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Doc. No. DOC-00043540 REV.
HTC Corporation Issued Date 2008/7/2
A10
. Revised Date 2008/12/01
Doc. Title Raphael Service Manual Page 1 of 98
Raphael
Service Manual
HTC Proprietary
U
Confidential Treatment Requested
Rev. A10
HTC Corp.
Engineering Mobility
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
HTC Corporation Issued Date 2008/7/2
A10
. Revised Date 2008/12/01
Doc. Title Raphael Service Manual Page 2 of 98
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/7/2 Fist Draft PSE Budiman_Cheng DVT
1. Change picture of water sensitive
label location on generic labeling plan
2. Update feature sheet (GSM/EDGE to
quad band frequency, battery life and
add extended battery with battery
A01 2008/7/23 cover in the accessory list as an PSE Budiman_Cheng PVT
optional item)
3. Update sleep and idle current test on
chapter 5.1
4. Add RF antenna spec on chapter 10
5. Add spare part list on chapter 9.1
1. Update assembling procedure and
A02 2008/8/11 pictures on chapter 2.3 PSE Budiman_Cheng PVT
2. Update cosmetic inspection criteria
Update feature sheet: add eMobile SKU
A03 2008/9/1 PSE Budiman_Cheng PVT
with 1700MHz UMTS band
1. Add picture and "Return to HTC"
column on chapter 9.1
2. Update speaker installation notice on
A04 2008/10/15 PSE Budiman_Cheng MV
chapter 2.3
3. Update assembling procedure on
page 27
1. Update repair code on chapter 9.1
A05 2008/10/20 2. Change hot key to enter diagnostic PSE Budiman_Cheng MV
mode on chapter 4.1
Update board level 2.5 repair on chapter
A06 2008/10/31 PSE Budiman_Cheng MV
9.2
Add sleep and idle current test condition
A07 2008/11/10 PSE Budiman_Cheng MV
on chapter 5.1
Add some part numbers on chapter 2.3
A08 2008/11/20 PSE Budiman_Cheng MV
(Assembling procedure)
Add FRU M/B additional parts location on
A09 2008/11/26 PSE Budiman_Cheng MV
chapter 9.3
1. Remove 76H02985-00M from chapter
9.1 SPL for repair (ECR#28037)
2. Change assembling procedure on
A10 2008/12/01 PSE Budiman_Cheng MV
chapter 2.3 (ECR#28037)
3. Add 76H03122-00M into chapter 9.3
(ECR#28037)
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HTC Corporation Issued Date 2008/7/2
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Doc. Title Raphael Service Manual Page 3 of 98
1. INTRODUCTION ....................................................................................................................................................................4
1.1 PRODUCT FEATURES ..........................................................................................................................................5
1.2 PRODUCT OVERVIEW ........................................................................................................................................10
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18
2.1 TOOLS LIST ......................................................................................................................................................18
2.2 DISASSEMBLING PROCEDURE............................................................................................................................19
2.3 ASSEMBLING PROCEDURE ................................................................................................................................27
3. ROM RE-FLASH PROCEDURE ........................................................................................................................................38
3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY) ................................................................................38
3.2 ROM IMAGE UPGRADE THRU SD CARD .............................................................................................................42
4. DIAGNOSTIC PROGRAM ..................................................................................................................................................44
4.1 LIST OF DIAGNOSTIC TEST ITEMS ......................................................................................................................44
5. POWER MEASUREMENT TEST ......................................................................................................................................59
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................59
5.2 BATTERY RUNDOWN TEST PROCEDURE ..............................................................................................................63
6. COSMETIC INSPECTION CRITERIA...............................................................................................................................68
6.1 CLASSES DEFINITION OF INSPECTIVE AREA.........................................................................................................68
6.2 DISPLAY INSPECTION ........................................................................................................................................71
6.3 MAIN UNIT INSPECTION .....................................................................................................................................72
7. GENERIC TROUBLESHOOTING .....................................................................................................................................73
8. GENERIC LABELING PLAN..............................................................................................................................................80
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................82
9.1 SPL FOR REPAIR..............................................................................................................................................82
9.2 BOARD LEVEL 2.5 REPAIRS ..............................................................................................................................90
9.3 FRU M/B ADDITIONAL PARTS LOCATION .............................................................................................................93
10. RF ANTENNA SPECIFICATION .......................................................................................................................93
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1. Introduction
This manual provides the technical information to support the service activities of this product.
This document contains highly confidential information, so any or all of this document should not be revealed to
any third party.
Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
reading this chapter, you will know what feature the product has and basic hardware
operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will
learn how to disassemble and assemble the product. Also, you will know what tools to
use and the torque. Please follow the instruction to disassemble the unit to prevent
from damaging the unit.
Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of
enter the boot loader mode.
Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
How to use the diagnostic program to perform unit function test
How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc...)
Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc...
Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc...
Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
Chapter 10: RF Antenna Specification- Reference Spec for RF test.
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1.1 Product Features
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1.2 Product overview
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. Revised Date 2008/12/01
Doc. Title Raphael Service Manual Page 12 of 98
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Installing the SIM card
Installing the SD card
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To install / remove the battery
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Charging the battery
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To perform a soft reset
1. Remove the back cover.
2. Pull out the stylus.
3. Use the stylus to press the RESET button located between the opening of the stylus compartment and
USB connector on the back of the device. Your device restarts and displays the Today screen.
To perform a hard reset
Warning! Your device will be set back to factory default settings. Please ensure any additional installed
programs and/or user data have been backed up before a hard reset is performed.
1. Pull out the stylus
2. With the device turned on, press and hold the VOLUME DOWN and ENTER buttons, then press the
RESET button with the stylus tip.
3. Release the RESET button, but continue pressing the VOLUME DOWN and ENTER buttons until you
see this message on the screen:
4. Release the VOLUME DOWN and ENTER buttons, then press the VOLUME UP button to perform the
hard reset, or press any other button to cancel the reset.
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2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
Level 2 Memory Card with Diag. test program
5 HTC design DCT-00050
(need be encoded by HTC)
L1 Level 0 Memory Card with Diag. test program
6 HTC design DCZ-00050
(need be encoded by HTC)
7 3pin battery holder HTC special tools MLT-00006
8 Universal Leakage Current Tester HTC special tools MLT-00001
9 Power supply
10 Current Meter
11 Mobile tester
12 Special Made Plastic Stick HTC special tools RTT-00006
13 Hand tools
14 Oven for rework purpose HTC special tools RTT-00007
L2 15 Mylar,Assembly jig, for navi and TW,black, Raphael 76H02974-00M
Mylar,Assembly jig, for navi and A-cover,black,
16 76H02973-00M
Raphael
17 Navi board keycap assembly jig HTC special tools RTT-00016
18 Barcode label printer (400dpi resolution and up)
19 Lead-free Soldering station
L 2.5
20 Hot air gun
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2.2 Disassembling procedure
1. PHILLIPS SCREW-DRIVER 00X50
2. FLAT PLASTIC STICK (P/N:
RTT-00006)
3. CLEANING CLOTH
4. PLASTIC TWEEZERS
5. ESD WRIST STRAP.
6. KEYCAP ASSEMBLY FIXTURE
(P/N: RTT-00016 )
7. OVEN FOR REPAIR / REWORK
PURPOSE (P/N: RTT-00007)
8. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02974-00M)
9. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02973-00M)
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1. TAKE OUT THE STYLUS.
2. REMOVE THE BATTERY COVER
AS SHOWN.
1. TAKE OUT THE BATTERY AS
SHOWN.
2. LOOSEN 4 SCREWS FROM THE
HOUSING.
1. EXTEND THE KEYBOARD BY
SLIDING THE DISPLAY UP.
2. INSERT THE FLAT PLASTIC
STICK BETWEEN THE HOUSING
AND QWERTY KEYBOARD AND
THEN FOLLOW THE ARROW
DIRECTION.
3. DISASSEMBLE THE HOUSING AS
SHOWN.
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1. DISCONNECT THE SPEAKER
CONNECTOR AT THE LOCATION
INDICATED.
2. REMOVE THE SOUND COVER BY
LIFTING IT UP.
1. REMOVE THE SPEAKER BY
LIFTING IT UP.
2. RELEASE THE ANTENNA WIRE
AS SHOWN.
1. LOOSEN THE SCREW AT THE
LOCATION INDICATED.
2. DISCONNECT QWERTY
KEYBOARD CONNECTOR
FROM THE MB.
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1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE MAIN FPC
FROM THE M/B.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE ANTENNA
WIRE AT THE LOCATION
INDICATED.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE I/O BOARD
CONNECTOR.
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1. DISCONNECT THE SIM FPC
CONNECTOR.
2. DISCONNECT THE MAIN
CAMERA CONNECTOR.
3. INSERT THE FLAT PLASTIC
STICK BETWEEN THE SIM FPC
AND SHIELDING COVER AND
THEN FOLLOW THE ARROW
DIRECTION TO SEPARATE THE
SIM FPC.
1. INSERT THE FLAT PLASTIC
STICK AS SHOWN TO SEPARATE
THE MAIN CAMERA AND THE
MAIN BOARD.
