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Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 1 of 109
Diamond
Service Manual
HTC Proprietary
U
Confidential Treatment Requested
Rev. A05
HTC Corporation
Engineering Mobility
HTC CONFIDENTIAL
SM-TP001-0704
6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 2 of 109
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/04/14 Fist Draft PSE Steven Liu CVT
1. Modify product overview
A01 2008/5/9 2. Add RF spec PSE Steven Liu MV
3. Add pre-load process
1. Modify the pre-load process in chapter 4
2. Modify ESPL material P/N
A02 2008/5/29 PSE Steven Liu MP
3.Modify the idle current specification in the page no. 71
A03 2008/6/9 Modify the pre-load process from page no. 53~56 PSE Steven Liu MP
1. Modify the specification for G-sensor in the page no. 7
A04 2008/6/14 PSE Steven Liu MP
2. Remove the matrix table in the pre-load process
1. Modify the disassembly process in page no.23, 24
and 30
2. Modify the pre-load process from page no. 53~57
A05 2008/6/21 PSE Steven Liu MP
3. Modify the SPL list in Chapter 9.1
4. Modify main board current leakage test procedure in
the chapter No.5
HTC CONFIDENTIAL
SM-TP001-0704
6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 3 of 109
Table of Contents
1. INTRODUCTION ....................................................................................................................................................................4
1.1 PRODUCT FEATURES ..........................................................................................................................................5
1.2 PRODUCT OVERVIEW ........................................................................................................................................12
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18
2.1 TOOLS LIST......................................................................................................................................................18
2.2 DISASSEMBLING PROCEDURE............................................................................................................................18
2.3 ASSEMBLING PROCEDURE ................................................................................................................................32
3. ROM RE-FLASH PROCEDURE ........................................................................................................................................46
3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY) ................................................................................46
3.2 ROM IMAGE UPGRADE THRU SD CARD ...............................................................................................................49
4. DIAGNOSTIC PROGRAM ..................................................................................................................................................51
4.1 LIST OF DIAGNOSTIC / WINCE TEST ITEMS ........................................................................................................52
5. POWER MEASUREMENT TEST ......................................................................................................................................70
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................70
5.2 BATTERY RUNDOWN TEST PROCEDURE ..............................................................................................................74
6. COSMETIC INSPECTION CRITERIA...............................................................................................................................79
6.1 CLASSES DEFINITION OF INSPECTIVE AREA.........................................................................................................79
6.2 DISPLAY INSPECTION ........................................................................................................................................80
6.3 MAIN UNIT INSPECTION .....................................................................................................................................81
7. GENERIC TROUBLESHOOTING .....................................................................................................................................82
8. GENERIC LABELING PLAN..............................................................................................................................................87
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................96
9.1 SPL FOR REPAIR..............................................................................................................................................96
9.2 BOARD LEVEL 2.5 REPAIRS ............................................................................................................................102
10. RF ANTENNA SPECIFICATION .................................................................................................................................108
HTC CONFIDENTIAL
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6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 4 of 109
1. Introduction
This manual provides the technical information to support the service activities of Diamond.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
Chapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter, you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
dissemble the unit to prevent from damaging the unit.
Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
How to use the diagnostic program to perform unit function test
How to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc...)
Chapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc...
Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc...
Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts
reference list and photos for repairing, including unit and Board level.
Chapter 10: RF Antenna Specification- Reference Spec for RF test.
HTC CONFIDENTIAL
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6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 5 of 109
1.1 Product Features
