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HT8970 Voice Echo
Features
· · ·
·
Operating voltage: 4.5V~5.5V ADM algorithm Low noise - Echo mode:-85dB - Surround mode:-90dB Low distortion rate - Echo mode: 1% - Surround mode: 0.2%
· · ·
Built-in 20Kb SRAM Automatic reset function Package type: 16-pin DIP/SOP
Applications
· ·
Television Karaoke systems
· ·
Video disc player Sound equipments
General Description
The HT8970 is an echo/surround effect processor. It is designed for various audio systems including karaoke, television, sound equipments, etc. The chip consists of a built-in pre-amplifier, VCO or Voltage Control OSC, 20Kb SRAM, A/D and D/A converters as well as delay time control logic. Its built-in 20Kb SRAM can generate delay time effect and can control the delay time value through the external VCO resistor. The VCO circuit can reduce external components and make it easy to adjust the delay time.
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Block Diagram
L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T O P 2 _ IN O P 1 _ IN O P 1 _ O U T C C 0 C C 1
4 .7 k W C O M P
4 .7 k W
M O D D E M
L P F 2
L P F 1
1 /2 V C C A U T O R E S E T
D I M O M I C L O C K
D O 0
D O 1
2 0 K B its R A M
V C O
V C C
R E F
A G N D
D G N D
O S C _ O
v c o
Pin Assignment
V C C R E F A G N D D G N D O S C _ O V C O C C 1 C C 0 8 7 6 5 4 3 2 1 1 6 1 5 1 4 1 3 1 2 1 1 1 0 9 L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T O P 2 _ IN O P 1 _ IN O P 1 _ O U T
H T 8 9 7 0 1 6 D IP /S O P
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Pad Assignment
L P F 1 _ O U T L P F 2 _ O U T L P F 1 _ IN L P F 2 _ IN A G N D 1 1 6 V C C 1 4 R E F 1 5 D G N D
1 3
1 2
1 1
1 0
(0 ,0 )
O S C _ O V C O C C 1 4 3
2
5 C C 0
6 7 O P 1 _ O U T
8 O P 2 _ IN
9 O P 2 _ O U T
Chip size: 1790 ´ 2215 (mm)
* The IC substrate should be connected to VSS in the PCB layout artwork.
O P 1 _ IN
2
Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 X -698.00 -669.25 -669.25 -669.25 -405.55 -140.05 123.65 389.15 Y 701.70 -614.45 -762.85 -945.30 -945.30 -945.30 -945.30 -945.30 Pad No. 9 10 11 12 13 14 15 16 X 652.85 720.20 571.80 423.40 275.00 -77.60 -306.55 -560.95
Unit: mm Y -945.30 882.55 882.55 882.55 882.55 877.60 849.95 737.70
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Pad Description
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Pad Name DGND OSC_O VCO CC1 CC0 OP1_OUT OP1_IN OP2_IN OP2_OUT LPF2_IN LPF2_OUT LPF1_OUT LPF1_IN VCC REF AGND I/O I O I ¾ ¾ O I I O I O O I I I I Internal Connection ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ ¾ Digital ground System oscillator output System oscillator input, system frequency adjustable pin Current control 1 Current control 0 OP1 output OP1 input OP2 input OP2 output Low pass filter 2 input Low pass filter 2 output Low pass filter 1 output Low pass filter 1 input Analog and positive power supply Analog reference voltage Analog ground Description
Absolute Maximum Ratings
Supply Voltage.................................-0.3V to 6V Input Voltage.................VSS-0.3V to VDD+0.3V Storage Temperature ................-50°C to 125°C Operating Temperature ..............-20°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
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Electrical Characteristics
Symbol VCC ICC GV VOMAX THD NO PSRR Parameter Operating Voltage Operating Current Voltage Gain Maximum Output Voltage Total Harmonic Distortion Output Noise Voltage Power Supply Rejection Ratio Test Conditions VDD ¾ 5V 5V 5V 5V 5V 5V Conditions ¾ ¾ RL=47kW THD=10% 30kHz L.P.F. DIN Audio DVCC=-20dBV (0.1Vrms) f=100Hz Min. 4.5 ¾ ¾ 0.9 ¾ ¾ ¾ Typ. 5.0 15 -0.9 1.8 0.7 -85 -40 Ta=25°C Max. 5.5 30 2.5 ¾ 1.5 -60 -30 Unit V mA dB Vrms % dBV dB
Functional Description
The HT8970 is an echo/surround effect generator with built-in 20Kb SRAM. It ensures low distortion as well as low noise for processing audio signal delay. The chip provides two playing modes (echo and surround) and the playing function block diagrams are shown as follows.
