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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY240S UHF amplifier module
Product specification Supersedes data of 1998 Nov 05 1999 Aug 23
Philips Semiconductors
Product specification
UHF amplifier module
FEATURES · 3.5 V nominal supply voltage · 3 W output power · Easy output power control by DC voltage. APPLICATIONS · Digital cellular radio systems with Time Division Multiple Access (TDMA) operation (GSM systems) in the 890 to 915 MHz frequency range. DESCRIPTION The BGY240S is a three-stage UHF amplifier module in a SOT388C package. The module consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic substrate. PINNING - SOT388C PIN 1 2 3 4 Flange VC VS RF output ground
BGY240S
DESCRIPTION RF input
handbook, halfpage
1 Top view
2
3
4
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF OPERATION Pulsed; = 1 : 8 f (MHz) 890 to 915 VS (V) 3.5 VC (V) 2.2 PL (W) 3 typ. 3.5 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS VC PD PL Tstg Tmb PARAMETER DC supply voltage DC control voltage input drive power load power storage temperature operating mounting base temperature CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B. CONDITIONS VC < 0.2 V; no RF VC 0.2 V - - - - - -40 -30 MIN. 7 5 3 5 3.8 +100 +100 MAX. V V V mW W °C °C UNIT Gp (dB) 35 (%) typ. 47 ZS, ZL () 50
1999 Aug 23
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
CHARACTERISTICS ZS = ZL = 50 ; PD = 1 mW; VS = 3.5 V; VC 2.2 V; f = 890 to 915 MHz; Tmb = 25 °C; = 1 : 8; tp = 575 µs unless otherwise specified. SYMBOL IQ ICM PL Gp H2 H3 VSWRin PARAMETER leakage current peak control current load power power gain efficiency second harmonic third harmonic input VSWR stability VC = 0.2 V adjust VC for PL = 2.5 W VC = 2.2 V adjust VC for PL = 2.5 W adjust VC for PL = 2.5 W adjust VC for PL = 2.5 W adjust VC for PL = 2.5 W adjust VC for PL = 2.5 W VS = 3 to 5 V; PD = -2 to +5 dBm; VC = 0 to 2.2 V; PL 3 W; VSWR 12 : 1 through all phases VC = 0.2 V PL = 2.5 W; bandwidth = 30 kHz; 10 MHz above transmission band PD = -2 to +5 dBm; PL = 6 to 34 dBm PD with 3% AM; f = 100 kHz; PL = 6 to 34 dBm PL = 6 to 34 dBm; time to settle within -0.5 dB of final PL PL = 6 to 34 dBm; time to settle within -0.5 dB of final PL VS = 5 V; adjust VC for PL = 3 W; VSWR 12 : 1 through all phases CONDITIONS - - 3 35 - - - - - MIN. - - 3.5 - 44 - - 1.8 : 1 - TYP. MAX. 10 3 - - - -35 -33 3:1 -60 dBc UNIT µA mA W dB % dBc dBc
isolation Pn noise power AM/PM conversion AM/AM conversion tr tf carrier rise time carrier fall time ruggedness
- - - - - -
-45 -82 - - 1.5 1.5
-36 -80 3 12 2 2
dBm dBm deg/dB % µs µs
no degradation
1999 Aug 23
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
handbook, halfpage
4
MGM155
880 MHz 915 MHz
handbook, halfpage
6
MGM156
PL (W) 3
PL (W) 4
880 MHz
915 MHz
2
2 1
0 0.5
1
1.5
2 V (V) 2.5 C
0 2.5
3
3.5
4
VS (V) 4.5
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
ZS = ZL = 50 ; VC = 2.2 V; PD = 1 mW; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
Fig.2
Load power as a function of control voltage; typical values.
Fig.3
Load power as a function of supply voltage; typical values.
handbook, halfpage
50 (%) 40
MGM157
handbook, halfpage
5
MGM158
PL (W)
4
915 MHz 30 880 MHz 20 2 3
10
1
0 0 1 2 3 PL (W) 4
0 880
890
900
910
f (MHz)
920
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; VC = 2.2 V; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
Fig.4
Efficiency as a function of load power; typical values.
Fig.5
Load power as a function of frequency; typical values.
1999 Aug 23
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
handbook, halfpage
4
MGM151
handbook, halfpage
-20
MGM152
VSWRin
H2, H3 (dBc) -30
3 H3 -40 880 MHz 2 915 MHz -50 H2
1 0 1 2 3 PL (W) 4
-60 880
890
900
910
f (MHz)
920
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; PL = 2.5 W; Tmb = 25 °C; = 1 : 8; tp = 575 µs.
