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Repair Siemens CL50/8008 Mobile Phone
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Information and Communication Mobile
Mobile Phones
Level 2.5
Repair
CL50/8008
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Company Confidential
CL50/8008 07/02
Copyright 2002© Siemens AG
Information and Communication Mobile
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Table of Contents:
i. CL50 Level2.5 Repair Location Code........................................................3
1. Battery connector......................................................................................4
2. SIM connector..........................................................................................7
3. DC Jack................................................................................................10
4. Phone Jack............................................................................................13
5. LCD Cable Connector..............................................................................16
6. Keypad Connector...................................................................................20
7. Speaker Spring.......................................................................................24
8. Vibrator Connector..................................................................................27
9. MIC Connector.......................................................................................30
10. Status LED.............................................................................................33
11. RTC......................................................................................................36
12. Hall IC...................................................................................................39
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i. CL50 Level2.5 Repair Location Code
The front side of M/B (Connect with keys)
LED
J5
RTC J6
J4 U2
The rear side of M/B
GND VBA
J7
J8
J2 J3
MIC1
J1
Code Description
J1 Battery connector J8 Vibrator/Motor connector
J2 SIM connector MIC1 MIC connector
J3 DC Jack LED Status led
J4 Phone Jack RTC RTC
J5 LCD Cable connector U2 Hall IC
J6 Key pad connector
J7 Speaker spring
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1 Battery Connector (J1)
1.1 Affected Units
1.1.1 Type: CL50
1.1.2 Affected IMEIs / Date Codes: All/All
1.1.3 Affected SW-Versions: All
1.1.4 Fault Code for LSO reporting: NA
1.2 Fault Description
1.2.1 Fault Symptoms for customers:
Can't power on under no rmal operation.
Can't charge by this mobile when power off.
1.2.2 Fault Symptom on GSM-Tester:
No response!
1.2.3 Component Information
J1 is a battery connector with 3 battery contacts as power supply portion. During
power on, 3.6 ~ 4.2V is supplied to the handset via VBAT. Battery temperature is
detected via TEMP.
PMS:Power Management System
VBC:Voiceband Codec
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1.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
1.3 Repair Document
1.3.1 Description of procedure
1.3.1.1 Diagnosis
Visually check pins for oxidization or deformity.
Measure pins to test points ( VBAT, GND) with a multimeter to check for
continuity.
1.3.1.2 Repair by component change
1. Use hot air blower to remove defective connector.
Avoid excessive heat! Watch surrounding components!
2. Add solder on related pads.
3. Secure new connector on to the M/B.
4. Reheat the solder on the pads with a fine-tipped soldering iron to allow the
solder to flow on to the connector's pins.
If MIC connector is damaged carelessly, please change MIC connector!
1.3.1.3 Repair by SW-Booting
Not possible!
1.3.1.4 Test
Turn on the handset after repair.
1.3.2 List of needed material
1.3.2.1 Components
J1 battery connector
Part-Number: NA
1.3.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
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1.3.2.3 Special Tools:
Multimeter
1.3.2.4 Working materials
Solder
1.3.3 Drawings
Figure1: CL50 Board Battery Connector Side (Top View)
Figure2: CL50 Board Battery Connector Placement (J1) (Top View)
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2 SIM Connector (J2)
2.1 Affected Units
2.1.1 Type: CL50
2.1.2 Affected IMEIs / Date Codes: All/All
2.1.3 Affected SW-Versions: All
2.1.4 Fault Code for LSO reporting: NA
2.2 Fault Description
2.2.1 Fault Symptoms for customers:
"Insert SIM card" shown under normal operation.
2.2.2 Fault Symptom on GSM-Tester:
No response!
2.2.3 Component Information
The SIM connector is a mechanical part designed to make a connection with SIM
Card (GSM 11.11). The power will be supplied into VCC and VPP. The signal of
RESET, CLOCK and DATA from DBP transmit to RST, CLK, and I/O.
DBP: Digital Baseband Process
VBC: Voiceband Codec
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2.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
2.4 Repair Document
2.4.1 Description of procedure
2.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins. Measure pins with multimeter for continuity.
