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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY. Table of Contents
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
GENEVA 2 EXT
CPU : Penryn g l
n a
C Chip Set :
Remarks :
Cantiga + ICH9M
Mobility Platform
u ti
s n
C
Model Name : GENEVA 2 EXT
m e
a id
S f
PBA Name : MAIN
PCB Code : SGCE BA41-00930A
NAYA BA41-00936A
B Dev. Step :
Revision :
T.R. Date :
PV1.0
1.0
o n B
DRAW
SUN XIAO
CHECK
WUSHIJIANG
C
APPROVAL
BC.LEE
A A
DRAW DATE TITLE
CHECK
SUN XIAO,
DEV. STEP
2/27/2008
Gevena 2 ext SAMSUNG
WU SHIJIANG, PV
ELECTRONICS
APPROVAL REV PART NO.
BYEONGCHANG LEE, 1.0 COVER BA41-####A
MODULE CODE LAST EDIT
undefined May 08, 2008 19:01:59 PM PAGE 1 OF 23
4 3 2 1
COM-22C-015(1996.6.5) REV. 3 D:/mentor/Geneva2/Geneva2_ext_PV_0507
SRP Sheet Number: 1 of 78
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
CPU Smart
FAN
Charging IGFX / EGFX
Clocking Mobile Processor DC/DC Battery DC/DC
PG 9 Circuit Module CORE
CK-505 IMVP-6
D Penrny-6M D
PG 8 CPU PG 51 PG 49 PG 49 46 PG 52
Thermistor (1066MHz)
(TBD) 478pin
PG 9
ON BOARD
PG 26,27,28 L2 Cache : 4 MB
PG 71 HDMI FSB
Termination VCCP / DC-DC
PG 18,19
800 MT/S PG 74
Channel A (Reverse) DDR III 1066 DDR III PG 35
g l
GMCH-M Dual channel
SODIMM 0
DDR III Power
NVIDIA
Cantiga-GM/PM Channel B (Reverse)
DDR III PG 36 PG 76
n a
NB9P / M DDR III 1066 SODIMM 1
(TBD)
PG 64 LCD 30PIN
LCD/CRT/TV
1299 FCBGA
u ti
PG 42-47 PG 29 - 33
PG 65 CRT
s n
C Direct Media Interface CLINK C
x4, 1.5V
PG 60 USB 0,2,6,7 USB 0,2,6,7
PG 78
52P
m e
Lane 0 MINI CARD
ANT PCIE x1
PG 67 Bluetooth USB 5 ROBSON Marvell
SVHS / RCA
a id
USB 3
Component HD Audio DVB-T OPTION 8E8055(GLAN)
ICH9-M PG 57 RJ45 PG 43
GLCI (Lane5) 82566Mx (Nineveh)
HDAUDIO USB 8 OPTION
S f
High Definition Audio PG 69 Camera 676 BGA LCI 82562V
ANT
Aud. Audio HD Audio
PCIE x1 Lane 1 52P
AMP
ALC262 12P PG 36- 40 USB 4 Mini Card Shiry Peak
CLINK
MDC HD Audio
PG 53 PG 52 RJ11
n
PG 37
Modem
PG 43
B PG 55 B
PG 54
o
SPI
HEADPHONE PG 41
SPI ROM
MIC-IN
LPC
C
SATA 0
2P 2P PG 19 SATA HDD
SATA 1
80 Port
SPKR R PG 63 Touch
MICOM PAD PG 68
3.3V LPC, 33MHz
HD64F2169/2160
PG 59 TMKBC (TBD) KBD PG 66
SPKR L
PG 19 SATA ODD
A A
DRAW DATE TITLE
LED PG 22
CHECK
SUN XIAO,
DEV. STEP
2/27/2008
Gevena 2 ext SAMSUNG
WU SHIJIANG, PV
ELECTRONICS
APPROVAL REV PART NO.
