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GS M T ELEP H O N E
Manual
SERVICE
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
ELECTRONICS
1 . SGH - X4 6 0 S p e c if ic a t io n
1. GSM General Specification
GS M9 0 0 E GS M 9 0 0 DC S 1 8 0 0
Ph a se 1 Ph a se 2 P h as e 1
F r eq . B a n d [M Hz ] 8 9 0 ~9 1 5 8 8 0 ~9 1 5 1 7 1 0 ~1 7 8 5
Up l in k / Do w n li n k 9 3 5 ~9 6 0 9 2 5 ~9 6 0 1 8 0 5 ~1 8 8 0
0~124 &
A RF C N r a n g e 1 ~1 2 4 5 1 2 ~8 8 5
9 7 5 ~1 0 2 3
T x /R x s p ac in g 4 5 MHz 4 5 MHz 9 5 M Hz
Mo d . B i t r at e/ 270.833kbps 2 7 0 .8 3 3 k b p s 270.833kbps
Bi t Pe r i o d 3.692us 3 .6 9 2 u s 3.692us
Ti me Sl o t 576.9us 5 7 6 .9 u s 576.9us
P er io d / F r am e P er i o d 4 .6 1 5 m s 4 .6 1 5 m s 4 .6 1 5 m s
Mo d u l a ti o n 0 .3 G MS K 0 .3 G MS K 0 .3 GM SK
M S P o we r 3 3 d Bm ~1 3 d B m 3 3 d Bm ~5 d B m 3 0 d B m ~0 d B m
Po w er C l as s 5 p cl ~ 1 5 p c l 5pcl ~ 19pcl 0pcl ~ 15pcl
Se n si t iv i t y -102dBm - 1 0 2 d Bm -100dBm
TDM A M u x 8 8 8
C el l Ra d iu s 3 5 Km 3 5 Km 2 Km
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Specification
2. GSM TX power class
TX Power TX Power
GSM900 DCS1800
control level control level
5 33¡¾2 dBm 0 30¡¾3 dBm
6 31¡¾2 dBm 1 28¡¾3 dBm
7 29¡¾2 dBm 2 26¡¾3 dBm
8 27¡¾2 dBm 3 24¡¾3 dBm
9 25¡¾2 dBm 4 22¡¾3 dBm
10 23¡¾2 dBm 5 20¡¾3 dBm
11 21¡¾2 dBm 6 18¡¾3 dBm
12 19¡¾2 dBm 7 16¡¾3 dBm
13 17¡¾2 dBm 8 14¡¾3 dBm
14 15¡¾2 dBm 9 12¡¾4 dBm
15 13¡¾2 dBm 10 10¡¾4 dBm
16 11¡¾3 dBm 11 8¡¾4dBm
17 9¡¾3dBm 12 6¡¾ dBm
4
18 7¡¾ dBm
3 13 4¡¾ dBm
4
19 5¡¾ dBm
3 14 2¡¾ dBm
5
15 0¡¾ dBm
5
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2 . SGH - X4 6 0 C ir c u it D e s c r ip t io n
¥° . S G H - X 4 6 0 R F C i r c u i t D e s c r i p t i o n
A. RX PART
1. ASM(U102)
¡æ Switching Tx, Rx path for GSM900, DCS1800 by logic controlling.
2. ASM Control Logic
¡æ Truth Table
VC_1 VC_2
GSM Tx Mode H L
DCS Tx Mode L H
GSM Rx Mode L L
DCS Rx Mode L L
3. FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency
band.
- GSM FILTER (F100) ¡æ For filtering the frequency band between 925 ~ 960 MHz
- DCS FILTER (F101) ¡æ For filtering the frequency band 1805 and 1880 MHz.
4. VC-TCXO (OSC101)
To generate the 26MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx
IQ modulator.
The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select
channel and use fast lock mode for GPRS high class operation.
5. UAA3536(U100)
This chip integrates two differential-input LNAs.
The GSM input supports the E-GSM, DCS input supports the DCS1800. The LNA inputs are
matched to the 150 ohm differential output SAW filters through external LC matching network.
Image-reject mixer downconverts the RF signal to a 100 KHz intermediate frequency(IF) with
the RFLO from OSC100 voltage-controlled oscillator. The RFLO frequency is between 1801 ~
1921 MHz.
The Mixer output is amplified with an analog programmable gain amplifier(PGA), which is
controlled by AGAIN.
The quadrature IF signal is digitized with high resolution A/D converts (ADC).
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Circuit Description
B. TX PART
Baseband IQ signal fed into offset PLL, this function is included inside of U100 chip.
UAA3536 chip generates modulator signal which power level is about 1.5dBm and fed into
Power Amplifier(U105).
The PA output power and power ramping are well controlled by Auto Power Control circuit.
We use offset PLL below table.