2.4.1.2 Repair by component change
1. Re-solder the connector if there is cold or insufficient solder.
2. Use hot air blower to remove defective connector if there is oxidization or
deformity and use de-soldering wick to remove excess solder on the pads.
3. Put on new connector and add solder on pins in diagonal sequence.
4. Touch-up the solder if needed.
2.4.1.3 Repair by SW-Booting
Not possible!
2.4.1.4 Test
Insert SIM card and turn on the handset after repair.
2.4.2 List of needed material
2.4.2.1 Components
CL50 SIM connector
Part-Number: NA
2.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
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2.4.2.3 Special Tools:
Multimeter
2.4.2.4 Working materials
Desolder Wick / Braid
Solder
2.4.3 Drawings
Figure1: CL50 Board SIM Connector Side (Top View)
Figure2: CL50 Board SIM Connector Placement (J2) (Top View)
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3 DC Jack (J3)
3.1 Affected Units
3.1.1 Type: CL50
3.1.2 Affected IMEIs / Date Codes: All/All
3.1.3 Affected SW-Versions: All
3.1.4 Fault Code for LSO reporting: NA
3.2 Fault Description
3.2.1 Fault Symptoms for customers:
Can't charge.
No charging icon shown when plugging the charger in.
3.2.2 Fault Symptom on GSM-Tester:
None
3.2.3 Component Information
The DC Jack is 3-contact type connector for charging power input. There will be
about 430mA current flowing into the system in the beginning of charging. The
fuse will be burned as soon as the charging current is lager than 1A. See diagram
below.
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3.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
3.4 Repair Document
3.4.1 Description of procedure
3.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins. Measure pins with multimeter for continuity.
3.4.1.2 Repair by component change
1. Use hot air blower to remove defective connector if there is oxidization or
deformity and use de-soldering wick to remove excess solder on the 2 wide
side-pads.
Avoid excessive heat! Watch surrounding component!
2. Add solder on the three pads in the front.
3. Heat and put on new jack to enhance adhesion.
4. Re-solder 2 wide side-pins before temperature decreasing.
3.4.1.3 Repair by SW-Booting
Not possible!
3.4.1.4 Test
Perform charging after repair.
3.4.2 List of needed material
3.4.2.1 Components
CL50 DC Jack
Part-Number: NA
3.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
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3.4.2.3 Special Tools:
Multimeter
3.4.2.4 Working materials
Solder
3.4.3 Drawings
Figure3.1: CL50 Board DC Jack Side (Top View)
Side-pins
Front-pins
Figure3.2: CL50 Board DC Jack Placement (J3) (Top View)
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4 Phone Jack (J4)
4.1 Affected Units
4.1.1 Type: CL50
4.1.2 Affected IMEIs / Date Codes: All/All
4.1.3 Affected SW-Versions: All
4.1.4 Fault Code for LSO reporting: NA
4.2 Fault Description
4.2.1 Fault Symptoms for customers:
Can't answer and receive via handset.
4.2.2 Fault Symptom on GSM-Tester:
None
4.2.3 Component Information
The Phone Jack is a 6-contact type connector for the earpiece. The voice band
(Speech) and melody signals will come from the VBC and melody IC respectively and
go to the earpiece via PIN -3. The voltage at PIN-5 is 0.2V before the earpiece plugged
in (PIN-3 is shorted with PIN-5 during this time). The DC voltage of PIN-5 will be pulled
high to about 2.8V after the earpiece is plugged in (PIN -3 and PIN-5 are opened during
this time). The voltage change of PIN-5 will be detected by the VBC so that the system
can tell if the earpiece is plugged in or not. Speech signal will be received from the
earpiece and sent into the VBC via PIN-4. See diagram below.
DBP: Digital Baseband Processor
VBC: Voiceband Codec
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4.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
4.4 Repair Document
4.4.1 Description of procedure
4.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
4.4.1.2 Repair by component change
1. Remove RTC battery first with the soldering iron (refer to section 11) (Do
Not use the hot air blower as the RTC battery may explode)
2. Use hot air blower to remove defective connector.
Avoid excessive heat! Watch surrounding component!
3. Use de-soldering wick to remove excess solder on the 6 pads and put on
new jack.
