF; RL = 680 (see Figs 6, 7, 8, 9 and 10) HD2 2nd harmonic distortion Vo = Vo(max) fi = 0.5 MHz fi = 4.43 MHz fi = 12.5 MHz fi = 21.4 MHz HD3 3rd harmonic distortion Vo = Vo(max); Tamb = 25 °C fi = 0.5 MHz fi = 4.43 MHz fi = 12.5 MHz fi = 21.4 MHz HD3/T 3rd harmonic distortion fi = 21.4 MHz variation with temperature - - - - - -64 -64 -62 -61 80 -60 -59 -58 -57 - dBc dBc dBc dBc mdB/°C - - - - -80 -77 -76 -74 -67 -67 -65 -62 dBc dBc dBc dBc
Reference voltage output ADC: pin CMADC Vref(CMADC) Ro(CMADC) ADC reference output voltage output resistance referenced to VDDA; Tamb = 25 °C Tamb = 25 °C VDDA - 1.64 VDDA - 1.45 VDDA - 1.26 V - - 17 -0.11 26 - mV/°C
Vref(CMADC)/T ADC reference output voltage variation with temperature 1999 Oct 08 7
Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
SYMBOL Io(CMADC)(max) Co(CMADC) Vref(CMVGA) Ro(CMVGA) PARAMETER maximum output current output capacitance CONDITIONS - - referenced to VDDA; Tamb = 25 °C Tamb = 25 °C MIN. 1.0 3 TYP. - -
TDA9901
MAX.
UNIT mA pF
Reference voltage output VGA: pin CMVGA VGA reference output voltage output resistance VDDA - 2.48 VDDA - 2.30 VDDA - 2.17 V - - 9 1.75 20 - mV/°C
Vref(CMVGA)/T VGA reference output voltage variation with temperature Io(CMVGA)(max) Co(CMVGA) maximum output current output capacitance
- -
1.0 3 - - - 4.2 2.6
- - - - - 5.9 3.2
mA pF
Gain switching characteristics (in latched mode); fCLK = 52 MHz; Tamb = 25°C; (see Fig.3) th tsu tW tPD1 tset1 input data hold time input data set-up time input data pulse width propagation delay time gain settling time 10 to 90% full scale if ±6 dB gain change; note 3 2.0 3.8 5.8 - - ns ns ns ns ns
Gain switching characteristics (in transparent mode); fCLK = 52 MHz; Tamb = 25°C; (see Fig.4) tPD2 tset2 propagation delay time gain settling time 10 to 90% full scale if ±6 dB gain change; note 4 - - 6.7 5.4 9.5 6.9 ns ns
Clock timing input: pins CLK and CLKN (see Fig.3) fCLK(max) tCPL tCPH tr tf VIL VIH IIH IIL Ci VIL VIH IIH IIL 1999 Oct 08 maximum clock frequency clock LOW pulse width clock HIGH pulse width rise time fall time 52 4.0 4.0 - - 0 2.0 -10 -10 - note 5 note 5 0 2.0 15 -40 8 - - - 4 4 - - - - - - - - - - - - - - 0.8 VDDD +10 +10 3 MHz ns ns ns ns
Digital inputs: pins TE, GRAY0, GRAY1 and GRAY2 LOW-level input voltage HIGH-level input voltage HIGH-level input current LOW-level input current input capacitance V V µA µA pF
Clock inputs in TTL mode LOW-level input voltage HIGH-level input voltage HIGH-level input current LOW-level input current 0.8 VDDD 80 -10 V V µA µA
Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
SYMBOL Ci VIL VIH IIH IIL Ci Vi(CLK )(p-p) PARAMETER input capacitance CONDITIONS - VDDA = 5.0 V; note 6 3.19 VDDA = 5.0 V; note 6 3.83 15 -40 - DC voltage level = 2.5 V 0.1 MIN. - - - - - - - TYP. 2
TDA9901
MAX.
UNIT pF
Clock inputs in differential mode LOW-level input voltage HIGH-level input voltage HIGH-level input current LOW-level input current input capacitance differential AC input voltage for switching CLK or CLKN (peak-to-peak value) 3.52 4.12 80 -5 2 2.0 V V µA µA pF V
Notes 1. Due to on-chip regulator behaviour a warm-up time of 1 minute (typical) is recommended for optimal performance. 2. The analog output voltages are positive with respect to AGND. 3. In latching mode (TE = 0), the gain settling is latched at the rising edge of the clock input. 4. In transparent mode, the gain settling is directly controlled by the input data pattern. 5. The circuit may be used with a single TTL clock on CLK or CLKN. The non used clock pin has to be decoupled to ground with a 100 nF capacitance. 6. There are four modes of operation for the clock inputs in non TTL mode: a) PECL mode 1: (DC level vary 1 : 1 with VDDA) CLK and CLKN inputs are differential PECL levels. b) PECL mode 2: (DC level vary 1 : 1 with VDDA) CLK input is at PECL level and gain change takes place on the rising edge of the clock input signal when in latched mode. A DC level of 3.65 V has to be applied on CLKN decoupled to VSSD via a 100 nF capacitor. c) PECL mode 3: (DC level vary 1 : 1 with VDDA) CLKN input is at PECL level and gain change takes place on the rising edge of the clock input signal when in latched mode. A DC level of 3.65 V has to be applied on CLK decoupled to VSSD via a 100 nF capacitor. d) AC driving mode 4: when driving the CLK input directly and with any AC signal of minimum 0.1 V (p-p) and with a DC level of 2.5 V, the gain change takes place on the rising edge of the clock signal. When driving the CLKN input with the same signal, gain change takes place on the falling edge of the clock signal. It is recommended to decouple the CLKN or CLK input to VSSD via a 100 nF capacitor. Table 1 Input coding GREY INPUT DATA CODE STATE D2 0 1 2 3 4 Other 0 0 0 0 1 - D1 0 0 1 1 1 - D0 0 1 1 0 0 - minimum minimum + 6 minimum + 12 minimum + 18 minimum + 24 minimum + 24 GAIN (dB)
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
TDA9901
handbook, full pagewidth
tr CLK
tf LOW 50 % HIGH tCPH tCPL LOW gain N gain N + 1 50 % HIGH
GRAY0 GRAY1 GRAY2 tsu OUT and OUTN tset1 tPD1 th 90 % 10 %
Vo(max)
gain N
gain N + 1
0.5Vo(max)
0V
MGM964
Fig.3 Latched mode timing diagram.
