Text preview for : Mini PCI.pdf part of Mini PCI Specification Manual of type I II and III of Mini PCI
Back to : Mini PCI.rar | Home
Mini PCI Specification
Revision 1.0 October 25, 1999
Revision 1.0
REVISION 1.0 Initial release.
REVISION HISTORY
DATE 10/25/99
The PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein. Contact the PCI Special Interest Group office to obtain the latest revision of the specification. Questions regarding the Mini PCI specification or membership in the PCI Special Interest Group may be forwarded to: PCI Special Interest Group 2575 N.E. Kathryn #17 Hillsboro, Oregon 97124 Phone: 800-433-5177 (inside the U.S.) 503-693-6360 (outside the U.S.) Fax: 503-693-8344 e-mail [email protected] http://www.pcisig.com
DISCLAIMER This Mini PCI Specification is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample. The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
Ethernet is a registered trademark of Xerox Corporation. All other product names are trademarks, registered trademarks, or servicemarks of their respective owners.
Copyright © 1999 PCI Special Interest Group
ii
Revision 1.0
Contents
Chapter 1 Introduction
1.1 1.2 1.3 1.4 1.5 Overview.............................................................................................................................. 1 Motivation ........................................................................................................................... 1 Features and Benefits .......................................................................................................... 3 Specification References ..................................................................................................... 5 Administration ..................................................................................................................... 6
Chapter 2 Signal Definition
2.1 PCI Local Bus Specification References............................................................................. 7
2.2 System Connector Interface Signals.................................................................................... 8 2.2.1 Modem and System Audio Support........................................................................... 11 2.3 2.4 Mini PCI Exceptions and Differences............................................................................... 11 System Connector Pinout .................................................................................................. 13
2.5 Function-Specific ConnectorsCommunications Support ................................................ 15 2.5.1 LED Support.............................................................................................................. 16 2.5.2 Chassis Ground.......................................................................................................... 16
Chapter 3 Buses
3.1 3.2 3.3 Introduction ....................................................................................................................... 17 System Connector.............................................................................................................. 18 Function-Specific Connector............................................................................................. 19
iii
Revision 1.0
Chapter 4 Electrical Specification
4.1 System Interface Connector............................................................................................... 21 4.1.1 Audio Interface Modes .............................................................................................. 23 4.2 Mini PCI Function-Specific Connector ............................................................................. 24 4.2.1 LED Voltage and Current Specifications .................................................................. 25 4.3 Communications Signal Characteristics and EMC ........................................................... 25 4.3.1 Modem....................................................................................................................... 26 4.3.2 NIC............................................................................................................................. 26 4.3.3 Host System ............................................................................................................... 26 4.3.4 Labeling ..................................................................................................................... 27 4.3.5 NIC Performance Considerations .............................................................................. 27 4.4 4.5 PCI Bus Loading................................................................................................................ 28 MPCIACT# Signal ............................................................................................................ 28
Chapter 5 Mechanical Specification
5.1 Overview............................................................................................................................ 31
5.2 Safety ................................................................................................................................. 31 5.2.1 Modem Safety............................................................................................................ 32 5.2.2 NIC Safety ................................................................................................................. 32 5.2.3 I/O Connector Safety ................................................................................................. 33 5.2.4 Host System Safety.................................................................................................... 33 5.2.5 Labeling ..................................................................................................................... 34 5.3 Physical Configuration ...................................................................................................... 35
5.4 Mechanical Design Details................................................................................................ 36 5.4.1 Type IA Form Factor ................................................................................................. 37 5.4.2 Type IB Form Factor ................................................................................................. 39 5.4.3 Type IIA Form Factor................................................................................................ 41 5.4.4 Type IIB Form Factor ................................................................................................ 43 5.4.5 Type IIIA Form Factor............................................................................................... 45 5.4.6 Type IIIB Form Factor............................................................................................... 46 5.4.7 Type III PCB Details ................................................................................................. 47 5.5 Connector Information....................................................................................................... 54 5.5.1 System Connectors .................................................................................................... 54 5.5.1.1 Type I and Type II System Connector Specifications ....................................... 54 5.5.1.2 Type III System Connector Specifications ........................................................ 57 5.5.2 Type I and Type III LAN and Modem I/O Connectors ............................................. 59 5.5.3 RJ Connectors for Type II Mini PCI Cards ............................................................... 61 5.6 Thermal Guidelines ........................................................................................................... 62
iv
Revision 1.0
Chapter 6 Configuration Space
6.1 Configuration Space Organization .................................................................................... 63
Chapter 7 Power Management
7.1 Power Management for Mini PCI Cards ........................................................................... 65 7.1.1 3.3VAUX Implementation ........................................................................................ 66 7.1.1.1 Industry Specification Definitions and Requirements....................................... 66 7.1.1.2 D3cold Support .................................................................................................... 68 7.1.1.2.1 No D3cold Support............................................................................................ 68 7.1.1.2.2 System Board Supports D3cold Wake Events .................................................. 69 7.1.1.3 Guidelines For Handling Non-Standard 3.3VAUX Transitions ....................... 69 7.1.1.3.1 3.3VAUX Lost, 3.3V Present......................................................................... 71 7.1.1.3.2 3.3VAUX Lost, 3.3V Not Present.................................................................. 71 7.1.1.3.3 3.3VAUX Transients ...................................................................................... 71 7.2 7.3 Power Consumption .......................................................................................................... 72 Optional PCI Implementations Required on Mini PCI Cards ........................................... 73
v
Revision 1.0
Figures