Platform HS
DPA/UMTS
ra Ult bar type PDA phone form factor
slim 0: 85
824-849 MHz, 869-894 MHz (Band V)
Mi
crosoft Windows Mobile 6.1 professional 900: 880-915 MHz, 925-960 MHz (Band VIII)
19
00:1850-1910MHz, 1930-1990MHz (Band II)
Dimension 21
00:1920-1980MHz, 2110-2170MHz (Band I)
10
2 mm(L) x 51 mm(W) x 11.5 mm(T) GSM/GPRS/EDGE Tri-band
[W/ 900mAH battery] 0: 85
824-849, 869-894MHz
0: 90
880-915, 925-960MHz
Processor/Chipset 18
00: 1710-1785, 1805-1880MHz
Qu
alcomm MSM 7201A, 528 MHz 19
00: 1850-1910, 1930-1990MHz
HS
DPA / UMTS
Memory 3GPP Release 5 compliant
ROM: 256 MB (for programs and users' storage) Up to 3.6/7.2Mbps peak rate
NA
ND: 4 GB HS
UPA [Option, depends on carrier engagement]
RAM: 196 MB DDR RAM (include 64MB memory in Category 5, 2Mbps
baseband) Concurrent: DL up to 3.6Mbs and UL up to 2Mbps
Glo
bal roaming
LCD Module ndAuto ba
switching
2.8" VGA dots resolution Hand
over and cell selection between
64K
-color TFT LCD with LED back light GSM/GPRS/EDGE and UMTS
To
uch Screen DTM
SAIC (circuit switch only)
HSDPA/WCDMA/EDGE/GPRS/GSM Function Equ
alizer (HSDPA channels only)
Internal antenna Audi
o codec: AMR-NB, AMR-WB, EFR, FR, HR
HS
DPA/UMTS (2100/900 MHz for EU, Asia and SMS (MO, MT), concatenated SMS (640
Softbank, 850/1900 for US, Latin America SKU3, characters)
2100/850 for Telstra, Latin America SKU1&SKU2) Sup
port MCC-MNC-UC-ID as stated in 3GPP TS
and GSM/GPRS/EDGE Tri-band 25.401 R99, section 6, for both RIL and radio
(900/1800/1900Mhz for EU, Asia, Softbank, E-Mobile, Ge
neric services:
Telstra, Latin America SKU2 and 850/1800/1900 for Call holding/waiting/forwarding
US, Latin America SKU1&3) Call barring
HTC CONFIDENTIAL
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6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 6 of 109
CLI (Calling Line Identity) static
Di
splay own number condition)
N
etwork selection Warm
start: 60 seconds, typical TTFF (open sky &
Cell broadcast static condition)
Multi-party conference call rt: Cold sta
75 seconds, typical TTFF (open sky &
Sp
ool icon static condition)
Ph
ase 2+ unstructured supplementary service data Update rate: once/1sec (default)
N
etwork Lock GPS Accuracy
CP
HS (partial support) Po
sition: < 15 meters, 95% typical
Velo
city: 0.05 meter/sec steady state
EGPRS Functionality A-GPS (Qualcomm Based solution)
EGPRS class B Sup
port UE-Based & UE-Assisted A-GPS
Multi-slot standard class 10 OMA SUPL v1.0 compliance (v2.0 if available)
PBCCH SUPL-RRLP
Lin
k Adaptation and Incremental Redundancy SUPL-RRC (optional) (TBD)
USIM/SIM WAP push initiated SUPL
1.8/3V of UICC Standard 3GPP A-GPS compliance
USIM Application at least according to 3GPP TS 3GPP TS 44.031 (RRLP 5.12)
31.102 3GPP TS 25.305 (GSM & UMTS)
SIM Application Tool Kit release 96 complete, 98 JS
R 179 (Location API) support
class 3, and 99 partial Perfo
rmance requirement
Ove
r the Air (OTA) programming TTFF
(95% successful rate): < 20 seconds
F
DN 2
D Location Error (95% successful rate): < 100 m
ADN Sen
sitivity requirement
Se
curity Pin 1 & 2 control GPS for one satellite: up to -142dBm
EAP-SIM GPS for remaining satellite: up to -147dBm
Standalone GPS (Qualcomm based solution) 3GPP TS 25.171 compliance (Requirement for
Internal GPS antenna support of Assisted Global Positioning System)
Sen
sitivity : better than -150dBm for outdoor 3GPP 34.171 (Terminal conformance
usage specification,
Sup
port NMEA 0183 version 3.0 or above Assisted Global Positioning System)
Dynami
cally allocate para llel channel GPS receiver 3GPP TS 34.108 (Common test environments for
Acqui
sition time User Equipment conformance testing)
Hot start: 8 seconds, typical TTFF (open sky & Motion G-sensor
HTC CONFIDENTIAL
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Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 7 of 109
Tri-Axis Accelerometer uplex d
Full
Resolution: 1.22 milli-g Audi
o sampling rate
Auto po
rtrait / landscape mode change when Recording (uplink): 8-bits or 16-bits with 8KHz,
device 11KHz, 22KHz, 44KHz
orientation change ck Playba
(downlink): 16-bits with 44KHz
FM Radio AMR-NB/AMRWB/
Tu
ring range: 87.5Mhz ~ 108Mhz AAC/AAC+/eAAC+/WAV/WMA/MP3 codec
Frequ
ency space: 100Khz Audi
o Path Routing
to Au
channel search Blueto
oth
Digital Camera Receiver
Main c
amera: (manufacture option) Speaker
3 me
ga-pixel camera auto focus Head
set
2n
d camera: (manufacture option) Connectivity & Interface
Color CMOS VGA camera Blueto
oth
Keyboard/Button/Switch Compliant with v2.0 with EDR
Po
wer button (Wake up key) Cl
ass 2 transmit power
Short Press: system on/off Sup
ported profiles:
ngLo
Press: power on/off GA
P (generic access profile)
HT
C navigator include SPP (s
erial port profile)
5
-way navigator pad OPP (o
bject push profile)
Home GOEP (generic object exchange profile)
B
ack / Clear Ac
tiveSync-Over-Bluetooth
d /Sen
hands-free HSP (headset profile)
- Lon during the call: handsfree on/off
g press HF
P (handsfree profile)
End A2
DP (Advanced Audio Distribution profile)
Volum
e Up/Down button AVRCP (Audio/Video Remote control Profile)
Reset HI
D (Human interface device profile)
Notification SIM Ac
cess Profile
Notification by sound, vibration, navigator LEDs or ceServi
Discovery Application Profile
status shown on the display BPP (basic printing profile)
Audio FTP (file transfer profile)
Built-in Microphone PAN (personal area networking profile)
Receiver DUN (Dial-up profile)
udLo
speaker for Hands-Free supported PBAP (Phone Book Access Profile)
HTC CONFIDENTIAL
SM-TP001-0704
6/30/2008 2:31:32 PM
Doc. No. DOC-00040624 REV.
HTC Corporation Issued Date 2008/4/14
A05
. Revised Date 2008/6/23
Doc. Title Diamond Service Manual Page 8 of 109
Co-exist with WiFi k time: 1.3 ~ 5.2 hours for UMTS
Tal
Fi Wi
[manufacture option] Vide
o Telephony time: 77~109 minutes
IEEE 802.11b/g compliant byStand 219~329 hours for GSM
time:
Internal WLAN antenna byStand 195 ~ 379 hours for UMTS
time:
Data rate auto fallback for extended range daptora
AC
ELP mode AC in
put: 100 ~ 240V AC, 50/60 Hz
Se
curity 802.11i and AES Th
e device shall be able to detect the AC adapter
WPA2 authentication