· Surround mode
V
IN
· Echo mode
V V
IN O U T
L P F 1
A /D
D e la y
D /A
L P F 2
L P F 1
A /D
D e la y
D /A
L P F 2
V
O U T
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ROSC-fOSC-Delay_time-Distortion Cross table ROSC fOSC Td THD 49.8 2M 327.6 1.6 38.3 2.5M 262 1.3 31.9 3M 218.4 1.0 26.77 3.5M 187.2 0.72 23.3 4M 163.8 0.7 20.54 4.5nm 145.6 0.64 18.08 5M 131 0.5 kW MHz ms %
ROSC fOSC Td THD
16.07 5.5M 119.1 0.47
14.29 6M 109.2 0.38
12.98 6.5M 100.8 0.36
11.97 7M 93.6 0.35
11 7.5M 87.36 0.3
9.99 8M 81.89 0.29
9.22 8.5M 77.08 0.28
kW MHz ms %
ROSC fOSC Td THD
8.5 9M 72.79 0.25
7.54 10M 65.52 0.245
6.66 11M 59.56 0.23
6.12 12M 54.59 0.22
5.5 13M 50.39 0.19
4.85 14M 46.79 0.185
4.4 15M 43.68 0.165
kW MHz ms %
ROSC fOSC Td THD
3.98 16M 40.94 0.165
3.64 17M 38.54 0.15
3.26 18M 36.39 0.14
2.92 19M 34.48 0.14
2.69 20M 32.75 0.13
2.48 21M 31.19 0.12
2.28 22M 29.78 0.11
kW MHz ms %
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Application Circuits
Echo mode
0 .6 8 m F M IC 2 4 .7 k W 4 .7 k W 4 7 k W 1 0 0 m F 9 V 4 .7 k W 4 .7 k W 5 6 0 W 2 2 m F 1 k W 1 m F 1 k W 3 8 4 5 5 8 4 4 7 k W 3 9 p F 5 6 0 0 p F 1 5 k W 4 .7 m F 4 .7 m F 1 0 0 k W 1 9 V 4 .7 m F 2 0 k W
5 V 0 .1 m F
1 1 0 0 m F 4 .7 m F 4 5 2 0 k W R 6 3 2
V C C R E F A G N D D G N D O S C _ O V C O
L P F 1 _ IN L P F 1 _ O U T
1 6 1 5
1 0 k W 5 6 0 p F 1 2 k W 1 3 k W
4 .7 k W 1 0 m F 0 .0 3 3 m F 1 5 k W
1 0 m F
O u tp u t
L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T 7 8 0 .1 m F 0 .1 m F
1 4 1 3 1 2
1 5 k W 5 6 0 p F 1 0 k W 1 5 k W 0 .0 4 7 m F 5 6 0 p F
C C 1 C C 0
O P 2 _ IN O P 1 _ IN O P 1 _ O U T 9
1 1 1 0
0 .0 4 7 m F
H T 8 9 7 0
Note: : Analog ground, : Digital ground
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Surround mode
0 .6 8 m F M IC 2 4 .7 k W 4 .7 k W 4 7 k W 1 0 0 m F 9 V 4 .7 k W 4 .7 k W 5 6 0 W 2 2 m F 1 k W 1 m F 1 k W 3 8 4 5 5 8 4 4 7 k W 3 9 p F 5 6 0 0 p F 1 5 k W 4 .7 m F 1 0 0 k W 5 V 0 .1 m F 1 1 0 0 m F 4 .7 m F 4 5 2 0 k W R 6 3 2 V C C R E F A G N D D G N D O S C _ O V C O L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T 7 8 0 .1 m F 0 .1 m F 1 4 1 3 1 2 5 6 0 p F 1 0 k W 1 5 k W 1 1 1 0 9 0 .0 4 7 m F 0 .0 4 7 m F 1 5 k W 5 6 0 p F 1 0 m F 3 k W O u tp u t L P F 1 _ O U T 1 5 1 2 k W L P F 1 _ IN 1 6 1 0 k W 5 6 0 p F 1 9 V 4 .7 m F 2 0 k W
C C 1 C C 0
O P 2 _ IN O P 1 _ IN O P 1 _ O U T
H T 8 9 7 0
Note:
: Analog ground,
: Digital ground
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Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor (Shanghai) Inc. 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor (Hong Kong) Ltd. Block A, 3/F, Tin On Industrial Building, 777-779 Cheung Sha Wan Rd., Kowloon, Hong Kong Tel: 852-2-745-8288 Fax: 852-2-742-8657 Holmate Semiconductor, Inc. 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright Ó 2000 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
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