Figure 1-1: Logical Representation of the Mini PCI Specification................................................ 2 Figure 1-2: Type I/Type III Mini PCI Card in a Notebook Computer ........................................... 3 Figure 1-3: Mini PCI and Standard PCI Size Comparison............................................................. 4 Figure 2-1: Mini PCI Card System PCI Signal Set ........................................................................ 8 Figure 4-1: System Audio Implementation for All Types............................................................ 23 Figure 4-2: Example of Single Ended and Differential Audio Signals for Type III Only ........... 24 Figure 5-1: Type I or Type III Mini PCI Card (Sample Installation) ........................................... 35 Figure 5-2: Type II Mini PCI Card (Sample Installation) ............................................................ 36 Figure 5-3: Type IA Form Factor ................................................................................................. 38 Figure 5-4: Type IB Form Factor ................................................................................................. 40 Figure 5-5: Type IIA Form Factor ................................................................................................ 42 Figure 5-6: Type IIB Form Factor ................................................................................................ 44 Figure 5-7: Type IIIA Form Factor............................................................................................... 45 Figure 5-8: Type IIIB Form Factor............................................................................................... 46 Figure 5-9: Type III PCB Form Factor ......................................................................................... 47 Figure 5-10: Type III PCB, Top Side, Detail A............................................................................ 48 Figure 5-11: Type III PCB, Top Side, Detail B (2X) ................................................................... 49 Figure 5-12: Type III PCB, Bottom Side...................................................................................... 50 Figure 5-13: Type III PCB, Bottom Side, Detail C ...................................................................... 51 Figure 5-14: Type III PCB, Bottom Side, Detail D (2X) ............................................................. 52 Figure 5-15: Type III PCB, Bottom Side, Detail E....................................................................... 53 Figure 5-16: Type I and Type II System Connector ..................................................................... 55 Figure 5-17: Type III System Connector (Shown with Type IIIA Card Inserted)........................ 57 Figure 5-18: Type I and Type III I/O Connectors......................................................................... 59 Figure 5-19: RJ Connector Detail................................................................................................. 61 Figure 7-1: 3.3VAUX Always Supported .................................................................................... 69 Figure 7-2: D3cold Support Only When On AC............................................................................. 70 Figure 7-3: Re-establishment of Mini PCI Card Without 3.3VAUX Support ............................. 70 Figure 7-4: Loss of 3.3VAUX When 3.3V is Present .................................................................. 71 Figure 7-5: Undefined 3.3VAUX Transitions.............................................................................. 72
vi
Revision 1.0
Tables
Table 2-1: Mini PCI Sideband Signals ........................................................................................... 9 Table 2-2: Mini PCI Card Type I/II System Connector Pinout.................................................... 13 Table 2-3: Mini PCI Card Type III System Connector Pinout ..................................................... 14 Table 2-4: Type I and Type III LAN Connector Pinout ............................................................... 15 Table 2-5: Type I and Type III Modem Connector Pinout........................................................... 16 Table 3-1: System Connector Specifications ............................................................................... 18 Table 3-2: Function-Specific Connector Specifications .............................................................. 19 Table 4-1: System Connector Specifications ............................................................................... 21 Table 4-2: Function-Specific Connector Specifications .............................................................. 25 Table 5-1: Function-Specific Connector Specifications .............................................................. 31 Table 5-2: 100-Pin Connector Physical Requirements................................................................. 56 Table 5-3: 100-Pin Connector Mechanical Performance Specification....................................... 56 Table 5-4: 100-Pin Connector Electrical Performance Specification .......................................... 56 Table 5-5: 100-Pin Connector Environmental Performance Specification.................................. 56 Table 5-6: 124-Pin Connector Physical Requirements................................................................. 58 Table 5-7: 124-Pin Connector Mechanical Performance Specification....................................... 58 Table 5-8: 124-Pin Connector Electrical Performance Specification .......................................... 58 Table 5-9: 124-Pin Connector Environmental Performance Specification.................................. 58 Table 5-10: I/O Connector Physical Requirements...................................................................... 60 Table 5-11: I/O Connector Mechanical Performance Specification ............................................ 60 Table 5-12: I/O Connector Electrical Performance Specification................................................ 60 Table 5-13: I/O Connector Environmental Performance Specification ....................................... 60 Table 5-14: Representative Connector Information ..................................................................... 61 Table 7-1: Mini PCI Power Management Exceptions.................................................................. 65 Table 7-2: Command Register Enable Bit.................................................................................... 73
vii
Revision 1.0
viii
Revision 1.0
Chapter 1 Introduction
1.1 Overview
The Mini PCI Specification defines an alternate implementation for small form factor PCI cards referred to in this specification as a Mini PCI Card. This specification uses a qualified sub-set of the same signal protocol, electrical definitions, and configuration definitions as the PCI Local Bus Specification. Where this specification does not explicitly define PCI characteristics, the PCI Local Bus Specification governs. The primary differences between a standard PCI expansion card and a Mini PCI Card are: · · · · The form factor of the card and card-system interconnection, that is, the smaller physical size of the Mini PCI Card and the connectors it uses The use of standard sideband signals for audio and communications Support of the CLKRUN# signal defined in the PCI Mobile Design Guide No support for optional JTAG signals, nor for the 64-bit PCI extension defined in the PCI Local Bus Specification
1.2 Motivation
The performance characteristics of the PCI local bus, demonstrated in desktop and server systems, make PCI cards desirable in a wide range of systems. Proprietary form factor PCI cards are already commonplace, underscoring the need for a standard to simplify designs, reduce costs, and increase the number of implementation options. This specification defines a standard small-form-factor card (using the 32-bit PCI local bus) that can be used in smaller systems in which standard PCI and Small PCI expansion cards cannot be used due to mechanical system design constraints. Examples of such smaller systems include notebook PCs and docking stations, sealed-case PCs (Net PCs or NCs), and set top boxes integrating communications capabilities. Figure 1-1 is a logical representation of the Mini PCI Specification.
1
Revision 1.0
Mini PCI CARD
SYSTEM BUSES
PCI
MODEM
AUDIO / AC '97
Mini PCI COMMUNICATION CENTRIC FUNCTION
FUNCTIONSPECIFIC CONNECTOR
LAN LED
POWER MGMT
SYSTEM INTERFACE
FUNCTION
I/O INTERFACE
Figure 1-1: Logical Representation of the Mini PCI Specification
2
Revision 1.0
Figure 1-2 shows a cutaway view of a notebook computer with a Mini PCI Card installed. The illustration shows a conceptual placement of the card. Actual installation location depends on the manufacturer.
Figure 1-2: Type I/Type III Mini PCI Card in a Notebook Computer
1.3 Features and Benefits
This specification establishes a high-performance local-bus standard for small or restricted mechanical environments. The key features and benefits can be divided into two groups. The first group of benefits comes from the use of an alternate form factor: · Upgradeability. Mini PCI Cards are removable and upgradeable with available "new technology" cards. This allows upgrades to the newest technologies. Where required, it is the system manufacturer's responsibility to provide sufficient notification in the accompanying manual that service should be performed by a qualified technician. Flexibility. A single Mini PCI interface can accommodate various types of communications devices. Therefore, the OEM manufacturer can supply "build to order" systems (for example, a network interface card instead of a modem or Token Ring instead of Ethernet). Reduced Cost. A standard form factor for small form factor cards makes them more manufacturable, which reduces costs and provides economies-of-scale advantage over custom manufactured form factors.
3
·
·
Revision 1.0
· · ·
Serviceability. Mini PCI Cards can be removed and easily serviced if they fail. Reliability. Mini PCI Cards will be mass produced and, consequently, of higher quality than low-volume custom boards. Software Compatibility. Mini PCI Cards are intended to be fully compatible with existing software drivers and applications developed for standard PCI expansion cards. In addition, it is strongly recommended that all Mini PCI Cards support current industry standards such as the applicable version of the PC XX System Design Guide (currently at version PC 99), Advanced Configuration and Power Interface Specification (ACPI), and other industry initiatives that may be developed in the future. Reduced Size. Mini PCI Cards are smaller than PCMCIA cards, Small PCI cards, and typical daughter boards. This reduced size permits a higher level of integration of data communications devices into notebook PCs, docking stations, sealed-case PCs (NetPCs or NCs), and set top boxes. Figure 1-3 shows a size comparison between the Type I Mini PCI Card and a standard PCI expansion card. Regulatory Agency Accepted Form Factor. Standardization of the Mini PCI Card form factor will permit world wide regulatory agencies to approve Mini PCI communications devices independent of host systems. This significantly reduces cost and risk on the part of systems manufacturers.
