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CAT. 8200B

Aluminum Solid Electrolytic Capacitors
with Functional Polymer

2012

NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
CONTENTS
Page
Precautions
Critical Precautions on FPCAP itself 1
General Precautions at Designing, for Use and Handling 2
Products List 6
Green Products 6
System Diagram 7
Products / Radial Lead Type
NS series 8
R7 series 10
R5 series 12
L8 series 14
E5 series 16
S8 series 18
F8 series 20
NU series 22
NE series 24
S6 series 26
HT series 28
Products / SMD Type
PS , PA series 30
HS , HA series 32
SS , SA , SB series 34
FS series 36
SL series 38
VA , VB series 40
Ordering Information 42
Packing Specifications 43
Materials and Soldering 46
Technical Guide 50
Estimating of Lifetime 54
Application Guide 55

NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
Precautions

Functional Polymer Aluminum Solid Electrolytic Capacitors

Critical Precautions on itself

1. Polarity
The FPCAP has polarity. Consequently, make sure polarity is never reversed when using.
If polarity is reversed, leakage current could increase or lifetime could decrease.

2. Applied Voltage
Under no circumstances can reverse voltage be applied. It may cause a short circuit.

3. Sudden charge and discharge
Keep sudden charge and discharge to a minimum. It may create a short circuit or cause high leakage current.
In this case, it is recommended to use a protection circuit in order to maintain high reliability.
Regardless, using protection circuit to ensure reliability is recommended when the rush current value exceeds 10A.
Please make sure to insert a protection resistor of about 1k for charge and discharge when measuring the leakage current.

4. Soldering
The soldering conditions must be kept within the permissible range prescribed in the catalog specification.
If the specification is not kept, there is the possibility of abnormal appearance and abnormal leakage current and reduced capacitance.

5. Installation on PC board
When designing the layout of your PC board using the FPCAP please take into consideration the standard mounting specifications.
The FPCAP can not be able to be mounted on a PC board if there is insufficient space.

6. Directions for use in circuits
Since leakage current fluctuations can occur during the soldering process the FPCAP cannot be used in the following circuits.

(1) High impedance voltage retention circuits

(2) Coupling circuits

(3) Time constant circuits

(4) Circuits greatly affected by leakage current

(5) Connecting two or more FPCAP in series

NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD. 1
Precautions

General Precautions at Designing, for Use and Handling

1. Circuit design precautions
(1) Check the rated performance
After checking the operation and installation environments, design the circuit so that it falls within the rated performance range
stipulated in the catalog specification.

(2) Operating temperature and ripple current
a) Set the operating temperature so that it falls within the range stipulated in the catalog specification.
b) Do not apply current that exceeds the allowable ripple current in the catalog.

(3) Leakage current
Even when the soldering conditions fall within the range of the catalog specification, the leakage current increases slightly.
It also increases slightly during high temperature no-load, moisture-proof no-load and temperature cycling tests with
no voltage applied.
In cases such as these, leakage current will decrease by applying voltage in conditions below the maximum operating temperature.

(4) Applied voltage Considerations
a) Make sure the sum of the peak DC voltage and ripple voltage values does not exceed the rated voltage.
b) Please do not apply the reverse voltage to FPCAP.
c) When the DC voltage is low, please check whether the peak value of ripple voltage does not become a reverse voltage.

(5) Reduction of failure stress
The main failure mode of the FPCAP is in the open mode primarily caused by an electrostatic capacitance drop.
Random short circuit mode failures occur rarely.
The time it takes to reach the failure mode can be extended by using the FPCAP with reduced ambient temperature,
ripple current and applied voltage.

(6) Capacitor insulation
a) Insulation is not guaranteed.
b) Be sure to completely separate the case, negative electrode terminal and positive electrode terminal from adjacent components
and PC board traces.

(7) Operating environment
Do not use the FPCAP in the following environments.
a) Places where it can come into direct contact with water or salt water and places where condensation may form.
b) Places filled with noxious gasses such as: hydrogen sulfide, sulfurous acid, nitrous acid, chlorine, ammonia, etc.
c) Places exposed to ozone, ultraviolet rays and radiation.
d) Where severe vibration or shock which exceeds the condition specified in the specification sheets.

