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DUAL BAND GSM
TELEPHONE
SGH-A408
SERVICE Manual
DUAL BAND GSM TELEPHONE CONTENTS
1. Exploded Views and Parts List
2. Electrical Parts List
3. Block Diagrams
4. PCB Diagrams
5. Flow Chart of Troubleshooting and
Circuit Diagram
1. SGH-A408 Exploded Views and Parts List
1-1. GSM Telephone Exploded View
1-2. GSM Telephone Parts List
1-3. Travel Adapter
1-4. STravel Adapter Parts List
1-5. Cigarette Lighter Adaptor
1-6. Cigarette Lighter Adapter Parts List
1-7. Test Jig
1-7-1. Test Jig Cable
1-7-2. RF Jig Cable
1-7-3. Test Jig
2. SGH-A408 Electrical Parts List
3. SGH-A408 Block Diagrams
3-1. Main Block Diagram
3-2. Main RF
3-2-1 RF Tx Part
3-2-2 RF Rx Part
4. SGH-A408 PCB Diagrams
4-1. Main Top
4-2. Main Bottom
5. SGH-A408 Flow chart of trouble shooting
5-1. Power ON
5-2. Initial
5-3. Sim Part
5-4. Charging Part
5-5. Microphone Part
5-6. Speaker Part
5-7. Key Data Input
5-8. Ring Indicator
5-9. Back Light
5-10. Alert Tone
5-11. GSM Receiver
5-12. GSM Transmit
5-13. DCS Receiver
5-14. DCS Transmit
SAMSUNG Proprietary-Contents may change without notice
1-1
1. SGH-A408 Exploded View and its Parts List
1-1. GSM Telephone Exploded View
1
9
2-1
2
2-2
11
3
2-3
10
4
12
14
13
15
5
8
16
7
18 6
17
19
22
20
21
SAMSUNG Proprietary-Contents may change without notice
1-2
SGH-A408 Exploded view and its Part List
1-2. GSM Telephone Parts List
NO DESCRIPTION SEC.CODE REMARK
1 MEC-FOLDER UPPER GH75-01450A SA
2 LCD ASS'Y GH07-00102A SA
2-1 SPEAKER ASS'Y GH59-00239A SA
2-2 VIBRATOR ASS'Y GH31-00030A SA
2-3 SHIELD NET GH74-01653A SA
3 FPCB GH59-00242A SA
4 HINGE HOLDER ASS'Y GH75-01109C SA
5 MEC-FOLDER LOWER GH75-01201F SA
6 WINDOW-LCD GH72-01726K SA
7 HOLE SHEET GH74-01013A SA
8 SCREW-MACHINE 6001-001155 SA
9 MEC-FRONT COVER GH75-01198F SA
10 MIC GH59-00245A SA
11 VOLUME ASS'Y GH75-00948A SA
12 KEY PAD-SILVER GH72-03141A SA
13 HOLDER-BUZZER GH73-00777A SA
14 KEY-PCB ASS'Y GH59-00279A SA
15 SHIELD COVER GH71-00512A SA
16 PBA GH92-01228A SA
17 COVER CONNECTOR GH73-00779E SA
18 ANTENNA GH42-00119C SA
19 RF JACK HOLDER GH73-00502A SA
20 MEC-REAR COVER GH75-01199F SA
21 SCREW-MACHINE 6001-000883 SA
22 BATTERY GH43-00392A SA 650 mAh
GH43-00391A SA 750 mAh
SAMSUNG Proprietary-Contents may change without notice
1-3
SGH-A408 Exploded view and its Part List
1-3. Travel Adapter
A B
C D
1-4. Travel Adapter Parts List
TYPE SEC CODE REMARK
A GH44-00171A CHINA (SGH-A408)
B GH44-00184A EUROPE
C GH44-00171C UNITED KINGDOM
D Gh44-00171E TAIWAN
SAMSUNG Proprietary-Contents may change without notice
1-4
SGH-A408 Exploded view and its Part List
1-5. Cigarette Lighter Adaptor
1-6. Cigarette Lighter Adapter Parts List
DESCRIPTION SEC CODE REMARK
Cigarette Lighter Adapter Code GH44-00195A BLACK
SAMSUNG Proprietary-Contents may change without notice
1-5
SGH-A408 Exploded view and its Part List
1-7. Test Jig (GH80-00161A)
1-7-1. Test Jig Cable (GH39-00096A) 1-7-2. RF Jig Cable (GH39-00093A)
SAMSUNG Proprietary-Contents may change without notice
1-6
SGH-A408 Exploded view and its Part List
1-7-3. Test Jig
DC
POWER
SUPPLY
8922 or 8960
WIRELESS COMMUNICATIONS
TEST SET
RF JIG CABLE
TES
T JI
G
232 CABLE
TEST JIG CABLE
SAMSUNG Proprietary-Contents may change without notice
1-7
2. SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
0 GH92-01228A
1 4302-001119 BAT200 BATTERY-LI(2ND) 3 V, 0.1MAH, -, -, 3.1 V, -
1 2203-000311 C100 C-CERAMIC, CHIP 0.12 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C101 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000330 C102 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP,
1 2203-005571 C103 C-CERAMIC, CHIP 10000 nF, +80-20 %, 6.3 V, Y5 V,
1 2203-000359 C104 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C106 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C107 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2404-001151 C108 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1 2203-005571 C109 C-CERAMIC, CHIP 10000 nF, +80-20 %, 6.3 V, Y5 V,
1 2203-000278 C110 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-000628 C111 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-001432 C112 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005158 C113 C-CERAMIC, CHIP 0.0022 nF, 0.25pF, 50 V, NP0, TP,
1 2203-005061 C114 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-001432 C115 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000628 C116 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C117 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005571 C118 C-CERAMIC, CHIP 10000 nF, +80-20 %, 6.3 V, Y5 V,
1 2203-005061 C119 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005061 C120 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-001432 C121 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP,