BYEONGCHANG LEE, 1.0 BLOCK DIAGRAM BA41-####A
MODULE CODE LAST EDIT
May 08, 2008 19:01:59 PM PAGE 2 OF 23
4 3 2 1
COM-22C-015(1996.6.5) REV. 3 D:/mentor/Geneva2/Geneva2_ext_PV_0507
SRP Sheet Number: 2 of 78
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
BOARD INFORMATION
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices
Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts
TYPE FREQUENCY DEVICE USAGE
Cardbus AD25 3 B,C,D
Crystal 32.768KHz ICH8-M Real Time Clock
DT PCI SLOT AD22 1 B,C,D,C Crystal 10MHz MICOM HD64F2169/2160
MiniPCI SLOT AD23 2 A,B Crystal 14.318MHz CLOCK-Generator CK-505
g l
USB AD29(internal) - USB2.0 #0 (USB0) : A Crystal 24.576MHz Cardbus Controller 1394
USB2.0 #1 (USB1) : D Crystal 25MHz LAN Intel LAN
USB2.0 #2 (USB4) : C Crystal 27MHz (TBD) VIDEO PEG
USB2.0 #3 (USB5) : E 24.576MHz (TBD) HD Audio Audio
Crystal
USB2.0 #4 (EHCI) : H
n a
Hub to PCI AD30(internal) - -
LPC bridge/IDE/AC97/SMBUS AD31(internal) - B
Internal MAC AD24(internal) - E
u ti
AC Link - - B
GLAN - - F
LCD Pannel Detect (TBD)
s n
C Devices Resolution PANNEL_DETECT_0 C
Voltage Rails
m e
2
VDC
VCC_CORE
Primary DC system power supply (7 to 21V)
Core Voltage for CPU
I C / SMB Address
a id
MCH_CORE Core Voltage for CPU Devices Address Hex Bus
ICH_CORE Core Voltage for CPU
P1.05V (VCCP) VTT for CPU, Crestline & ICH8-M
ICH8-m Master - SMBUS Master
P1.05V_M 1.05V switched power rail for ME (on in M0/M1) CPU Thermal Sensor 1001 110x 9Ch Thermal Sensor
S f
P1.25V_M 1.25V switched power rail for ME (on in M0/M1) SODIMM0 1010 000x A0h -
P3.3V_M 3.3V switched power rail for ME (on in M0/M1) SODIMM1 1010 010x A4h -
P3.3V_A 3.3V always power rail (by KBC3_ALWS_ON) Thermal Sensor on SODIMM0 0011 000x 30h -
MICOM_P3V 3.3V always power rail (for Micom) Thermal Sensor on SODIMM1 0011 010x 34h -
LAN_3.3V 3.3V always power rail (for LAN) CK-505M (Clock Generator) 1101 001x D2h Clock, Unused Clock Output Disable
P1.5V 1.5V switched off power rail (off in S3-S5) DB400 (PCI Express Clocks) 1101 110x DCh Clock Buffer for PCI Express
P1.5V_AUX 1.5V switched on power rail TBD 0100 1100 4Ch Thermal Sensor
P2.5V 2.5V switched off power rail (off in S3-S5) TBD : (LVDS BackLight Inverter) 0101 1000 58h -
P1.8V 1.8V switched off power rail (off in S3-S5) TBD : (ALS) 0111 0010 72h Ambient Light Sensor
P1.8V_AUX 1.8V power rail for DDR TBD : (AUX DISPLAY) 0011 110x 3Ch EMA
n
P0.9V 0.9V power rail for DDR LAN 1100 1000 C8h 82566
P3.3V 3.3V switched off power rail (off in S3-S5) PCI Express Docking TBD TBD TBD
B P3.3V_AUX 3.3V switched on power rail TPM TBD TBD TBD B
P5V 5.0V switched off power rail (off in S3-S5)
o
P5V_AUX 5.0V switched on power rail
USB PORT Assign
PORT #
0
1
2
3
4
5
6
7
8
9
ASSIGNED TO
SYSTEM PORT 0
SYSTEM PORT 1
DMB
Expresas Card
DOCKING PORT 0
Bluetooth
Mini PCI Express
Aux Display
Test Port (RSVD)
WWAN/WIBRO (TBD)
PCI Express Assign
PORT #
0
1
2
3
4
5
C
ASSIGNED TO
PCIE x1 Slot
Mini Card (Golan)
Mini Card (WIBRO : RSVD)
Expresas Card
DOCKING PORT 0
GLAN
REVISION HISTORY
See rev notes for more information.
A A
DRAW DATE TITLE
CHECK
SUN XIAO,
DEV. STEP
2/27/2008
Gevena 2 ext SAMSUNG
WU SHIJIANG, PV
ELECTRONICS
APPROVAL REV PART NO.