Fig.6
Input VSWR as a function of load power; typical values.
Fig.7
Harmonics as a function of frequency; typical values.
MGM153
5 PL (W) 4
(1) (2) (3) (4)
handbook, halfpage
10 output AM (%) 8
MGM154
915 MHz 880 MHz 6 3
2
4
1
2
0 0 20 40 60 80 100 Tmb (°C)
0 0 10 20 30 PL (dBm) 40
ZS = ZL = 50 ; PD = 1 mW; VC = 2.2 V; = 1 : 8; tp = 575 µs. (1) (2) (3) (4) VS = 3.5 V; f = 880 MHz. VS = 3.5 V; f = 915 MHz. VS = 3.1 V; f = 880 MHz. VS = 3.1 V; f = 915 MHz.
ZS = ZL = 50 ; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C; f = 100 kHz; input amplitude modulation = 3%; = 1 : 8; tp = 575 µs.
Fig.8
Load power as a function of mounting base temperature; typical values.
Fig.9
Output amplitude modulation as a function of load power; typical values.
1999 Aug 23
5
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
handbook, full pagewidth
1
90 2 3 4
50 input
50 output 47
VC
VS
MBH435
Dimensions in mm.
Fig.10 Printed-circuit board test fixture.
handbook, full pagewidth
C2
C1 Z1 R1
L1 C3 Z2
C4 typ. 1.35A
RF input
VC
MGD432
VS
RF output
Fig.11 Test circuit.
1999 Aug 23
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Philips Semiconductors
Product specification
UHF amplifier module
List of components (see Fig.11) COMPONENT C1, C2 C3 C4 L1 Z1, Z2 R1 Note DESCRIPTION multilayer ceramic chip capacitor tantalum capacitor electrolytic capacitor Grade 4S2 Ferroxcube bead stripline; note 1 metal film resistor 50 100 ; 0.6 W width 2.33 mm VALUE 680 pF 2.2 µF; 35 V 47 µF; 40 V DIMENSIONS
BGY240S
CATALOGUE NO. 2222 851 11681 2222 030 37479 4330 030 36300 2322 156 11001
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (r = 2.2); thickness 1/32 inch.
1999 Aug 23
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Philips Semiconductors
Product specification
UHF amplifier module
SOLDERING The indicated temperatures are those at the solder interfaces. Advised solder types are types with a liquidus less than or equal to 210 °C. Solder dots or solder prints must be large enough to wet the contact areas. Soldering can be carried out using a conveyor oven, a hot air oven, an infrared oven or a combination of these ovens. A double reflow process is permitted. Hand soldering must be avoided because the soldering iron tip can exceed the maximum permitted temperature of 250 °C and damage the module. The maximum allowed temperature is 250 °C for a maximum of 5 seconds. The maximum ramp-up is 10 °C per second. The maximum cool-down is 5 °C per second. Cleaning The following fluids may be used for cleaning: · Alcohol · Bio-Act (Terpene Hydrocarbon) · Acetone. Ultrasonic cleaning should not be used since this can cause serious damage to the product.
100
BGY240S
handbook, halfpage
300
MGM159
T (°C) 200
0 0 1 2 3 4 t (min) 5
Fig.12 Recommended reflow temperature profile.
1999 Aug 23
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
handbook, full pagewidth
17.7 12.5 12 6
4 8.75 footprint metallization solder area occupied area 2.9 1.8 1 0.57 0.7 1.37 5.08 5.08 17.9 1.7 2.54 6.75
12.5
17.1 12.4 12.1 6.4
solder area 5.55 2.45
7.55
1.67 2.7 1.1 0.5 1.37 5.08 5.08 1.5 2.54
MGM150
Dimensions in mm.
Fig.13 Footprint SOT388C.
1999 Aug 23
9
Philips Semiconductors
Product specification
UHF amplifier module
PACKAGE OUTLINE Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
BGY240S
SOT388C
U
A
y
D
E
U1
1 L
2
3
4
L1
b Z e e e1
w M
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 2.7 2.3 b 0.56 0.46 c 0.30 0.20 D 17.1 16.7 e 5.08 e1 2.54 E 12.2 11.8 L 0.7 0.3 L1 3.4 3.0 U 17.3 16.9 U1 6.0 5.6 w 0.25 y 0.15 Z 2.3 1.9
OUTLINE VERSION SOT388C
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 99-02-06
1999 Aug 23
10
Philips Semiconductors
Product specification
UHF amplifier module
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BGY240S
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1999 Aug 23
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Philips Semiconductors a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
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Printed in The Netherlands
125002/07/pp12
Date of release: 1999
Aug 23
Document order number:
9397 750 06262