1 2404-001105 C200 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1 2203-005061 C201 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005509 C202 C-CERAMIC, CHIP 330 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000359 C203 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-000359 C204 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-005061 C205 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000254 C206 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000679 C207 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP,
1 2404-001017 C208 C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0
1 2203-000679 C209 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C210 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000359 C211 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
SAMSUNG Proprietary-Contents may change without notice
2-1
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2203-005509 C212 C-CERAMIC, CHIP 330 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-005061 C213 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005061 C214 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005061 C280 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000233 C300 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C301 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-005053 C302 C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-005053 C303 C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-005446 C304 C-CERAMIC, CHIP 0.0027 nF, 0.1pF, 50 V, NP0, TP,
1 2404-001234 C305 C-TA, CHIP 68 uF, 20 %, 6.3 V, -, TP, 3.3x2.7x1.7mm
1 2203-005061 C306 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000438 C308 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1 2203-005053 C309 C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-000628 C310 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C311 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2301-001230 C312 C-FILM, CHIP 10 nF, 5 %, 16 V, TP, 2012, -
1 2404-001105 C313 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1 2203-000940 C314 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, -
1 2203-000812 C315 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000254 C316 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000254 C317 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000836 C318 C-CERAMIC, CHIP 390 pF, 10 %, 50 V, X7R, TP, -
1 2203-005664 C319 C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
1 2203-000812 C320 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000438 C321 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1 2203-000278 C322 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-005446 C323 C-CERAMIC, CHIP 0.0027 nF, 0.1pF, 50 V, NP0, TP,
1 2203-000278 C324 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-000254 C325 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000425 C326 C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP,
1 2203-000425 C327 C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C328 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000940 C329 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, -
1 2203-000330 C330 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP,
1 2203-000836 C331 C-CERAMIC, CHIP 390 pF, 10 %, 50 V, X7R, TP, -
1 2203-005481 C332 C-CERAMIC, CHIP 47 nF, 10 %, 10 V, X7R, TP, -
1 2203-005664 C333 C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
SAMSUNG Proprietary-Contents may change without notice
2-2
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2203-000386 C334 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C335 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2301-001230 C336 C-FILM, CHIP 10 nF, 5 %, 16 V, TP, 2012, -
1 2203-005158 C337 C-CERAMIC, CHIP 0.0022 nF, 0.25pF, 50 V, NP0, TP,
1 2203-005158 C338 C-CERAMIC, CHIP 0.0022 nF, 0.25pF, 50 V, NP0, TP,
1 2203-000812 C339 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C340 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-002443 C341 C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP,
1 2203-002443 C342 C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP,
1 2203-002443 C343 C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP,
1 2203-002443 C344 C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP,
1 2203-000254 C345 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000254 C346 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-005061 C400 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000233 C401 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-005061 C402 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005065 C403 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-005065 C404 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-005664 C405 C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
1 2203-005664 C406 C-CERAMIC, CHIP 4700 nF, 10 %, 6.3 V, X5R, TP, 2012
1 2203-005065 C408 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000995 C409 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP,