4. Re-solder new jack in diagonal line (1,6,2,5,3,4) afterwards.
5. Replace a new RTC battery (refer to section 12).
4.4.1.3 Repair by SW-Booting
Not possible!
4.4.1.4 Test
Insert earpiece and test after repair.
4.4.2 List of needed material
4.4.2.1 Components
CL50 Phone Jack
Part-Number: NA
4.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
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4.4.2.3 Special Tools:
Multimeter
4.4.2.4 Working materials
Desolder Wick / Braid
Solder
4.4.3 Drawings
Figure 4.1: CL50 Board Phone Jack Side (Top View)
2 4 6
1 3 5
Figure 4.2: CL50 Board Phone Jack Placement (J4) (Top View)
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5 LCD Cable Connector (J5)
5.1 Affected Units
5.1.1 Type: CL50
5.1.2 Affected IMEIs / Date Codes: All/All
5.1.3 Affected SW-Versions: All
5.1.4 Fault Code for LSO reporting: NA
5.2 Fault Description
5.2.1 Fault Symptoms for customers:
No display on screen.
The calling party can't hear the opposite party.
5.2.2 Fault Symptom on GSM-Tester:
None
5.2.3 Component Information
The LCD Cable connector is a 20-pins contact type socket. There are 3 types
of signals transmitted through this connector.
1. LCD signal:
A0, D0~D7, RE/E, WR/R/W, REST, CS1, VDD are used to transmitted the
address signal, data signal, control signal and power signal of LCD.
2. Backlight LED signal:
There is a 4.1V supplied to the anode of backlight LED via Vbat (PIN -4). Lcdlight
(PIN19) is connected to the cathode of backlight LED and the current limiting
resistor, which limits the current passing through the LED.
3. Receiver signal:
The differential signal of speech voice will be transmitted from the VBC to
receiver+(PIN -2) and receiver-(PIN-1). See diagram next page.
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DBP: Digital Baseband Processor
PMS:Power Management System
VBC:Voiceband Codec
5.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
5.4 Repair Document
5.4.1 Description of procedure
5.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
5.4.1.2 Repair by component change
1. Re-solder the connector if there is cold or insufficient solder.
2. Use hot air blower to remove defective connector if there is oxidization or
deformity and use de-soldering wick to remove excess solder on the
pads.
Avoid excessive heat! Watch surrounding component!
3. Heat and put on new connector to enhance adhesion.
4. Touch-up the solder if needed.
IF RTC is damaged carelessly, please change RTC !
5.4.1.3 Repair by SW-Booting
Not possible!
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5.4.1.4 Test
Turn on handset after repair and observe for display on the screen.
5.4.2 List of needed material
5.4.2.1 Components
CL50 LCD Cable Connector
Part-Number: NA
5.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
5.4.2.3 Special Tools:
Multimeter
5.4.2.4 Working materials
Solder
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5.4.3 Drawings
Figure 5.1: CL50 Board LCD Cable Connector Side (Top View)
Figure 5.2: CL50 Board LCD Cable Connector Placement (J5) (Top View)
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6 Keypad Connector (J6)
6.1 Affected Units
6.1.1 Type: CL50
6.1.2 Affected IMEIs / Date Codes: All/All
6.1.3 Affected SW-Versions: All
6.1.4 Fault Code for LSO reporting: NA
6.2 Fault Description
6.2.1 Fault Symptoms for customers:
Can't power on/off.
No response while pressing keys under normal operation.
6.2.2 Fault Symptom on GSM-Tester:
None
6.2.3 Component Information
The keypad connector is a 14-pins contact type socket. There are 2 types of
signals transmitted through this connector.
1. Key signal:
ROW0~ROW3, COL0~COL4, and PWR are used to transmit the ROW signal,
COLUMN signal, and POWER ON signal of key.
2. Keypad backlight signal
There are 12 pieces of LEDs used in the keypad FPC. The power is supplied to
the LEDs via VBAT(PIN-12). The signal coming from DBP to LED(PIN-11) will
control the ON/OFF of the LED.
See diagram next page.
