5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note part of Agilent 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note, Agilent 5991-3686EN Mapping the Mechanical Properties of SAC 305 Solder with Express Test - Application Note c20140828 [4].pdf text manual preview

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Keysight Technologies
Mapping the Mechanical Properties
of SAC 305 Solder with Express Test

Application Note

Abstract
Electronic packaging reliability depends largely on the me-
chanical integrity of soldered interconnects. Thus, the purpose
of this work was to use a new nano-indentation technique,
Express Test, to map the hardness of a SAC 305 solder joint
with gold plating. In this study after extended aging, the solder
joint comprised three constituents: a tin-rich matrix, a bulk
intermetallic AuSn4, and an interfacial intermetallic (Cu, Ni,
Au)6Sn51. The softest material was the tin-rich matrix, which
had a hardness of 0.51