·
·
Mini PCI CARD STANDARD PCI EXPANSION CARD
Figure 1-3: Mini PCI and Standard PCI Size Comparison
4
Revision 1.0
The second group of benefits derives from the use of the high-performance PCI local bus: · High Performance. The PCI high-performance characteristics include 32-bit data path, full concurrency with the processor and memory subsystem, and hidden (overlapped) central arbitration. Ease of Use. Mini PCI supports full auto-configuration of PCI local bus add-in boards and components. Longevity. Implementing subsystems on the Mini PCI Cards increases system board utility. PCI local buses are processor independent and support multiple families of processors and future generations of processors (by bridges or by direct integration). Flexibility. PCI's full multi-master capability allows any PCI master peer-to-peer access to any PCI master/target. Data Integrity. PCI provides parity on both data and address and allows implementation of robust client platforms. Power Management. Consideration for mobile systems power requirements, PCI bus power management, and clock run protocol support.
· ·
· · ·
1.4 Specification References
This specification should be used in conjunction with the following specifications and documents (which were at the corresponding version numbers at the time of writing): · · · · · · · · PCI Local Bus Specification, Revision 2.2 PCI Bus Power Management Interface Specification, Revision 1.1 PCI Mobile Design Guide, Version 1.1 Audio Codec '97 Component Specification, Revision 2.1 PC Card Standard Electrical Specification, Revision April 1998 ISO/IEC 8802-3 ANSI IEEE Standard 802.3 Supplement to ANSI/IEEE 802.3 Document 802.3u ISO/IEC 8802-5 ANSI IEEE Standard 802.5
Design considerations should adhere to the guidelines established in the applicable revision of the PC XX System Design Guide (currently at version PC 99).
5
Revision 1.0
1.5 Administration
This document is maintained by the PCI SIG. The PCI SIG, an unincorporated association of members of the microcomputer industry, was established to monitor and enhance the development of the PCI local bus. SIG membership is available to all applicants within the microcomputer industry. Benefits of membership include: · · · · · · · · · Ability to submit specification revisions and addendum proposals Participation in specification revisions and addendum proposals Automatically receive revisions and addenda Voting rights to determine the Steering Committee membership Vendor ID number assignment PCI technical support PCI support documentation and materials Participation in SIG sponsored trade show suites and events, conferences, and other PCI local bus promotional activities Participation in the compliance program including participation at the "PCI Compliance Workshops" and the opportunity to be included in the "PCI Integrator's List"
For information on how to become a SIG member or on obtaining PCI local bus documentation, please contact: PCI Special Interest Group 2575 N.E. Kathryn #17 Hillsboro, Oregon 97124 Phone: 800-433-5177 (Inside the U.S.) 503-693-6360 (Outside the U.S.) Fax: 503-693-8344 e-mail: [email protected] Internet: http://www.pcisig.com
6
Revision 1.0
Chapter 2 Signal Definition
2.1 PCI Local Bus Specification References
The Mini PCI Card system interface implements the following: · · · A qualified sub-set of the signals required by a PCI interface. Bridging is supported but must be implemented without the LOCK# signal. Some optional PCI signals. A number of additional sideband signals.
Because the Mini PCI Card system interface is implemented with a supply voltage (Vcc) of 3.3 volts, and the bus interface signals are 3.3 volts, there is no requirement that the Mini PCI Card implement a 5 volt tolerant bus interface architecture. The Mini PCI signal set can be divided into three sub-sets: · · · PCI interface PCI power management Sideband
Sideband signals provide audio and communications support.
7
Revision 1.0
2.2
System Connector Interface Signals
The Mini PCI Card PCI interface signal sub-set is defined in Figure 2-1.
REQUIRED PINS OPTIONAL PINS
AD[31::00] ADDRESS & DATA C/BE[3::0]# PAR FRAME# TRDY# INTERFACE CONTROL IRDY# STOP# DEVSEL# IDSEL SERR# PERR# REQ# GNT# Mini PCI CARD INTA# INTB# INTERRUPTS
ERROR REPORTING
ARBITRATION
SYSTEM
CLK RST#
CLKRUN# PME#
POWER MANAGEMENT
Figure 2-1: Mini PCI Card System PCI Signal Set
The signals follow the specifications as defined in Chapter 2 of the PCI Local Bus Specification. All signal directions are specified with respect to the system board. Mini PCI power management consists of the following: · PCI power bus management signals PME# and 3.3VAUX as defined in the PCI Bus Power Management Interface Specification, with the exceptions noted in Chapter 7 of this document CLKRUN# as defined in the PCI Mobile Design Guide
·
This specification does not require that the system board implement Mobile PCI's clock run. If clock run is not implemented on the system board, the clock run pin on the system connector must be terminated low on the system board. This specification does require that the Mini PCI Card implement clock run functionality. Functionality does not allow for terminating the CLKRUN# pin to ground or through a pull-down resistor to indicate that the Mini PCI Card cannot tolerate a stopped or slowed clock. If the Mini PCI Card cannot tolerate the clock stopping or slowing, the Mini PCI Card must implement the clock run protocol and indicate that the clock cannot be stopped according to the Mobile PCI Design Guide. Only if the Mini PCI Card can tolerate the clock being stopped or slowed at any time without notification and the Mini PCI Card will never need to restart the clock, can the Mini PCI Card implement clock run as a no connect. Clock run cannot be implemented with a static pull-down or repetitive pulse circuit. The protocol must be supported or the implementation must be insensitive to clock stopping or slowing down. Telephony audio support is provided by the SYS_AUDIO_IN, SYS_AUDIO_OUT, and the MOD_AUDIO_MON pins. Future modem support is available using the Audio Codec '97 Component Specification interface.
8
Revision 1.0
These signals are shown in Table 2-1. All signal directions are specified with respect to the system board.
Table 2-1: Mini PCI Sideband Signals Signal Group
Power Management Support CLKRUN# Input/Output Control signal for PCI CLK. Used to stop or start the PCI clock for power management purposes. Also used to indicate the requirement for re-starting the clock or indicating that the PCI function cannot tolerate stopping the PCI clock. Control signal indicating a power management event has occurred. Mini PCI function active. Intended to indicate, when low, that the Mini PCI Card is in a communicating state requiring full system performance; for example, a software modem in the off hook state. Audio Codec '97
Signal
3.3VAUX
Direction
Output
Description
Auxiliary 3.3Vcc support for PME#
PME#
Input
MPCIACT#
Input
AC-link Support
AC_SYNC
Output
AC_SDATA_IN
Input
Audio Codec '97 This corresponds to the SDATA_INx pin of the AClink specification where "x" is 0, 1, 2, or 3. It is the responsibility of the system designer to properly connect the AC_SDATA_IN pin to the correct SDATA_IN pin of the system. If the system requires that the codec on the Mini PCI Card be a primary codec, then the system must hook the AC_SDATA_IN pin to SDATA_IN0 on the system board. If the system requires that the codec on the Mini PCI Card be a secondary codec, the system must hook the AC_SDATA_IN pin to the proper SDATA_INy pin on the system board where "y" is 1, 2, or 3.