handbook, full pagewidth
GRAY0 GRAY1 GRAY2 gain N gain N + 1 50 %
LOW
HIGH
OUT and OUTN tset2 tPD2
gain N
gain N + 1
90 % 10 %
Vo(max)
0.5Vo(max)
0V
MGM965
Fig.4 Transparent mode timing diagram with CLK HIGH.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
TDA9901
handbook, full pagewidth
CMVGA FILTER IN 100
5 6
15
OUT
47 nF 680
Vi C1(1)
42 D0...11 12
TDA9901TS sine wave generator 100 100 nF 680 14 OUTN 47 nF
(2) (3)
TDA8768 (ADC) Vi C2(1) dB
INN 7
43 36 CLK 30 MHz
FCE306
(1) C1 and C2 represent the board line capacitance. They represent about 5 pF with the TDA8768 input capacitance. Special care has to be taken to minimize this load in order to have the best dynamic performance. (2) The HD2 and HD3 of the TDA8768 is lower than that measured on the TDA9901.This measurement method is preferred to conventional methods due to its low contribution to the HD2. (3) The chain measurement shows the harmonic distortion of the TDA9901 as the measurement from TDA8768 is negligible.
Fig.5 Dynamic distortion measurement diagram.
handbook, halfpage
-55 HD (dBc) -60 -65 -70 -75 -80
FCE307
handbook, halfpage
-55 HD (dBc) -60 -65 -70
FCE308
(1)
(1)
-75 -80 -85 10-1
(2)
(2)
-85 10-1
1
10
f (MHz)
102
1
10
f (MHz)
102
(1) HD3 (2) HD2 Typical condition; 2 V (p-p) differential output.
(1) HD3 (2) HD2 Typical condition; 2 V (p-p) differential output.
Fig.6
Harmonic distortion as a function of frequency for minimum gain.
Fig.7
Harmonic distortion as a function of frequency for minimum gain plus 6 dB.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
TDA9901
handbook, halfpage
-55 HD (dBc) -60 -65 -70 -75
FCE309
handbook, halfpage
-55 HD (dBc) -60 -65
FCE310
(1)
(1)
-70 -75
(2)
(2)
-80 -85 10-1
-80 -85 10-1
1
10
f (MHz)
102
1
10
f (MHz)
102
(1) HD3 (2) HD2 Typical condition; 2 V (p-p) differential output.
(1) HD3 (2) HD2 Typical condition; 2 V (p-p) differential output.
Fig.8
Harmonic distortion as a function of frequency for minimum gain plus 12 dB.
Fig.9
Harmonic distortion as a function of frequency for minimum gain plus 18 dB.
handbook, halfpage
-55 HD (dBc) -60 -65 -70 -75 -80
FCE311
(1)
(2)
-85 10-1 (1) HD3 (2) HD2
1
10
f (MHz)
102
Typical condition; 2 V (p-p) differential output.
Fig.10 Harmonic distortion as a function of frequency for minimum gain plus 24 dB.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
APPLICATION INFORMATION
TDA9901
handbook, full pagewidth
GRAY0 TE CLK CLKN(1) 100 nF 47 µF
1 2 3 4 5
20 19 18 17 16
GRAY1 GRAY2 100 nF
3.3 V
100 nF VIN 100 1:1 n.c. n.c. n.c. 100
TDA9901TS
IN 6 15
47 nF
R1(2)
R2(2) OUT
47 µF
100 nF
INN
47 nF 7 8 9 10 14 13 12 100 nF 11 5V
MGM966
OUTN n.c.
(1) Single-ended clock signal can be applied if required. (2) R1 and R2 should be at least 680 .
Fig.11 Application diagram.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
TDA9901
SOT266-1
D
E
A X
c y HE v M A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X w M
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
TDA9901
If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
TDA9901
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
NOTES
TDA9901
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
NOTES
TDA9901
1999 Oct 08
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Philips Semiconductors
Product specification
Wideband differential digital controlled variable gain amplifier
NOTES
TDA9901
1999 Oct 08
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Philips Semiconductors a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
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Printed in The Netherlands
545004/25/02/pp20
Date of release: 1999
Oct 08
Document order number:
9397 750 05272