BYEONGCHANG LEE, 1.0 BOARD INFO BA41-####A
MODULE CODE LAST EDIT
May 08, 2008 19:01:59 PM PAGE 3 OF 23
4 3 2 1
SRP Sheet Number: 3 of 78
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
POWER DIAGRAM
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
KBC3_VRON
ALWAYS ON KBC3_SUSPWR KBC3_PWRON VCCP3_PWRGD
P5.0V_AUX P5.0V
g l
DDR3 Power VRM ICH9M CAMERA
VRMs MICOM TOUCHPAD
USB Ports CRT THERMAL
HDD HDMI ODD
n a
AC Adapter SIO LEDs VRMs
Debug
19V
VDC P3.3V_AUX P3.3V
u ti
Battery DC ICH9M MCH FAN
11.1V MINICARD ICH9M AU6371
EXPCARD CLOCK BLUETOOTH
s n
C THERMAL MICOM LEDs C
LAN MDC DDR3 MINICARD
P12.0V_ALW HDD EXPCARD
P1.2V_LAN LCD HEADPHONE
SWITCHED POWER SPI LID SWITHC
HDCP ALC262
LAN
SIO
m e
P5.0V_ALW
P1.5V_AUX P1.5V
VRMs
a id
MCH EXPCARD
DDR3-SODIMM MINICARD Rail
P3.3V_MICOM State +V*Always +V*AUX +V SUSPWR PWRON VRON
ICH9M CLOCK
MCH
MICOM
SWITCH POWER Full On ON ON ON H H H
S f
RTC Battery
3V P1.8V S3 ON ON OFF H L L
ICH9M
GDDR3 NB9M
S4 ON OFF OFF H L L
P1.1V
S5 ON OFF OFF L L L
NB9M
B
o n P1.05V
CPU
ICH9M
P0.75V
MCH
B
C
DDR3
CPU_CORE
CPU
S5/S4 S3 S0
A A
DRAW DATE TITLE
CHECK
SUN XIAO,
DEV. STEP
2/27/2008
Gevena 2 ext SAMSUNG
WU SHIJIANG, PV
ELECTRONICS
APPROVAL REV PART NO.
BYEONGCHANG LEE, 1.0 POWER DIAGRAM BA41-####A
MODULE CODE LAST EDIT
May 08, 2008 19:01:59 PM PAGE 4 OF 23
4 3 2 1
SRP Sheet Number: 4 of 78
4 3 2 1
SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG. POWER RAILS ANALYSIS Rev. 0.5
D
220V This sheet should be updated !!! D
Adapter Battery
3.3V_AUX ( TBD A )
5V_AUX ( TBD A )
MICOM 3V ( TBD A )
1.8V ( TBD A )
g l
1.05V
0.1 A (TBD) ITP
CPU CORE MICOM 3V
CPU CORE ( TBD A )
1.05V (VCCP)
24.5 A (TBD) Merom-4M 3.3V
0.1 A (TBD)
Thermal
3.3V
0.08 A (TBD) KBC
n a
1.05V ( TBD A ) 3 A (TBD) Sensor 0.08 A (TBD)
1.5V ( 34 W )
1.5V ( TBD A ) 0.3 A (TBD)
2.5V ( TBD A )
3.3V ( TBD A ) 3.3V MICOM 3V
SIO PWR LED
u ti
0.02 A (TBD) 0.1 A (TBD)
5V ( TBD A ) 1.05V (MCH CORE)
1.8V_AUX ( TBD A ) 4.8 A (TBD) *1.5V : 13.4 A (TBD)
1.05V (VCCP)
2.5 A (TBD) Crestline
0.9V_AUX ( TBD A ) 1.5V 1.8V
1.3 A (TBD)
s n
P3.3V_ALW ( TBD A )
C 3.3V 0.14 A (TBD) C
2.5V CLOCK 3.3V
P1.8V_ALW (TBD A)
P1.0V_ALW (TBD A)
GMCH 0.2 A (TBD) R5C843
VGA CORE (TBD A)
0.2 A (TBD) 0.1 A (TBD)
VDC INV ( TBD A )
3.3V 3.3V_AUX
0.12 A (TBD) 0.1 A (TBD)
(8 - 8.5 W )
PEX IO (TBD A)
1.8V_AUX 2.7 A (TBD)
RTC_Battery
3.3V KeyBoard
0.2 A (TBD) 3.3V_AUX
1.05V (ICH CORE) 0.6 A (TBD) LAN (Intel)
m e