9
Revision 1.0
Table 2-1. Mini PCI Sideband Signals (continued) Signal Group Signal
AC_BIT_CLK AC-link Support AC_ CODEC_ID0#, AC_CODEC_ID1#
Direction
Input/Output Output
Description
Audio Codec '97 Audio Codec '97 Used to assign the Mini PCI AC, AMC, or MC codec to the correct primary or secondary codec address. The system board manufacturer sets these bits based on the connection of AC_SDATA_IN to its respective SDATA_INx pin. A logic high voltage should be tied to the Wake voltage of the Mini PCI Card (3.3VAUX or 3.3V if 3.3VAUX is not used) Connection SDATA_IN0 SDATA_IN1 SDATA_IN2 SDATA_IN3 ID1 0 0 1 1 ID0 0 1 0 1
Note that the pins are logically TRUE when low. AC_SDATA_OUT AC_RESET# Audio Support AUDIO_GND MOD_AUDIO_MON SYS_AUDIO_IN SYS_AUDIO_OUT SYS_AUDIO_IN_GND1 SYS_AUDIO_OUT_GND1 Phoneline Interface TIP1 RING1 LAN Interface Analog Power See Table 2-4 for signal assignments1 VCC5VA1 Output Output Output Input Input Output Input Output Input/Output Input/Output Input/Output Output Audio Codec '97 Audio Codec '97 Analog ground for line level audio Modem audio monitor Telephony audio support Telephony audio support Return for SYS_AUDIO_IN Return for SYS_AUDIO_OUT Analog phoneline interface for modems Analog phoneline interface for modems LAN and LAN LED connections 5 volt power for analog voice circuits
A number of pins are defined as "RESERVED." These pins are reserved for future expansion and must not be connected on the Mini PCI Card or the host platform.
1 Available on the system connector in the Type III form factor only.
10
Revision 1.0
The signals denoted Audio Codec `97 constitute audio support as defined in the Audio Codec '97 Component Specification. The host platform support of AC link signals is optional. If AC link signals are supported, the host platform may need to terminate, with weak pulldowns or pullups as required by the system board chipset, the AC_BIT_CLK and AC_SDATA_IN signals to cover instances where the Mini PCI Card is not present or where it does not support AC link. Host platforms not supporting AC-link shall terminate the following signals to ground with less than or equal to 10 kohm termination: AC_RESET#, AC_BIT_CLK, AC_SYNC, and AC_SDATA_OUT. Host platforms not supporting AC-link shall terminate the following signals to Wake voltage with less than or equal to 100 kohm termination: AC_CODEC_ID0# and AC_CODEC_ID1#. Interrupt support is indicated by PCI interrupts INTA# and INTB#. PCI 66 MHz bus clock support is provided by M66EN. The PCI interrupts and M66EN are defined in Chapter 2 of the PCI Local Bus Specification. As a system board device, Mini PCI interrupt support implements some of the latitude afforded system board devices in interrupt assignments as defined in the PCI Local Bus Specification, Section 2.2.6.
2.2.1 Modem and System Audio Support
The MOD_AUDIO_MON signal supports Pulse Width Modulation (PWM) modem call progress monitoring. Implementation of the MOD_AUDIO_MON (Modem Audio Monitor) is defined in the PCMCIA PC Card StandardElectrical Specification, Section 5.2.12. The MOD_AUDIO_MON signal is required for data/fax (non-voice) only modem implementations. However, this signal is optional for the purposes of call progress monitoring in voice/data/fax modem implementations. The definitions for SYS_AUDIO_IN (system audio input from the Mini PCI Card) and SYS_AUDIO_OUT (system audio output to the Mini PCI Card) are line-level audio signals intended to support modem speakerphone type implementations. These signals are required for voice/data/fax modem implementations. These signals are optional for data/fax only modem implementations. Examples are shown in Figures 4-1 and 4-2. The electrical parameters of SYS_AUDIO_IN and SYS_AUDIO_OUT can be found in Chapter 4 of this document. The Type III Mini PCI form factor has two additional signals, SYS_AUDIO_IN_GND and SYS_AUDIO_OUT_GND, which may be used to support different audio implementations. Chapter 4 describes these different implementations.
2.3
Mini PCI Exceptions and Differences
Mini PCI differs from the PCI Local Bus Specification in the following ways: · While the PCI Local Bus Specification defines 5V, 3.3V, and dual voltage add-in cards, Mini PCI supports only a 3.3V signaling environment. Therefore, there are no VI/O pins defined, and no connector keying. The main Vcc logic supply is 3.3V. 5V is available, but limited to 100 mA. Total power consumption from all sources is limited to 2.0 W. The 5V supply defined for Type I, II, and III Mini PCI Cards is limited to 100 mA. The VCC5VA defined for Type III only Mini PCI Cards (filtered audio 5V supply) is limited to 100 mA. The 5V and VCC5VA supply are not the same supply and cannot be connected on the Mini PCI Card. See Table 4-1 for more information regarding VCC5VA.
11
· ·
Revision 1.0
·
3.3VAUX is limited to 200 mA in D3 states with PME enabled and to less than 5 mA in D3 states when PME is not enabled. In D0, D1, and D2 states, it is acceptable for wake event capable Mini PCI applications to consume up to 375 mA of 3.3VAUX current. PCI 64-bit bus expansion is not supported. Maximum connector pin current capacity is 500 mA. +12V and -12V supplies are not implemented. Uninitialized (D0 uninitialized) current is limited to 70 mA rather than the 10 W afforded a standard PCI expansion card. Caching is not supported. Since a Mini PCI Card is discovered through normal IDSEL and configuration read sequences, the PRESENT pins are not required or supported. Some interrupt routing latitude, typically reserved for the system board, is allocated to the Mini PCI Card. Power management is required. The LOCK# signal is not supported. Mini PCI is 3.3V signaling only.
· · · · · ·
· · ·
12
Revision 1.0
2.4
System Connector Pinout
The pin list in Table 2-2 shows system connector pinout for Type I and Type II cards. The pin list in Table 2-3 shows the system connector pinout for Type III cards.
Table 2-2: Mini PCI Card Type I/II System Connector Pinout
Pin Signal
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 INTB# 3.3V RESERVED GROUND CLK GROUND REQ# 3.3V AD[31] AD[29] GROUND AD[27] AD[25] RESERVED C/BE[3]# AD[23] GROUND AD[21] AD[19] GROUND AD[17] C/BE[2]# IRDY# 3.3V CLKRUN#
Pin Signal
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 5V INTA# RESERVED 3.3VAUX RST# 3.3V GNT# GROUND PME# RESERVED AD[30] 3.3V AD[28] AD[26] AD[24] IDSEL GROUND AD[22] AD[20] PAR AD[18] AD[16] GROUND FRAME# TRDY#
Pin Signal
51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 SERR# GROUND PERR# C/BE[1]# AD[14] GROUND AD[12] AD[10] GROUND AD[08] AD[07] 3.3V AD[05] RESERVED AD[03] 5V AD[01] GROUND AC_SYNC AC_SDATA_IN AC_BIT_CLK AC_CODEC_ID1# MOD_AUDIO_MON AUDIO_GND SYS_AUDIO_OUT
Pin Signal
52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 STOP# 3.3V DEVSEL# GROUND AD[15] AD[13] AD[11] GROUND AD[09] C/BE[0]# 3.3V AD[06] AD[04] AD[02] AD[00] RESERVED_WIP2 RESERVED_WIP2 GROUND M66EN AC_SDATA_OUT AC_CODEC_ID0# AC_RESET# RESERVED GROUND SYS_AUDIO_IN
2 Work in progress by the Mini PCI Working Group System Connector Sub Group.
13
Revision 1.0
Note that the Type III system connector is a superset of the Type I and II connectors. The signal list and layout in Table 2-3 starting at pin 17 is equivalent to pin 1 in Table 2-2. The overlapping signal region is shaded in Table 2-3.
