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Keysight 5600LS AFM
Enhanced Sample Versatility:
300mm Wafer Vacuum Chuck

The Keysight Technologies, Inc. 5600LS AFM, already one of the most versatile atomic
force microscopy systems on the market (with a fully programmable 200 mm stage that
allows complete access over a full 200 mm in X/Y travel), has added yet another highly
useful configuration.

Previously, in order to image a 300 mm wafer on an AFM, an engineer needed to "break"
the wafer and place the portion of interest on the stage. Such destructive testing is not
only costly, but prevents further processing of the device in question, thus limiting the
use of atomic force microscopy for process development. However, by utilizing the new
300 mm wafer vacuum chuck with a properly configured Keysight 5600LS AFM system,
process engineers and failure analysis engineers can quickly obtain data via any of
Keysight's AFM modes to provide valuable process information and feedback without
wafer breakage.

Available as a special configuration, this new 5600LS AFM option entails shifting and
rotating the X/Y stage, mounting the 300 mm wafer vacuum chuck, and enabling an
option within the Keysight PicoView control software that facilitates rotation of the
camera image so as to simplify navigation and data acquisition.

Contact your sales representative today for more
information or to receive a quotation for this new option.

A B
C

P+ Buried Layer
Active Area of Devices
SMM capacitance and dC/dV images of IC obtained simultaneously.
Capacitance (A) clearly reveals differences in the varied shallow doping
N+ Buried Layer
with construct devices within the active areas. There are dramatic
contrast differences in the dC/dV phase image (B) which confirms the
presence of sub-surface highly doped layers. A vertical line profile across
P+ Buried Layer the phase image [as indicated by the green line] in (B) is shown in (C).
D
02 | Keysight | Keysight 5600LS AFM