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INTEGRATED CIRCUITS

DATA SHEET

HEF4794B 8-stage shift-and-store register LED driver
Product specification Supersedes data of 1994 Jul 01 File under Integrated Circuits, IC04 1999 Jun 30

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
APPLICATIONS · Automotive · Industrial. GENERAL DESCRIPTION The HEF4794B is an 8-stage serial shift register having a storage latch associated with each stage for strobing data from the serial input to parallel LED driver outputs O0 to O7. Data is shifted on positive-going clock transitions. The data in each shift register stage is ORDERING INFORMATION PACKAGES TYPE NUMBER PINS HEF4794BT HEF4794BP FUNCTIONAL DIAGRAM 16 16 PIN POSITION SO16 DIP16 MATERIAL plastic plastic LOGIC DIAGRAMS

HEF4794B

transferred to the storage register when the strobe (STR) input is HIGH. Data in the storage register appears at the outputs whenever the output enable (EO) signal is HIGH. Two serial outputs (OS and OS') are available for cascading a number of HEF4794B devices. Data is available at OS on positive-going clock edges to allow high-speed operation in cascaded systems in which the clock rise time is fast. The same serial information is available at OS' on the next negative-going clock edge and provides cascading HEF4794B devices when the clock rise time is slow.

CODE SOT109-1 SOT38-1

V DD 16 D 2 CP 3 8-STAGE SHIFT REGISTER

HEF4794B
10 O S' 9 OS D handbook, halfpage

STR

1

8-BIT STORAGE REGISTER

CP O
MBD912

EO

15

OPEN-DRAIN OUTPUTS

8

4

5 O1

6

7

14 O4

13

12

11 O7
MBD909

VSS O 0

O2 O3

O5 O6

Fig.1 Functional diagram.

Fig.2 One D-latch.

1999 Jun 30

2

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver

HEF4794B

handbook, full pagewidth

STAGE 0 D D CP FF 1 CP O D

STAGE 1 to 6 O

STAGE 7 D CP FF 8 D CP latch Q OS ' O OS

D CP

O

D CP

O

latch 1 STR

latch 8

EO

HEF4794B

MBD911

O0

O 1 O2 O 3 O 4 O 5 O 6

O7

Fig.3 Logic diagram.

PINNING SYMBOL STR D CP O0 to O3 VSS OS,OS' O7 O6 O5 O4 EO VDD PIN 1 2 3 4 to 7 8 9 and 10 11 12 13 14 15 16 DESCRIPTION strobe input data input clock input parallel outputs 0 to 3 (open drain) ground serial outputs parallel output 7 (open drain) parallel output 6 (open drain) parallel output 5 (open drain) parallel output 4 (open drain) output enable input supply voltage
CP O0 O1 O2 O3 V SS 3 4 HEF4794B 5 6 7 8
MBD910

handbook, halfpage

STR D

1 2

16 VDD 15 EO

14 O 4 13 O 5 12 O 6 11 O 7 10 O S' 9 OS

Fig.4 Pin configuration.

1999 Jun 30

3

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
FUNCTIONAL DESCRIPTION Table 1 Function table; note 1 INPUTS CP Note 1. H = HIGH state; L = LOW state; X = don't care; = positive-going transition; = negative-going transition; Z = high-impedance OFF state; nc = no change; O6' = the information in the seventh shift register stage. a) At the positive clock edge the information in the 7th register stage is transferred to the 8th register stage and the OS output. DC CHARACTERISTICS VSS = 0 V. Tamb (°C) SYMBOL PARAMETER CONDITIONS MIN. VOL LOW level output voltage VI = VSS or VDD; IO < 20 mA; VDD = 5 V VI = VSS or VDD; IO < 20 mA; VDD = 10 V VI = VSS or VDD; IO < 20 mA; VDD = 15 V IOZH HIGH level output leakage current; 3-state VO = 15 V; VDD = 5 V VO = 15 V; VDD = 10 V VO = 15 V; VDD = 15 V - - -40 MAX. 0.75 0.75 MIN. - - +25 MAX. 0.75 0.75 EO L L H H H H STR X X L H H H D X X X L H H PARALLEL OUTPUTS O0 Z Z nc L H nc On Z Z nc On - 1 On - 1 nc SERIAL OUTPUTS OS O6' nc O6' O6' O6' nc OS' nc O7 nc nc nc O7 FAMILY DATA

HEF4794B

See "Family Specifications" except for: rating for DC current into any open-drain output is 40 mA. IDD LIMITS CATEGORY MSI See "Family Specifications" for ratings.

+85 MIN. - - MAX. 1.5 1.5

UNIT

V V

-

0.75

-

0.75

-

1.5

V

- - -

2 2 2

- - -

2 2 2

- - -

15 15 15

µA µA µA

1999 Jun 30

4

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
AC POWER CHARACTERISTICS VSS = 0 V; Tamb = 25 °C; input transition times 20 ns; unless otherwise specified. SYMBOL P PARAMETER dynamic power dissipation per package CONDITIONS VDD = 5 V VDD = 10 V VDD = 15 V Note 1. Where: RL = ; fi = input frequency (MHz); fo = output frequency (MHz); CL = load capacitance (pF); (foCL) = sum of outputs; VDD = supply voltage (V). AC TIMING CHARACTERISTICS VSS = 0 V; Tamb = 25 °C; CL = 50 pF; input transition times 20 ns; unless otherwise specified. SYMBOL tPHL PARAMETER propagation delay time CP to OS; HIGH-to-LOW VDD (V) 5 10 15 tPLH propagation delay time CP to OS; LOW-to-HIGH 5 10 15 tPHL propagation delay time CP to OS'; HIGH-to-LOW 5 10 15 tPLH propagation delay time CP to OS'; LOW-to-HIGH 5 10 15 tPZL propagation delay time CP to On; OFF-to-LOW 5 10 15 tPLZ propagation delay time CP to On; LOW-to-OFF 5 10 15 MIN. - - - - - - - - - - - - - - - - - - TYP. 160 65 45 130 55 40 120 50 40 130 60 45 240 80 55 170 75 60 MAX. 320 130 90 260 110 80 240 100 80 260 120 90 480 160 110 340 150 120 UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns note 1