Table 2-3: Mini PCI Card Type III System Connector Pinout
Pin Signal
1 TIP Key 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 8PMJ-33, 4 8PMJ-63, 4 8PMJ-73, 4 8PMJ-83, 4 LED1_GRNP LED1_GRNN CHSGND INTB# 3.3V RESERVED GROUND CLK GROUND REQ# 3.3V AD[31] AD[29] GROUND AD[27] AD[25] RESERVED C/BE[3]# AD[23] GROUND AD[21] AD[19] GROUND AD[17] C/BE[2]# IRDY# 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62
Pin Signal
2 RING Key 8PMJ-13, 4 8PMJ-23, 4 8PMJ-43, 4 8PMJ-53, 4 LED2_YELP LED2_YELN RESERVED 5V INTA# RESERVED 3.3VAUX RST# 3.3V GNT# GROUND PME# RESERVED AD[30] 3.3V AD[28] AD[26] AD[24] IDSEL GROUND AD[22] AD[20] PAR AD[18] AD[16] GROUND
Pin Signal
63 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 121 123 3.3V CLKRUN# SERR# GROUND PERR# C/BE[1]# AD[14] GROUND AD[12] AD[10] GROUND AD[08] AD[07] 3.3V AD[05] RESERVED AD[03] 5V AD[01] GROUND AC_SYNC AC_SDATA_IN AC_BIT_CLK AC_CODEC_ID1# MOD_AUDIO_MON AUDIO_GND SYS_AUDIO_OUT SYS_AUDIO_OUT GND AUDIO_GND RESERVED VCC5VA
Pin Signal
64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 FRAME# TRDY# STOP# 3.3V DEVSEL# GROUND AD[15] AD[13] AD[11] GROUND AD[09] C/BE[0]# 3.3V AD[06] AD[04] AD[02] AD[00] RESERVED_WIP5 RESERVED_WIP5 GROUND M66EN AC_SDATA_OUT AC_CODEC_ID0# AC_RESET# RESERVED GROUND SYS_AUDIO_IN SYS_AUDIO_IN GND AUDIO_GND MPCIACT# 3.3VAUX
3 8PMJ = 8 position modular jack connector pin, hereinafter referred to as RJ45 (see IEC 603-7:1990), see Table 2-4 for details. 4 Note: These signals are optional and are defined to provide convenient access to LAN signals without cabling. However, due to voltage limitations of the Type III connector, additional insulation or engineering will be required to meet IEEE 802.3 and 802.5 electrical isolation requirements. 5 Work in progress by the Mini PCI Working Group System Connector Sub Group.
14
Revision 1.0
2.5
Function-Specific ConnectorsCommunications Support
This section describes the 8 position modular jack LAN connector, hereinafter referred to as RJ45 (see IEC 603-7:1990), support for the Mini PCI Type I and Type III Cards only because Type II Cards have built in RJ connectors. Those RJ connector pinouts must be in compliance with the following specifications: · · · ISO/IEC 8802-3 ANSI IEEE Standard 802.3 Supplement to ANSI/IEEE 802.3 Document 802.3u ISO/IEC 8802-5 ANSI IEEE Standard 802.5
Table 2-4 shows Type I and Type III LAN connector pinout.
Table 2-4: Type I and Type III LAN Connector Pinout
I/O Conn Pin6 1 2 3 4 5 6 7 8 9 10 11 12 13 14 10 BASE-T LED1_GRNP7 LED1_GRNN7 No Connect8 Not used Not used RDNot used Not used RD+ TDTD+ No Connect8 LED2_YELP7 LED2_YELN7 Type III System Connector Pin6 11 13 15 8 7 6 5 4 3 2 1 9 7 5 10 8 3 6 4
LAN Type 10-100 LED1_GRNP7 LED1_GRNN7 No Connect8 RJ45 termination RJ45 termination RDRJ45 termination RJ45 termination RD+ TDTD+ No Connect8 LED2_YELP7 LED2_YELN7 Token Ring LED1_GRNP7 LED1_GRNN7 No Connect8 Optionally terminated Optionally terminated TX+ RXRX+ TXOptionally terminated Optionally terminated No Connect8 LED2_YELP7 LED2_YELN7
RJ45 (8PMJ) Pin
12 14
6 Due to the high frequencies on the LAN signals, Type III implementations shall not use both an I/O connector and a system connector for LAN wiring. The Type III card and host systems supporting Type III cards must be configured for only one connector, either an I/O connector or a system connector, but not both. Using both connectors will have an adverse affect on LAN performance and reliability. Host systems shall designate which form of connection is available on the host system and only incorporate Mini PCI Cards with matching configurations. Note: The Type III system connector wiring for LAN signals is defined to provide convenient access to LAN signals without cabling. However, due to voltage limitations of the Type III connector, additional insulation or engineering will be required to meet IEEE 802.3 and 802.5 electrical isolation requirements.
7 LED signals are optional and, if connected, are only required on the connector used for LAN signals. LED signals do
not need to be wired to both the I/O Connector and the System Connector on Type III cards. 8 This pin must be left as No Connect in order to meet IEEE 802.3 and 802.5 electrical isolation requirements.
15
Revision 1.0
Table 2-5 shows the pinout for the Type I and Type III modem connector.
Table 2-5: Type I and Type III Modem Connector Pinout Pin # 1 2 Signal RING TIP Description RING is one conductor of the wire pair comprising the local loop. TIP is one conductor of the wire pair comprising the local loop. Usually the more positive of the two conductors.
Type II modem Cards will have built-in RJ connectors whose pinouts must be in compliance with each country's regulatory agency specifications as discussed in Section 4.3.
2.5.1 LED Support
In addition to the standard LAN signal support, the Mini PCI implementation can support two LED devices in support of LAN functionality only. These LED devices can also be used in supporting LAN diagnostics which may be implementation specific. The Mini PCI Card generates and drives or sinks the LED device current as defined in Section 4.2.1. The LED device interface is supported as described in the LAN functionspecific connector, as shown in Table 2-4; and optionally in the Type III system connector, as shown in Table 2-3. It is intended that one LED device be green. The second LED may be yellow, orange, or amber. LED signals are optional and, if connected, are only required on the connector used for LAN signals. LED signals do not need to be wired to both the I/O Connector and the System Connector on Type III cards. The LED devices are driven by the signals LEDx-yyyz where: · · · x is the number 1 or 2 LED device. yyy indicates the color (YEL for yellow in this implementation). z indicates the DC polarity: N for sinking current into the pin, and P for sourcing current out of the pin.