(8) Assembly Conditions Considerations
In designing a circuit, the following conditions should be checked before the FPCAP is mounted on the PC board.
a) The pitch and diameter of PCB holes to which the FPCAP is mounted, shall be designed in conformance with the dimensional
tolerance stipulated in the catalog specifications.

(9) PC board
Avoid locating heat-generating components around the FPCAP and on the underside of the PC board under the FPCAP.

(10) Parallel connection
When used in a parallel connection with another capacitor, carefully select the type of capacitor.

(11) Other
a) Electrical characteristics are affected by fluctuations in temperature and frequency.
b) When mounting the FPCAP on a double-sided PC board, design the board so that extra PC board holes are not located
underneath the FPCAP.

2 NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
Precautions

2. Mounting precautions

(1) Things to know before mounting
a) Do not reuse the FPCAP that has already been assembled in a device and energized.
Excluding the FPCAP that has been removed for measuring electrical characteristics during a periodic inspection,
they cannot be reused.
b) Leakage current may increase if the part has been stored for a long period of time.
In this case, use after voltage treatment under the rated voltage.

(2) Mounting-1
a) Mount after checking the capacitance and the rated voltage.
b) Mount after checking the polarity.
c) Do not drop on the floor and do not use parts that have been dropped.
d) Do not deform and then mount.

(3) Mounting-2
a) Mount after checking the match between the lead pitch and the PC board holes pitch.
b) When an automatic insertion equipment is used to clinch the lead wires, make sure it is set correctly.
c) Be careful of the shock force that can be produced by the automatic insertion equipment.
d) Do not apply excessive external force to the lead wires, the FPCAP itself, or the electrode terminals.

(4) Soldering with a soldering iron
a) Set the soldering conditions (temperature, time) so that they fall within the range stipulated by the catalog specification.
b) When the lead wire terminal must be processed because the terminal spacing and the PC board holes spacing do not match,
process it before soldering so that no stress is applied to the FPCAP itself.
c) Do not subject the FPCAP itself to excessive stress when soldering with a soldering iron.
d) When a soldering iron is used to repair the FPCAP that has already been soldered once and needs to be removed,
do it after the solder has been completely melted so that no stress is applied to the FPCAP terminals.
e) Do not let the tip of the soldering iron touch the FPCAP itself.
f ) The amount of leakage current after soldering may increase a slightly (from a few A to several hundred A) depending
on the soldering condition (preheating and solder temperature and time, PC board material and thickness, etc.)
The leakage current can be reduced by applying voltage.

(5) Flow soldering (Radial lead type)
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few A to several
hundred A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP.
e) Flow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.

(6) Reflow soldering (SMD type)
Do not use reflow soldering for Radial lead type (Through Hole).
a) Never submerge the FPCAP in molten solder. Use the PC board to protect the FPCAP and only solder the opposite side
of the board that the FPCAP is mounted on.
b) Set the soldering conditions (soldering temperature, terminal submersion time) so that they fall within the range stipulated
by the catalog specification. The amount of leakage current after soldering may increase slightly (from a few A to several
hundred A) depending on the soldering conditions (preheating and solder temperature and time, PC board material and
thickness, etc.). The leakage current can be reduced through self-repair by applying voltage.
c) Take care that flux does not adhere to any place other than the terminals.
d) When soldering, take care that other components do not fall over and touch the FPCAP.
e) Reflow soldering under extremely abnormal conditions may reduce the capacitance of products before or after soldering.
f) Do not use VPS (Vapor Phase Soldering).

NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD. 3
Precautions

(7) Handling after soldering
a) Do not tilt, bend or twist the FPCAP after it has been soldered on the PC board.
b) Do not use the FPCAP as a handle to move the PC board after it has been attached to it.
c) Do not bump the FPCAP with objects after it has been soldered to the PC board. Make sure the FPCAP does not touch
other PC boards or components.
d) Do not subject to excessive stress after it has been soldered to the PC board.

(8) Washing the PC board
Check the following items before washing the PC board with these detergents; high quality alcohol-based cleaning fluid such as
Pine-ST-100S, Clean-thru 750H, 750L, 750K, or Techno Care FRW14 through 17; or detergents including substitute
Freon such as AK-225AES and IPA.
a) Use immersion or ultrasonic wave to clean for a total of less than five minutes.
b) The temperature of the cleaning fluid should be less than 60