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Doc. No. DOC-00046130 REV.
HTC Corporation Issued Date 2008/9/1
A05
. Revised Date 2008/12/10
Doc. Title QUARTZ Service Manual Page 1 of 80
QUARTZ
Service Manual
HTC Proprietary
U
Confidential Treatment Requested
Rev. A05
HTC Corporation
Engineering Mobility
HTC CONFIDENTIAL
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HTC Corporation Issued Date 2008/9/1
A05
. Revised Date 2008/12/10
Doc. Title QUARTZ Service Manual Page 2 of 80
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/04/14 Fist Draft PSE Jason.Cl_Lee DVT
A01 2008/10/7 Formal release PSE Jason.Cl_Lee PVT
1. Add tamper evident label.
2. Revise chapter 11.1 LCM and Bezel replacement.
A02 2008/10/29 PSE Jason.Cl_Lee MV
3. Add internal storage content pre-load process.
4. Update chapter 9.1 SPL list for repair
1. Add "write engineer ID" in the diagnostic process.
2. Add "Adjust the backlight to lowest" in the
A03 2008/11/19 power management for idle and sleep PSE Jason.Cl_Lee MP
current measurement.
1. Remove some parts of board level 2.5.
2. Add document no for internal storage pre-load tool.
3. Add the last step of internal storage pre-load
A04 2008/11/26 process to check the internal storage content. PSE Jason.Cl_Lee MP
4. Add chapter 9.3 FRU M/B addition parts location.
5. Add unit water sensitive label location.
6. Update chapter 9.1 SPL for repair.
A05 2008/12/10 1. Add TV out test in the chapter 4.1 Win CE test item PSE Jason.Cl_Lee MP
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Table of Contents
1. INTRODUCTION ......................................................................................................................................................4
1.1 Product overview ...............................................................................................................................................6
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE...........................................................................10
2.1 Tools List..........................................................................................................................................................10
2.2 Disassembling procedure ................................................................................................................................11
2.3 Assembling procedure ......................................................................................................................................17
3. ROM RE-FLASH PROCEDURE ............................................................................................................................23
3.1 Internal storage pre-load .................................................................................................................................23
3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility) ........................................................................................25
3.3 Rom Image upgrade thru SD card ..................................................................................................................29
4. DIAGNOSTIC PROGRAM .....................................................................................................................................31
4.1 List of Diagnostic / WinCE Test Items..............................................................................................................31
5. POWER MEASUREMENT TEST...........................................................................................................................45
5.1 Main board leakage current Test Procedure ...................................................................................................45
5.2 Battery rundown test procedure ......................................................................................................................48
6. COSMETIC INSPECTION CRITERIA....................................................................................................................54
6.1 Classes definition of inspective area ...............................................................................................................54
6.2 Display inspection............................................................................................................................................55
6.3 Main unit inspection.........................................................................................................................................55
7. GENERIC TROUBLESHOOTING..........................................................................................................................56
8. GENERIC LABELING PLAN ..................................................................................................................................61
9. GENERIC SPARE PART LIST AND PHOTOS.......................................................................................................65
9.1 SPL for Repair .................................................................................................................................................65
9.2 Board Level 2.5 Repairs ..................................................................................................................................70
9.3 FRU M/B addition parts location......................................................................................................................73
10. RF ANTENNA SPECIFICATION ..........................................................................................................................74
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11. APPENDIX ...........................................................................................................................................................76
11.1 LCM and LCM bezel replacement ...................................................................................................................76
11.2 2nd camera and daughter board assembly ......................................................................................................80
1. Introduction
This manual provides the technical information to support the service activities of Diamond.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
Chapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter, you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
dissemble the unit to prevent from damaging the unit.
Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
How to use the diagnostic program to perform unit function test
How to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc...)
Chapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc...
Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc...
Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts
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reference list and photos for repairing, including unit and Board level.
Chapter 10: RF Antenna Specification- Reference Spec for RF test.
Appendix: Additional information.
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1.1 Product overview
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2. Device Disassembling and Assembling Procedure
2.1 Tools List
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
5 Micro Memory Card with Diag. test HTC design DCT-00062
program (need be encoded by
HTC)
6 Micro memory card for ROM code HTC design
re-flash ( must be encoded by HTC)
7 Micro memory card for internal
L1
storage pre-load
7 Universal leakage current tester HTC design MLT-00001
8 Battery holder HTC design
9 Unit current consumption test HTC design
fixture
10 Power supply
11 Current Meter
12 Mobile tester
13 TV out cable HTC option parts 73H00274-02M
14 TV
13 Special Made Plastic Stick HTC special tools RTT-00006
L2 14 Hand tools
19 Label printer ( 400 dpi resolution and up )
18 Lead-free Soldering station
L 2.5 19 Air heater
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2.2 Disassembling procedure
Tools needed for Assembling and Disassembling
process.
1. Lens Cleaning Cloth.
2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.
Press the battery cover and push the battery cover
as shown photo.
Use your finger to lift up battery.
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Use Torx bit no 6 to remove five screws.
Use Flat Plastic Stick to separate LCM and
housing.
Disconnect vibrator.
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Use flat plastic stick to disconnect LCM connector.
Use flat plastic stick to disconnect 2nd camera.
Use flat plastic stick to disconnect main camera.
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Use flat plastic stick to remove speaker.
Use flat plastic stick to remove receiver.
Remove one gasket on the LCM.
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Place the LCM module into the oven by 60 and
5 minutes.
Press LCM as shown the photo to separate LCM
and bezel.
Lift up the LCM as shown the photo.
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The disassembly process is finished.
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2.3 Assembling procedure
Tools needed for Assembling and Disassembling
process.
1. Lens Cleaning Cloth.
2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.
Place LCM into bezel as shown the photo.
For LCM and LCM bezel assembly, please
also refer appendix 11.1
Stick one EMI gasket on the LCM as shown the
photo.
EMI gasket P/N: 72H02659-00M
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Place receiver on the LCM bezel. The pins of
receiver should direct LCM side.
Place speaker into housing.
Assemble main camera and then stick one EMI
gasket on it.
EMI gasket P/N: 72H02659-00M
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Place 2nd camera on the main board as shown the
photo especially the red circle must toward the
bottom.
Please replace 2nd camera and daughter
BD in the same time if 2nd camera is
defective.
For 2nd camera and daughter BD
assembly, please refer appendix 11.2
Connect LCM cable and main board.
Place main board on the LCM and then ensure the
main board is locked by the two hooks.
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Remove protector of vibrator tape.
Connect vibrator with main board and then ensure
the cable of vibrator is fixed on the vibrator tape.
Combine housing with LCM bezel.
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Fasten five screws.
Torque: 1.5