As Table 2-4 shows, these signals then become LED1_GRNN and LED1_GRNP for the green LED device and LED2_YELN and LED2_YELP for the yellow LED device. There is no standard convention for the implementation of LEDs for Token Ring or Ethernet. Therefore, LED functionality for the two LEDs for Token Ring and Ethernet is left undefined. Vendors are free to implement the two LEDs as they choose.
2.5.2 Chassis Ground
The signal CHSGND is a chassis ground contact and is connected on the Mini PCI Card through a mounting hole on Type I and Type II cards and via a spring contact clip on Type III cards (as illustrated in Chapter 5).
16
Revision 1.0
Chapter 3 Buses
3.1 Introduction
In addition to the PCI bus, Mini PCI provides for implementing several technologies which may be enumerated as buses for discussion purposes as illustrated in Figure 1-1. The buses used in a Mini PCI Card implementation consist of combinations of the following: · · · · · The PCI local bus An audio bus A power management bus LAN (Ethernet and Token Ring) buses A modem bus
Existing specifications define the implementations of these functional buses.
17
Revision 1.0
3.2 System Connector
Table 3-1 summarizes the appropriate specifications regarding the buses implemented in the Mini PCI Card system connector.
Table 3-1: System Connector Specifications Signals Bus Implementation Governing Specification
INTA#, INTB#, C/BE[0::3]#, PCI STOP#, DEVSEL#, IDSEL, CLK, RST#, AD[00::31], REQ#, GNT#, PAR, PERR#, SERR#, M66EN, IRDY#, TRDY#, FRAME# PME#, 3.3VAUX CLKRUN# AC_SYNC, AC_SDATA_IN, AC_SDATA_OUT, AC_BIT_CLK, AC_CODEC_ID0#, AC_CODEC_ID1#, AC_RESET# MOD_AUDIO_MON, SYS_AUDIO_OUT, SYS_AUDIO_IN, SYS_AUDIO_OUT_GND9 SYS_AUDIO_IN_GND9 AUDIO_GND TIP9, RING9 8PMJ1-89,10 Modem LAN Power management Power management AC-link support
PCI Local Bus Specification, Chapter 3
PCI Bus Power Management Interface Specification PCI Mobile Design Guide Audio Codec '97 Component Specification
System audio
These audio signals are implementation specific. Refer to Chapter 4 of this specification for characteristics.
Specific to country's regulatory agency specifications Refer to Table 3-2 for governing specifications
9 Available on the system connector in the Type III form factor only. 10 Note: These signals are optional and are defined to provide convenient access to LAN signals without cabling. However, due to voltage limitations of the Type III connector, additional insulation or engineering will be required to meet IEEE 802.3 and 802.5 electrical isolation requirements.
18
Revision 1.0
3.3 Function-Specific Connector
Table 3-2 summarizes the appropriate specifications regarding the buses implemented in the Mini PCI Card function-specific connector.
Table 3-2: Function-Specific Connector Specifications Signals RD-, RD+, TD-, TD+ Bus Implementation Ethernet Governing Specification
ISO/IEC 8802-3 ANSI IEEE Standard 802.3 Supplement to ANSI/IEEE 802.3 Document 802.3u ISO/IEC 8802-5 ANSI IEEE Standard 802.5
Specific to country's regulatory agency specifications
TX-, TX+, RX-, RX+ TIP, RING
Token Ring Modem
LED1_GRNP, LED1_GRNN, Local area network support Implementation specific LED2_YELP, LED2_YELN RJ45 termination Local area network support Technology specific
19
Revision 1.0
20
Revision 1.0
Chapter 4 Electrical Specification
4.1 System Interface Connector
The electrical characteristics of each bus specified in this specification are implemented according to the relevant bus specification as shown in Table 4-1. An exception exists for Mini PCI with regard to the implementation of the PCI bus CLK signal. The PCI Local Bus Specification requires that the CLK signal be 2.5 inches in length on the PCI card. This length is reduced to 25.4 mm ±2.5 mm (1.0 inch ±0.1 inches) for the Mini PCI Card and must be routed to only one load. This deviation from the PCI Local Bus Specification requires that the system board design be responsible for clock/data timing. All other characteristics of the CLK signal are as defined in the PCI Local Bus Specification.
Table 4-1: System Connector Specifications System Connector Signals DEVSEL#, IDSEL, CLK, RST#, AD[00::31], REQ#, GNT#, PAR, PERR#, SERR#, M66EN, IRDY#, TRDY#, FRAME# PME#, 3.3VAUX Power management Bus Implementation Governing Specification
INTA#, INTB#, C/BE[0::3]#, STOP#, PCI
PCI Local Bus Specification, Chapter 4
PCI Bus Power Management Interface Specificiation PCI Mobile Design Guide
Refer to Section 4.5 for more information.
CLKRUN# MPCIACT# AC_SYNC, AC_SDATA_IN, AC_SDATA_OUT, AC_BIT_CLK, AC_ CODEC_ID0#, AC_CODEC_ID1#, AC_RESET#
Power management Power management and general purpose AC-link support
Audio Codec '97 Component Specification
21
Revision 1.0
Table 4-1: System Connector Specifications (continued) System Connector Signals
TIP11, RING11
Bus Implementation
Modem
Governing Specification
Specific to country's regulatory agency specifications. Refer to Section 4.1.1 for specific wiring ground rules. Refer to Table 4-2 for governing specifications
8PMJ1-811, 12
LAN
System Audio System Audio Signal SYS_AUDIO_OUT Voltage Range 700 mV RMS Nominal 1000 mV RMS Max Impedance Mini PCI Card termination impedance: 50 k minimum System source impedance: 600 , maximum SYS_AUDIO_IN 700 mV RMS Nominal 1000 mV RMS Max Mini PCI Card source impedance: 600 , maximum System termination impedance: 50 k, minimum MOD_AUDIO_MON AUDIO_GND SYS_AUDIO_OUT_GND11 Refer to the PC Card Electrical Specification, Section 5.2.12 for specification of the electrical characteristics of this signal Connected to system board audio ground Return signal for SYS_AUDIO_OUT. This may be used as a ground or may be used as a return for differentially receiving SYS_AUDIO_OUT. See Figure 4-1. Return signal for SYS_AUDIO_IN. This may be used as a ground or may be used as a return for differentially receiving SYS_AUDIO_IN. See Figure 4-1. 5 Volts ±5%, 100 mA maximum. Used primarily for voice circuit on modem card but may be used where quiet analog supply is needed. Voltage is supplied by system board to Type III Mini PCI Card. VCC5VA power return signal is AUDIO_GND. 300 Hz-3.4 kHz ±1 dB Test Conditions 300 Hz-3.4 kHz ±1 dB
SYS_AUDIO_IN_GND11
VCC5VA11
11 Available on the system connector in the Type III form factor only. 12 Note: These signals are optional and are defined to provide convenient access to LAN signals without cabling. However, due to voltage limitations of the Type III connector, additional insulation or engineering will be required to meet IEEE 802.3 and 802.5 electrical isolation requirements.