2. LOOSEN 6 SCREWS AT THE
LOCATION INDICATED.
1. LOOSEN 5 SCREWS FROM
B-COVER AND B-UPPER
COVER
2. DISASSEMBLE THE B-UPPER
COVER AS SHOWN.
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1. DISASSEMBLE THE B COVER AS
SHOWN
2. TAKE OUT THE VOLUME KEY AS
SHOWN.
1. DISCONNECT THE MAIN FPC
CONNECTOR FROM NAVI KEY
ASSEMBLY.
2. REMOVE THE CONDUCTIVE
FABRIC AT THE LOCATION
INDICATED
1. DISCONNECT THE LCM
CONNECTOR AND LOOSEN
THE TWO SCREWS FROM THE
MAIN FPC.
2. DO NOT DISASSEMBLY THE 2ND
CAMERA, REPLACE BOTH THE
FPC AND 2ND CAMERA AT THE
SAME TIME IF ONE OF THEM
WAS FAILED (FOR MODEL WITH
2ND CAMERA)
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1. TAKE OUT THE POWER
BUTTON.
2. TAKE OUT THE RECIEVER AT
THE LOCATION INDICATED.
1. TAKE OUT THE MICROPHONE
RUBBER AT THE LOCATION
INDICATED.
2. LOOSEN 4 SCREWS FROM THE
NAVI KEY ASSEMBLY AT THE
LOCATION INDICATED.
LOOSEN ANOTHER 2 SCREWS AT
THE LOCATION INDICATED.
NOTE: BELOW STEPS CAN BE DONE
BY AUTHORIZED SERVICE PROVIDER
ONLY AFTER SAFE LAUNCH.
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PUT THE NAVI PRE ASSY INTO AN
OVEN ABOUT 5 MINUTES AT 65
DEGREE CELCIUS.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE KEY CAP AND THE
FPC AS SHOWN.
CONTINUE ABOVE STEP AND
FOLLOW THE ARROWS DIRECTION
TO SEPARATE THE NAVI KEY CAP
AND THE FPC.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE CENTER NAVI KEY
CAP AND THE FPC AS SHOWN TO
SEPARATE THEM
The Disassemble process is done
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2.3 Assembling procedure
1. REMOVE THE CONDUCTIVE FABRIC
ON THE MAIN CAMERA AT THE
LOCATION INDICATED.
2. PASTE A CONDUCTIVE FABRIC
(72H02844-0M) ON THE MAIN
CAMERA AT THE LOCATION
INDICATED.
1. CONNECT THE MAIN CAMERA TO SIM
FPC AND STICK THE CONDUCTIVE
FABRIC ON IT.
1. MAKE SURE THE MYLAR
(76H02625-00M) AND THE
CONDUCTIVE FABRIC
(72H02843-00M, 76H03122-00M)
WAS ATTAHCED AT THE LOCATION
INDICATED.
2. STICK THE SIM FPC TO THE MAIN
BOARD AT THE LOCATION INDICATED
NOTE:
A. DO NOT BEND THE SIM FPC
B. DO NOT TOUCH THE DOUBLE SIDED
TAPE
C. MAKE SURE THE SHIELDING COVER
SURFACE IS CLEAN
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1. CONNECT THE SIM FPC
CONNECTOR TO THE MAIN BOARD.
2. PASTE A LDI (77H00668-00M) AT
THE LOCATION INDICATED.
PASTE A CONDUCTIVE FABRIC
(76H02985-00M) AT THE LOCATION
INDICATED.
PASTE A CONDUCTIVE FABRIC
(72H02845-00M) AT THE LOCATION
INDICATED.
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1. CONNECT THE I/O BOARD
CONNECTOR TO THE M/B
2. STICK A MYLAR (76H02770-00M) AT
THE LOCATION INDICATED
1. CONNECT THE ANTENNA WIRE AT THE
LOCATION INDICATED.
2. FIX THE ANTENNA WIRE WITH A
CONDUCTIVE FABRIC
(72H02703-00M) AT THE LOCATION
INDICATED.
1. INSTALL THE RECEIVER AT THE
LOCATION INDICATED.
2. STICK THE LIGHT SENSOR LENS AT
THE LOCATION INDICATED.
NOTE: MAKE SURE THE SPEAKER'S
CONTACT SPRING IS FACING OUTSIDE
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1. ASSEMBLE THE NAVI KEY AND
TIGHTEN 2 SCREWS AT THE LOCATION
INDICATED (P/N: 72H02450-00M).
TORQUE: 0.5