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The Handling and
Bonding of Beam Lead
Devices Made Easy
Application Note
Introduction 710 (28)
670 (27)
Beam lead devices are particularly suited for hybrid integrated 225 (9) 225 (9)
225 (9) 250 (10)
circuits where low parasitics and small size are prime 200 (8) 200 (8) 200 (8) 175 (7)
requirements. Available as single units or monolithic quads,
the beam lead devices have made high packing density and
superior performance easily achievable in hybrid circuits. 130 (5)
There are single beam lead devices in four different 100 (4)
outlines--05 and 10 for Schottky diodes, 06 and 07 for PIN
diodes. A picture of the HPND-4001 PIN diode in outline
07 appears in Figure 1. As typical of the single beam lead 12 (0.48)
8 (0.32)
devices, this beam lead PIN diode consists of a silicon chip
with coplanar plated gold tabs (beam leads measuring barely
5 mils wide and 0.5 mil thick) 9 mils beyond the edge. The
detailed dimensions of outline 07 shown in figure 2 illustrate
the small size of the beam lead package, which results in Dimensions in