22
Revision 1.0
4.1.1 Audio Interface Modes
Three interconnect options are provided for the analog audio interface signals. The signals may be connected in a single-ended fashion as shown in Figure 4-1 for all cards; or, as in Figure 4-2 for Type III cards only. The signals may also be connected in a quasi-differential fashion as shown in Figure 4-2 for Type III cards only. The implementation permits any combination of single-ended/differential system/Mini PCI Card configurations.
SYS_AUDIO_OUT
AUDIO_GND HOST AUDIO SUBSYSTEM SYS_AUDIO_IN Mini PCI CARD
Figure 4-1: System Audio Implementation for All Types
23
Revision 1.0
SINGLE ENDED AUDIO IMPLEMENTATION
SYS_AUDIO_OUT
SYS_AUDIO_OUT_GND HOST AUDIO SUBSYSTEM
Mini PCI TYPE III CARD
SYS_AUDIO_IN
SYS_AUDIO_IN_GND
DIFFERENTIAL AUDIO IMPLEMENTATION
SYS_AUDIO_OUT
SYS_AUDIO_OUT_GND
HOST AUDIO SUBSYSTEM SYS_AUDIO_IN
Mini PCI TYPE III CARD
SYS_AUDIO_IN_GND
Figure 4-2: Example of Single Ended and Differential Audio Signals for Type III Only
4.2 Mini PCI Function-Specific Connector
The functional buses of Mini PCI consist of local area network support for Ethernet and Token Ring implementations, LED indicator support, and modem support. Table 4-2 lists the specifications governing the operation of these buses.
24
Revision 1.0
Table 4-2: Function-Specific Connector Specifications Signals Bus Implementation Governing Specification
RD-, RD+, TD-, TD+ Ethernet
ISO/IEC 8802-3 ANSI IEEE Standard 802.3 ANSI/IEEE 802.3 Document 802.3u ISO/IEC 8802-5 ANSI IEEE Standard 802.5
TX-, TX+, RX-, RX+ TIP, RING LED1_GRNP, LED1_GRNN, LED2_YELP, LED2_YELN RJ45 termination
Token Ring Modem Local area network support
As described in Section 2.5.1 of this specification
Local area network support
Technology specific
4.2.1 LED Voltage and Current Specifications
LED1_GRNP and LED2_YELP output signals are intended to provide a current limited supply voltage to system-mounted LED indicators. These signals shall provide one of the following: · · 5 V ±5% through a series resistance of 422 ohms ±1% 3.3 V ±5% through a series resistance of 187 ohms ±1%
LED1_GRNN and LED2_YELN output signals are active low and are intended to drive system-mounted LED indicators. These signals shall be capable of sinking to ground a minimum of 9.0 mA. The specifications listed in Table 4-2 provide approximately 7.0 mA of LED current assuming a typical forward voltage for the LED of Vf(typ) = +2.0 V dc.
4.3 Communications Signal Characteristics and EMC
Mini PCI Cards shall be tested and certified to the applicable standards for telecommunications devices per each country's regulations. Some examples of regulatory standards writing bodies and applicable standards are: · · · · · · · ACA Australian Communications Authority (Australia) TS 002 and TS 004 IC Industry Canada (Canada) CS-03 Issue 8 and IEES-003 JATE Japan Authority for Telecommunications Equipment (Japan) Blue Book FCC Federal Communications Commission (United States of America) 47 CFR Parts 15 and 68 CTR21 Common Technical Regulation 21 CENELEC European Committee for Standards Electrical (European) EN55022 and EN50082-1 IEC International Electrotechnical Commission(International) CISPR 22
25
Revision 1.0
·
VCCI Voluntary Control Council for Interference by Information Technology Equipment
It is the host system manufacturer's responsibility to ensure that the complete system/card combination complies with the applicable country's regulations.
4.3.1 Modem
Mini PCI Cards shall comply with the electromagnetic compatibility (EMC) requirements applicable per each country's regulations. Country specific requirements may include limits on Out of Band Noise (lower frequency emissions near the transmitted signal band), radiated and conducted emissions, immunity and susceptibility.
4.3.2 NIC
As with modems, Mini PCI Card NICs shall comply with the electromagnetic compatibility (EMC) requirements applicable per each country's regulations.
4.3.3 Host System
Host systems designed to receive Mini PCI Cards shall comply with the EMC requirements per each country's regulations in relation to the I/O signals. Country specific requirements may include limits on Out of Band Noise (lower frequency emissions near the transmitted signal band), radiated and conducted emissions, immunity and susceptibility. The I/O modem cable itself can degrade the Out of Band Noise performance if proper care is not exercised in the routing path within the system. The physical proximity of the cable to certain high frequency and high current switching elements (such as the microprocessor) can significantly affect results. As a general rule, the cable should be kept as short as possible and should be routed in such a way as to minimize its proximity to the high radiation sources within the system. If shielding becomes necessary, make sure the shield does not violate the TNV insulation and isolation requirements. The host system manufacturer shall ensure that the fully assembled system, including the modem and cable, complies with the Out of Band Noise emissions and Electromagnetic Compatibility requirements. Compliance should be confirmed by measuring the emissions level with respect to the particular national requirements of the receiving country. System designers should take care to minimize the possibility of electromagnetic interference (EMI) coupling onto the Tip and Ring signals. This should include careful consideration in the frequency range from 4 kHz to 10 MHz, where additional noise coupled to the signal path may impair the modem's ability to comply with the type approval requirements. As with the Out of Band Noise, EMI performance can be degraded by the cable. This can be caused by energy induced into the cable from circuit elements which are in close proximity as well as energy from the Mini PCI Card itself. The same guidelines outlined for the Out of Band Noise applies to minimizing EMI. Compliance should be confirmed by measuring the emissions level with respect to the particular national requirements of the receiving country.
26
Revision 1.0
NIC performance can be severely impacted by EMI coupled onto the signal paths. It is recommended that the signal paths be designed to meet the electrical attributes described in EIA/TIA 568-A and TSB-36 for Category 5 cabling. NIC cable shielding shall be optional and is determined based on the individual system requirements. For systems with relatively long cables, it may become necessary to shield the cable in order to meet EMI requirements. The presence of a shield can affect the impedance and return loss of the cable and, therefore, shall be factored into the overall cable design. It is recommended that the shield be connected to the chassis ground of the system.
4.3.4 Labeling
In cases where the Mini PCI Card is not user accessible, approval labels for the card may need to appear on the host platform with a note on the label stating that the approvals apply to the card and not the host system. The card may also be required to bear some safety, telecom, and EMC approval markings depending on the requirements of the receiving country. It is the responsibility of the host system manufacturer to ensure that the labeling is affixed in accordance with local regulations.