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PMS:Power Management System
DBP: Digital Baseband Processor
6.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
6.4 Repair Document
6.4.1 Description of procedure
6.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
6.4.1.2 Repair by component change
1. Re-solder the connector if there is cold or insufficient solder.
2. Use hot air blower to remove defective connector if there is oxidization or
deformity.
Avoid excessive heat! Watch surrounding component!
3. Heat and put on new connector to enhance adhesion.
4. Touch-up the solder if needed.
6.4.1.3 Repair by SW-Booting
Not possible!
6.4.1.4 Test
Retest handset by `*#369#' after repair as described above
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6.4.2 List of needed material
6.4.2.1 Components
CL50 keypad Connector
Part-Number: NA
6.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
6.4.2.3 Special Tools:
Multimeter
6.4.2.4 Working materials
Solder
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6.4.3 Drawings
Figure 6.1: CL50 Board Keypad Side (Top View)
Figure 6.2: CL50 Board Keypad Placement (J6) (Top View)
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7 Speaker Spring (J7)
7.1 Affected Units
7.1.1 Type: CL50
7.1.2 Affected IMEIs / Date Codes: All/All
7.1.3 Affected SW-Versions: All
7.1.4 Fault Code for LSO reporting: NA
7.2 Fault Description
7.2.1 Fault Symptoms for customers:
No ring tone while setting or during a n incoming call.
7.2.2 Fault Symptom on GSM-Tester:
None
7.2.3 Component Information
The speaker spring connector is used to contact an 8ohm speaker. It
provides two contact traces for the melody signal from the Melody IC. See
diagram below.
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7.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
7.4 Repair Document
7.4.1 Description of procedure
7.4.1.1 Diagnosis
Visually inspect for oxidization or deformity on the springs.
7.4.1.2 Repair by component change
1. Use tweezers to remove black plastic piece.
2. Heat and remove the springs from M/B.
3. Re-solder new springs on to the pads.
7.4.1.3 Repair by SW-Booting
Not possible!
7.4.1.4 Test
Re-test the handset by entering `*#369#' after the repair.
7.4.2 List of needed material
7.4.2.1 Components
CL50 Speaker Spring
Part-Number: NA
7.4.2.2 Jigs and Tools
Soldering Iron
7.4.2.3 Special Tools:
Multimeter
7.4.2.4 Working materials
Solder
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7.4.3 Drawings
Figure 7.1: CL50 Board Speaker Spring Side (Top View)
Figure 7.2: CL50 Board Speaker Spring Placement (J7) (Top View)
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8 Vibrator Connector (J8)
8.1 Affected Units
8.1.1 Type: CL50
8.1.2 Affected IMEIs / Date Codes: All/All
8.1.3 Affected SW-Versions: All
8.1.4 Fault Code for LSO reporting: NA
8.2 Fault Description
8.2.1 Fault Symptoms for customers:
Vibrator is not functioning.
8.2.2 Fault Symptom on GSM-Tester:
None
8.2.3 Component Information
The vibrator connector is a two pins holder. System controls the
on/off of the vibrator via PIN-1. It can be considered as a high
impedance terminal when the vibrator is off. When the vibrator is on,
the impedance of PIN -1 will decrease, and the voltage drop across
PIN-1 and PIN -2 is lager than 2.5V. See diagram below.
DBP: Digital Baseband Processor
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8.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
8.4 Repair Document
8.4.1 Description of procedure
8.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
8.4.1.2 Repair by component change
1. Re-solder this connector if there is cold or insufficient solder.
2. Use hot air blower to remove defective connector if there is oxidization or
deformity.
Avoid excessive heat! Watch surrounding components!
3. Heat and put on new connector to enhance adhesion.
4. Touch-up the solder if needed.
8.4.1.3 Repair by SW-Booting
Not possible!
8.4.1.4 Test
Re-test the handset by entering `*#369#' after repair.