1 2203-000359 C410 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-000359 C411 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-000254 C412 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-005065 C413 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000233 C414 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2404-001239 C415 C-TA, CHIP 100 uF, 20 %, 6.3 V, WT, TP, 3.3x2.7x
1 2203-005562 C416 C-CERAMIC, CHIP 10000 nF, +80-20 %, 10 V, Y5 V,
1 2203-005061 C417 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000940 C418 C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, -
1 2203-000812 C419 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005796 C420 C-CERAMIC, CHIP 2200 nF, 10 %, 10 V, X7R, TP, 2012
1 2203-000278 C421 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-000233 C500 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000438 C501 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1 2203-000812 C503 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
SAMSUNG Proprietary-Contents may change without notice
2-3
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2203-000233 C504 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C505 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000278 C506 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-005056 C507 C-CERAMIC, CHIP 0.0068 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-000233 C508 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C509 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-005234 C511 C-CERAMIC, CHIP 0.0012 nF, 0.25pF, 50 V, NP0, TP,
1 2203-000628 C512 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C513 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000278 C515 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-000628 C516 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C517 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C518 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C519 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000278 C520 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2404-001239 C521 C-TA, CHIP 100 uF, 20 %, 6.3 V, WT, TP, 3.3x2.7x
1 2203-005148 C522 C-CERAMIC, CHIP 100 nF, 10 %, 16 V, X7R, TP, 1608,
1 2203-000628 C525 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C526 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C527 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C530 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C532 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C533 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005061 C534 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000278 C535 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-000628 C537 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000438 C538 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1 2203-000254 C539 C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, -
1 2203-000696 C540 C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-000466 C541 C-CERAMIC, CHIP 0.001 nF, 0.25 pF, 50 V, NP0, TP,
1 2203-000679 C542 C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP,
1 2203-000233 C543 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP,
1 2301-001475 C544 C-FILM, CHIP 3.9 nF, 5 %, 16 V, TP, 2.0 x 1.25 x 0.9mm
1 2203-000995 C545 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C546 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-000278 C547 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP,
1 2203-001432 C548 C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP,
SAMSUNG Proprietary-Contents may change without notice
2-4
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2203-005065 C549 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2007-007771 C550 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP,
1 2203-005509 C551 C-CERAMIC, CHIP 330 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000725 C552 C-CERAMIC, CHIP 3.9 nF, 10 %, 50 V, X7R, TP, -
1 2203-005509 C553 C-CERAMIC, CHIP 330 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000812 C600 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C601 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2404-001151 C602 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1 2203-005148 C603 C-CERAMIC, CHIP 100 nF, 10 %, 16 V, X7R, TP, 1608,
1 2203-000812 C604 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000628 C605 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-005367 C606 C-CERAMIC, CHIP 6800 nF, +80-20 %, 25 V, Y5 V, TP,
1 2203-000812 C608 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C609 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-002968 C610 C-CERAMIC, CHIP 0.051 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C611 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2404-001151 C613 C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1 2203-000812 C614 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C615 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000812 C616 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005061 C617 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-005061 C618 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP,