4.3.5 NIC Performance Considerations
NIC performance can be severely impacted by the design of the signal paths. Whether the NIC signals are routed through the host system board or a cable, one of the most important NIC performance considerations is the characteristic impedance of the conductors. If the conductor impedance does not closely match that of the Telecommunications Outlet (TO) and onboard PHY, reflections will occur which can cause significant performance reduction. Under severe mismatch conditions, complete loss of connectivity can occur. A properly designed transmission path should present an impedance of 100 ohms, ±15% in the frequency range 1 MHz to 100 MHz. The signal path construction is critical to controlling this impedance. A NIC cable may be constructed in many different ways but, as a general rule, the cable should meet the electrical attributes described in EIA/TIA 568-A and TSB-36 for Category 5 cabling. In the case of a twisted pair cable, the wire gauge, insulation, and twist parameters affect the cable impedance. With flex cable construction, the strip line constants such as trace width, trace spacing, and dielectric thickness control the cable impedance. Insertion loss of the NIC signal path including connectors should be equal to or better than an equivalent length of Category 5 cable. Refer to EIA/TIA 568-A Section 10.5. Refer to EIA/TIA 568-A Annex B, ANSI/IEEE 802.3 and ANSI X3.263 1995 clause 11 for more details on methods and techniques for measuring this parameter. Crosstalk is an unwanted signal coupled, either capacitively or inductively, from one signal path to another. The NIC signal path should be designed to minimize crosstalk. Refer to EIA/TIA 568-A and ANSI X3.263 1995 for crosstalk requirements and test methods.
27
Revision 1.0
Although termination of the unused NIC pairs is implementation specific, it is recommended that they be terminated. The purpose of termination is to reduce the noise and crosstalk coupled from the unused pairs onto the used pairs. Methods for termination include: · · · 100 ohm resistor placed across the pair and left floating RC network from each conductor to ground RC network from each conductor to a termination plane
It is recommended that the use of stubs (un-terminated lengths of signal path) be avoided. Stubs cause signals to be reflected back from the far end of the stub and can cause a significant reduction in NIC performance. A stub cannot be properly terminated without excessively attenuating the output signal. The presence of a shield around the NIC signals can affect the impedance and return loss of the signal path and, therefore, shall be factored into the overall signal path design. It is recommended that the shield be connected to the chassis ground of the system. The NIC signal paths are part of the network adapter interface and can impact network performance. Therefore, NIC performance should be verified to be compliant with characteristics and templates described in ANSI X3.263 1995 clause 9 (and those clauses of ANSI/IEEE 802.3 that are appropriate for the technologies supported by the Mini PCI NIC) when installed in the host system.
4.4 PCI Bus Loading
The PCI bus loading is defined in the PCI Local Bus Specification.
4.5 MPCIACT# Signal
MPCIACT#, Mini PCI function active, is intended to indicate, when low, that the Mini PCI Card is in a communicating state requiring full system performance. This signal is optional for systems and shall be used to prevent system suspend and limit CPU clock throttling where necessary. MPCIACT# is required for all Mini PCI Cards implementing functions that have critical system performance requirements, such as a software modem, or that have critical times where the Mini PCI function cannot tolerate system suspend. This signal should be active whenever the PCI function requires maximum system performance, or requires that the system not enter any suspended state. Typically, a modem would activate this signal when the modem is in an off hook state. This signal is not necessary for Mini PCI Cards where means to guarantee maximum system performance are either unnecessary or are provided through some other means. This signal is an open drain/collector signal with a Vol max of 0.8V with an Iol max of 5 mA. The Mini PCI Card shall be tolerant of 5V pullup on this pin. The Mini PCI Card may use a pullup on this pin as long as the Vol max at Iol max is maintained and the pullup is tied to 3.3V. The pullup shall not be tied to 3.3VAUX or 5V. The system board may pull this signal to 3.3V or 5V as required as long as the pullup resistance is greater than V/5 mA.
28
Revision 1.0
The Mini PCI Card shall not source more than 10 µA from MPCIACT# in the suspended state (3.3V and 5V are off). The maximum leakage current into this output, when not asserted (high state), shall be 40 µA. The leakage current shall be measured with the output tied to +5.5Vdc over the full temperature range of the Mini PCI Card.
29
Revision 1.0
30
Revision 1.0
Chapter 5 Mechanical Specification
5.1 Overview
This specification was created to define Mini PCI Cards for systems in which a standard PCI expansion card cannot be used due to mechanical system design constraints. The specification defines three form factors: Type I and Type II are single 100-pin connector interfaces; Type III is a single 124-pin connector interface. The Type I and Type II Mini PCI Cards use one miniature stacking connector. The Type III Mini PCI Card uses a card-edge type connector similar to the SO-DIMM type.
5.2 Safety
The specifications governing the mechanical and electrical safety requirements (for example, creepage and clearance requirements) for modem and network interface cards may include those in Table 5-1.
Table 5-1: Function-Specific Connector Specifications Bus Implementation Ethernet Governing Specifications
ISO/IEC 8802-3 ANSI IEEE Standard 802.3 Supplement to ANSI/IEEE 802.3 Document 802.3u
Token Ring Modem
ISO/IEC 8802-5 ANSI IEEE Standard 802.5
Specific to country's regulatory agency specifications
Mini PCI Cards shall be tested and certified to comply with the applicable international safety standards for telecommunications devices per each country's regulations. Some examples of regulatory standards writing bodies and applicable standards are: · · · · · CSA Canadian Standards Association (Canada) CAN/CSA C22.2 No. 950 CENELEC European Committee for Standards Electrical (European) EN 60950 IEC International Electrotechnical Commission (International) IEC60950 JATE Japan Authority for Telecommunications Equipment (Japan) Blue Book UL Underwriters Laboratories, Inc. (United States of America) UL 1950
31
Revision 1.0
Note: It is the Mini PCI Card manufacturer's responsibility to ensure that the Mini PCI Card complies with the applicable country's current regulations. It is the host system manufacturer's responsibility to ensure that the complete system/card combination complies with the applicable country's current regulations.
5.2.1 Modem Safety
Mini PCI Cards shall comply with the safety requirements applicable per each country's regulations. Some examples of safety specifications are IEC60950, UL1950 / CSA C22.2 No. 950, and EN60950. The Mini PCI Card shall provide, within the Mini PCI Card form factor envelope dimensions defined in this chapter, sufficient electrical insulation to meet all applicable insulation and spacing (creepage/clearance distance) requirements when the Mini PCI Card is installed in the host system. Insulation and spacing requirements may include: · · · 2.0 mm clearance and 2.5 mm creepage between Telecom Network Voltage (TNV) circuitry and ground. A single layer of insulation between TNV and ground of at least 0.4 mm thick. Two layers of insulation between TNV and ground, each layer being able to withstand 1500 VAC dielectric voltage. (A six-week temperature cycling test and 100% dielectric test may also be required unless a 2.0 mm clearance and 2.5 mm creepage distance is maintained between TNV circuitry and the edge of the insulation.) Three or more layers of insulation separating TNV from ground, each combination of two layers being able to withstand 1500 VAC dielectric voltage (A six-week temperature cycling test and 100% dielectric test may also be required unless a 2.0 mm clearance and 2.5 mm creepage distance is maintained between TNV circuitry and the edge of the insulation.)
·
A specific area of concern is the spacing (creepage/clearance distance) at the seams or openings in the card insulator. Also, care should be taken to ensure that the fit of the card in the host allows for sufficient spacing to other components in the system. Reduced spacing to the card insulator may increase the risk of compromising the insulator integrity. If a Mini PCI Card is intended to be sold into a country that requires (via NRTL) UL1950 /CSA C22.2 No. 950, TNV protection against overvoltage, a means f