HEF4794B

TYPICAL FORMULA FOR P (µW)(1) 1200f i + ( f o C L ) × V DD 5550f i + ( f o C L ) × V DD 15000f i + ( f o C L ) × V DD
2 2 2

TYPICAL EXTRAPOLATION FORMULA 132 ns + (0.55 ns/pF)CL 53 ns + (0.23 ns/pF)CL 37 ns + (0.16 ns/pF)CL 102 ns + (0.55 ns/pF)CL 44 ns + (0.23 ns/pF)CL 32 ns + (0.16 ns/pF)CL 92 ns + (0.55 ns/pF)CL 39 ns + (0.23 ns/pF)CL 32 ns + (0.16 ns/pF)CL 102 ns + (0.55 ns/pF)CL 49 ns + (0.23 ns/pF)CL 37 ns + (0.16 ns/pF)CL note 1

1999 Jun 30

5

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver

HEF4794B

SYMBOL tPZL

PARAMETER

VDD (V)

MIN. - - - - - - - - - - - - - - - - - - 60 30 24 80 60 24 60 20 15 +5 20 20 5 11 14

TYP. 140 70 55 100 40 35 85 40 30 85 40 30 100 55 50 80 40 30 30 15 12 40 30 12 30 10 5 -15 5 5 10 22 28

MAX. 280 140 110 200 100 70 170 80 60 170 80 60 200 110 100 160 80 60 - - - - - - - - - - - - - - -

UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz

TYPICAL EXTRAPOLATION FORMULA note 1

propagation delay time STR to On; 5 OFF-to-LOW 10 15 propagation delay time STR to On; 5 LOW-to-OFF 10 15 output transition time OS and OS'; HIGH-to-LOW 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15

tPLZ

note 1

tTHL

35 ns + (1.0 ns/pF)CL 19 ns + (0.42 ns/pF)CL 16 ns + (0.28 ns/pF)CL 35 ns + (1.0 ns/pF)CL 19 ns + (0.42 ns/pF)CL 16 ns + (0.28 ns/pF)CL note 1

tTLH

output transition time OS and OS'; LOW-to-HIGH

tPZL

output enable time EO to On; OFF-to-LOW

tPLZ

output disable time EO to On; LOW-to-OFF

note 1

tWCPL

minimum clock pulse width LOW

tWSTRH

minimum strobe pulse width HIGH 5 10 15

tsu

set-up time D to CP

5 10 15

th

hold time D to CP

+5 10 15

fclk(max)

maximum clock frequency

5 10 15

Note 1. Definition of symbol equivalent to 3-state outputs.

1999 Jun 30

6

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver

HEF4794B

handbook, full pagewidth input clock

data input

strobe input

output enable input internal O 0 ' (FF1) output O0 internal O 6 ' (FF7) output O6 serial output O S serial output O S '
MBD914

Fig.5 Timing diagram.

1999 Jun 30

7

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VDD VCC O0 VDD D PWM dimmer input
MBD913

APPLICATION INFORMATION

Philips Semiconductors

8-stage shift-and-store register LED driver

O7

HEF4794B
EO STR CP

O0 VDD D EO STR

O7

O S' V SS

HEF4794B
CP

O S' VSS

Fig.6 Application example: serial-to-parallel converting LED drivers.

handbook, full pagewidth

8
DATA

CONTROL AND SYNC CIRCUITRY

CLOCK

from remote controller

Product specification

HEF4794B

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm

HEF4794B

SOT109-1

D

E

A X

c y HE v M A

Z 16 9

Q A2 A1 pin 1 index Lp 1 e bp 8 w M L detail X (A 3) A

0

2.5 scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3

0.010 0.057 0.069 0.004 0.049

0.019 0.0100 0.39 0.014 0.0075 0.38

0.244 0.050 0.041 0.228

0.028 0.004 0.012

8 0o

o

Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION

ISSUE DATE 95-01-23 97-05-22

1999 Jun 30

9

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver

HEF4794B

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

D seating plane

ME

A2

A

L

A1

c Z e b1 b 16 9 MH w M (e 1)

pin 1 index E

1

8

0

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-10-02 95-01-19

1999 Jun 30

10

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Jun 30 11 MANUAL SOLDERING

HEF4794B

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
Suitability of IC packages for wave, reflow and dipping soldering methods

HEF4794B

SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -

suitable not not recommended(4)(5) recommended(6)

1999 Jun 30

12

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values

HEF4794B

This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1999 Jun 30

13

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
NOTES

HEF4794B

1999 Jun 30

14

Philips Semiconductors

Product specification

8-stage shift-and-store register LED driver
NOTES

HEF4794B

1999 Jun 30

15

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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1999

Internet: http://www.semiconductors.philips.com

SCA 66

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

245002/02/pp16

Date of release: 1999 Jun 30

Document order number:

9397 750 06151