1 2203-000628 C620 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C621 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-005065 C622 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000628 C625 C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP,
1 2404-001239 C627 C-TA, CHIP 100 uF, 20 %, 6.3 V, WT, TP, 3.3x2.7x
1 2203-005065 C630 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-001412 C631 C-CERAMIC, CHIP 0.03 nF, 5 %, 50 V, NP0, TP,
1 2203-001412 C632 C-CERAMIC, CHIP 0.03 nF, 5 %, 50 V, NP0, TP,
1 2404-001105 C634 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1 2404-001105 C635 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1 2203-000812 C636 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C637 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C638 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C639 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C640 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
SAMSUNG Proprietary-Contents may change without notice
2-5
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2203-000812 C641 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C642 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C643 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C644 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C647 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-005065 C651 C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP,
1 2203-000359 C652 C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C657 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000386 C658 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP,
1 2203-000386 C659 C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C660 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C662 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C663 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C664 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C665 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C666 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000812 C667 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 2203-000438 C670 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, -
1 2203-000812 C671 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP,
1 3709-001190 CN400 CONNECTOR-CARD EDGE 6P, 2.54MM, SMD, -
1 3705-001178 CN500 CONNECTOR-COAXIAL SMC, JACK, 100 Mohm,
1 3722-001530 CN600 JACK-PHONE 5P, 2.6PI, A uF, BLK, -
1 3710-001585 CN601 CONNECTOR-SOCKET 20P, 2R, 0.5mm, SMD-S, A uF
1 3711-004623 CN602 CONNECTOR-HEADER BOX, 20P, 2R, 0.5mm,
1 3710-001653 CN604 CONNECTOR-SOCKET 18P, 1R, 0.5mm, SMD-A, A uF
1 0407-000115 D200 DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
1 0401-001033 D201 DIODE-SWITCHING MCL4154, 25 V, 200 mA, M-MELF,
1 0405-001093 D300 DIODE-VARACTOR MA4ST230, 12 V, -, SOT-23, TP
1 0401-001033 D402 DIODE-SWITCHING MCL4154, 25 V, 200 mA, M-MELF,
1 0402-001463 D500 DIODE-RECTIFIER HSMS-2825, 15 V, 1 A, SOT-143,
1 0407-000115 D601 DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
1 2903-001211 F300 FILTER-CERAMIC BP, 14.6MHz, 300KHz, 6dB, 1dB,
1 2904-001165 F301 FILTER-SAW 400MHZ, .28MHZ, +-70KHZ, TP, 6.5DB, -
1 2904-001096 F500 FILTER-SAW 1.8425GHz, 75MHz, +-37.5MHz/2.5dB,
1 2904-001281 F501 FILTER-SAW 947.5MHz, 25MHz, +-12.5MHz/1.4dB,
1 2007-007771 F502 R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP,
1 2703-000310 L100 INDUCTOR-SMD 1.8 uH, 10 %, 0.8x1.6x0.8mm
SAMSUNG Proprietary-Contents may change without notice
2-6
SGH-A408 Electrical Parts List
Level SEC CODE REFERENCE DESCRIPTIONS Remark
1 2703-001543 L300 INDUCTOR-SMD 33 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001513 L301 INDUCTOR-SMD 100 nH, 5 %, 1.8x1.12x1.02mm
1 2703-002214 L302 INDUCTOR-SMD 8.2 nH, 5 %, 1.6X0.8X0.8MM
1 2703-001513 L303 INDUCTOR-SMD 100 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001545 L304 INDUCTOR-SMD 47 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001543 L305 INDUCTOR-SMD 33 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001547 L306 INDUCTOR-SMD 10 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001547 L307 INDUCTOR-SMD 10 nH, 5 %, 1.8x1.12x1.02mm
1 2703-001547 L308 INDUCTOR-SMD 10 nH, 5 %, 1.8x1.12x1.02mm
1 2703-002218 L400 INDUCTOR-SMD 100 uH, 20 %, 3.3X1.5X0.8MM
1 2703-001954 L501 INDUCTOR-SMD 2.7 nH, 0.3 nH, 1.0x0.5x0.5mm
1 2703-002213 L502 INDUCTOR-SMD 3.3 nH, 5 %, 1.6X0.8X0.8MM
1 2703-002212 L503 INDUCTOR-SMD 1.6 nH, 5 %, 1.6X0.8X0.8MM
1 2703-001514 L504 INDUCTOR-SMD 68 nH, 5 %, 1.8x1.12x1.02mm
1 2703-002213 L505 INDUCTOR-SMD 3.3 nH, 5 %, 1.6X0.8X0.8MM
1 2703-002284 L506 INDUCTOR-SMD 8.2 nH,