8.4.2 List of needed material
8.4.2.1 Components
CL50 Vibrator Connector
Part-Number: NA
8.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
8.4.2.3 Special Tools:
Multimeter
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8.4.2.4 Working materials
Solder
8.4.3 Drawings
Figure 8.1: CL50 Board Vibrator Connector Side (Top View)
Figure 8.2: CL50 Board Vibrator Connector Placement (J8) (Top View)
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9 MIC Connector (MIC1)
9.1 Affected Units
9.1.1 Type: CL50
9.1.2 Affected IMEIs / Date Codes: All/All
9.1.3 Affected SW-Versions: All
9.1.4 Fault Code for LSO reporting: NA
9.2 Fault Description
9.2.1 Fault Symptoms for customers:
The opposite party can't hear any voice.
9.2.2 Fault Symptom on GSM-Tester:
None
9.2.3 Component Information
The MIC connector is a two pins holder. See drawing below. There will be about
1.2V bias on PIN-2 as the system is power on. The voice trace here is single end
structure. Voice signal will be received by the microphone and goes to the VBC
via PIN-2.
VBC: Voiceband Codec
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9.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
9.4 Repair Document
9.4.1 Description of procedure
9.4.1.1 Diagnosis
Measure pin2 to R22 with multimeter to check for cold or insufficient
soldering.
9.4.1.2 Repair by component change
1. Use hot air blower to remove defective connector.
Avoid excessive heat! Watch surrounding components!
2. Re-solder pad on M/B.
3. Heat and put on new connector to enhance adhesion.
9.4.1.3 Repair by SW-Booting
Not possible!
9.4.1.4 Test
Retest handset after repair as described above
9.4.2 List of needed material
9.4.2.1 Components
CL50 MIC Connector
Part-Number: NA
9.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
9.4.2.3 Special Tools:
Multimeter
9.4.2.4 Working materials
Solder
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9.4.3 Drawings
Figure 10.1: CL50 Board MIC Connector Side (Top View)
R22,
the 3rd register
from out end
1 2
Figure 10.2: CL50 Board MIC Connector Placement (MIC1) (Top View)
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10 Status LED (LED)
10.1 Affected Units
10.1.1 Type: CL50
10.1.2 Affected IMEIs / Date Codes: All/All
10.1.3 Affected SW-Versions: All
10.1.4 Fault Code for LSO reporting: NA
10.2 Fault Description
10.2.1 Fault Symptoms for customers:
The status LED can't emit in normal, searching network and calling conditions.
10.2.2 Fault Symptom on GSM-Tester:
None
10.2.3 Component Information
The status LED is used as an indicator that represents different linking status via
different display colours. PIN-1 connects to a resistor, which fixes the passing
current to a certain value through the LED. The signals, from DBP to PIN-2 and
PIN-3, control the ON/OFF of the two LEDs independently. See diagram below.
DBP: Digital Baseband Processor
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Information and Communication Mobile
Mobile Phones
10.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
10.4 Repair Document
10.4.1 Description of procedure
10.4.1.1 Diagnosis
Short PIN-1 (+) & PIN-2 (-) or PIN-1 (+) & PIN-3 (-) with a multimeter (diode
function) to see if there is a fade light emitting .
10.4.1.2 Repair by component change
1. Remove RTC battery first with the soldering iron (refer to section 11) (Do
Not use the hot air blower as the RTC battery may explode)
2. Use hot air blower to remove defective LED.
Avoid excessive heat! Watch surrounding component!
3. Remove solders and add new solder to enhance adhesion.
4. Solder new LED on to the M/B.
5. Solder new RTC (refer to section 11)
10.4.1.3 Repair by SW-Booting
Not possible!
10.4.1.4 Test
Retest after repair by turning on the handset.
10.4.2 List of needed material
10.4.2.1 Components
CL50 Status LED
Part-Number: NA
10.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
10.4.2.3 Special Tools:
Multimeter
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Company Confidential
CL50/8008 07/02
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10.4.2.4 Working materials
Solder
10.4.3 Drawings
Figure 11.1: CL50 Board Status LED Side (Top View)
1
3
2
Figure 11.2: CL50 Board Status LED Placement (LED) (Top View)
V 1.0 Page 35 of 41 ICM MP CCQ ASP ASC
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CL50/8008 07/02
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11 RTC (RTC Battery)
11.1 Affected Units
11.1.1 Type: CL50
11.1.2 Affected IMEIs / Date Codes: All/All
11.1.3 Affected SW-Versions: All
11.1.4 Fault Code for LSO reporting: NA
11.2 Fault Description
11.2.1 Fault Symptoms for customers:
Time/Clock will reset each time the handset is turned on.
No call records can be saved.
11.2.2 Fault Symptom on GSM-Tester:
None
11.2.3 Component Information
The RTC is a Lithium battery which supplies the power to the system to let the real
time clock continue counting for about 15~20 minutes after the main battery is
taken off.
The RTC battery will always be charged from the PMS when the main battery is
inside the phone. See diagram below.
PMS: Power Management System
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CL50/8008 07/02
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11.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
11.4 Repair Document
11.4.1 Description of procedure
11.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
11.4.1.2 Repair by component change
1. Use soldering iron to heat pads and tweezers to remove RTC from the
M/B. Timing has to be appropriate. Do not over heat the RTC as it may
explode, so do not use the hot air blower.
2. Put on new RTC and press two pins by soldering iron.
3. Re-solder RTC but avoid touching the two pins at the same time.
11.4.1.3 Repair by SW-Booting
Not possible!
11.4.1.4 Test
Retest handset after repair.
11.4.2 List of needed material
11.4.2.1 Components
CL50 RTC battery
Part-Number: NA
11.4.2.2 Jigs and Tools
Soldering Iron
11.4.2.3 Special Tools:
Multimeter
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CL50/8008 07/02
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11.4.2.4 Working materials
Desolder Wick / Braid
Solder
11.4.2.5 Drawings
Figure 12.1: CL50 Board RTC battery Side (Top View)
Æ
?
Figure 12.2: CL50 Board RTC batteryPlacement (RTC) (Top View)
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CL50/8008 07/02
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12 Hall IC (U2)
12.1 Affected Units
12.1.1 Type: CL50
12.1.2 Affected IMEIs / Date Codes: All/All
12.1.3 Affected SW-Versions: All
12.1.4 Fault Code for LSO reporting: NA
12.2 Fault Description
12.2.1 Fault Symptoms for customers:
Can't answer and hand up a call by open/close flip-flop cover.
The backlight won't turn on while open flip-flop cover.
12.2.2 Fault Symptom on GSM-Tester:
None
12.2.3 Component Information
The Hall IC is a magnetic sensor used in flip type cellular phone to detect the
magnetic flux density. When the LCD module is closing, the magnet (near the hall
IC) within the LCD module will cause the output voltage of hall IC to decrease
from high to low. When opening the LCD module (magnet is away from hall IC),
the output voltage will increase from low to high. It can determine the flip current
status and alert the processor. See diagram below.
PMS: Power Management System
DBP: Digital Baseband Process
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12.3 Priority:
c ... ... ...Mandatory
g ... ... ...Repair
c ... ... ...Optional
c ... ... ... Yet Defined
Not
12.4 Repair Document
12.4.1 Description of procedure
12.4.1.1 Diagnosis
Visually inspect for cold or insufficient solder, oxidization or deformity on the
pins.
Measure the pin2 output voltage while a magnet is closing and far with power
supply.
12.4.1.2 Repair by component change
1.Resolder this connector if there is cold or insufficient solder.
2. Use hot air blower to remove defective connector if there is oxidization or
deformity.
Avoid excessive heat! Watch surrounding component!
3.Heat and put on new connector to enhance adhesion.
4.Resolder new connector afterwards.
12.4.1.3 Repair by SW-Booting
Not possible!
12.4.1.4 Test
Retest handset after repair as described above
12.4.2 List of needed material
12.4.2.1 Components
CL50 Hall IC
Part-Number: NA
12.4.2.2 Jigs and Tools
Hot Air Blower
Soldering Iron
V 1.0 Page 40 of 41 ICM MP CCQ ASP ASC
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CL50/8008 07/02
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12.4.2.3 Special Tools:
Multimeter, Magnet
12.4.2.4 Working materials
Solder
12.4.3 Drawings
Figure1: CL50 Board Hall IC Side (Top View)
1
3
2
Figure2: CL50 Board Hall IC Placement (U2) (Top View)
V 1.0 Page 41 of 41 ICM MP CCQ ASP ASC
Company Confidential
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Copyright 2002© Siemens AG