200kHz offset GSM -35dBc
30 kHz bandwidth DCS -35dBc
400kHz offset GSM -66dBc
Modulation Spectrum
30 kHz bandwidth DCS -65dBc
600kHz ~ 1.8MHz offset GSM -75dBc
30 kHz bandwidth DCS -68dBc
¥± . B a s e b a n d C ir c u it d e s c r ip t io n of S G H - X4 6 0
A. PCF50601
1. Power Management
Ten low-dropout regulators designed specifically for GSM applications power the terminal and
help ensure optimal system performance and long battery life. A programmable boost converter
provides support for 1.8V, 3.0V, and 5.0V SIMs, while a self-resetting, electronically fused
switch supplies power to external accessories. Ancillary support functions, such as RTC module
and High Voltage Charge pump, Clock generator, aid in reducing both board area and system
complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface
gives a microprocessor full control of the PCF50601 and enables system designers to maximize
both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature
sensor, support reliable system design. These functions work together to ensure proper system
behavior during start-up or in the event of a fault condition(low microprocessor voltage,
insufficient battery energy, or excessive die temperature).
2. Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator
(PWM) and FET to modulate the intensity of a series of LED's or to control a DC/DC
converter that drives LCD backlight.
This phone (SGH-X460) use PWM.
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Circuit Description
3. Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32768 Hz
crystal oscillator provides an accurate low clock frequency for the PCF50601 and other circuitry.
B. Connector
1. LCD Connector
LCD is consisted of main LCD(color 65K UFB LCD) and small LCD(B/W). Chip select
signals, LCD_MAIN_CS and LCD_SUB_CS, can enable Each LCD. Backlight signal enables
white LED of main LCD and small LCD. "RESET_2V8" signal initiates the Reset process of
the LCD.
16-bit data lines(HD(0)~HD(15)) transfers data and commands to LCD through by pass
capacitor.
"SPK_P" and "SPK_N" from OM6357 are used for audio speaker. And "VDD_VIB" from
PCF50601 enables the motor.
2. Key
This is consisted of key interface pins among OM6357, KBIO(0:7). These signals compose the
matrix. Result of matrix informs the key status to key interface in the OM6357. Power on/off
key is separated from the matrix. So power on/off signal is connected with PCF50601 to enable
PCF50601. twelve key LED use the "VBAT" supply voltage. "VDD_KEY" signal enables
LEDs with current control. "FLIP" informs the status of folder (open or closed) to the OM6357.
This uses the hall effect IC, A3210ELH. A magnet under main LCD enables A3210ELH.
3. EMI ESD Filter
This system uses the EMI ESD filter, EMIF09 to protect noise from IF CONNECTOR part.
4. IF connetor
It is 24-pin connector. They are designed to use VBAT, V_EXT_CHARGE, TXD0, RXD0,
RTS0, CTS0, JIG_REC, CHARGER_OK, RXD1, TXD1, AUX_MIC, AUX_SPK and GND.
They connected to power supply IC, microprocessor and signal processor IC.
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Circuit Description
C. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "CHARGER_OK" enable charger IC and supply current to battery.
when fault condition caused, "CHG_ON" signal level change low to high and charger IC stop
charging process.
D. Audio
EARP_P and EARP_N from OM6357 are connected to the main speaker. AUXSP is connected to
the Hands free kit. MIC_P and MIC_N are connected to the main MIC. And AUX_MIC_P and
AUX_MIC_N are connected to the Hands free kit.
YMU762C is a LSI for portable telephone that is capable of playing high quality music by
utilizing FM synthesizer and ADPCM decoder that are included in this device.
As a synthesis, YMU762MA3 is equipped 32 voices with different tones. Since the device is
capable of simultaneously generating up to synchronous with the play of the FM synthesizer,
various sampled voices can be used as sound effects.
Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the
data(playing period) is not limited, so the device can flexibly support application such as incoming
call melody music distribution service. The hardware sequencer built in this device allows playing
of the complex music without giving excessive load to the CPU of the portable telephones.
Moreover, the registers of the FM synthesizer can be operated directly for real time sound
generation, allowing, for example, utilization of various sound effects when using the game
software installed in the portable telephone.
YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is
550mW (SPVDD=3.6V). The device is also equipped with conventional function including a
vibrator synchronous with music.
For the headphone, it is provided with a stereophonic output terminal.
For the purpose of enabling YMU762MA3 to demonstrate its full capabilities, Yamaha purpose to
use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is
compatible with multimedia.
Since the SMAF takes a structure that sets importance on the synchronization between sound and
images, various contents can be written into it including incoming call melody with words that can
be used for training karaoke, and commercial channel that combines texts, images and sounds, and
others.
The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to synthesis
(playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed
in SMAF.
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Circuit Description
E. Memory
Signals in the OM6357 enable two memories. They use only one volt supply voltage, VDD3 in
the PCF50601. This system uses Samsung's memory, KBB06A300M-T402. It is consisted of 128M
bits flash NOR memory and 128M bits flash NAND memory and 32M bits UtRAM. It has 16 bit
data line, HD[0~15] which is connected to OM6357. It has 23 bit address lines, HA[1~23].
CS_NAND and NCSRAM signals is chip select.
Writing process, HWR_N is low and it enables writing process to flash memory and SRAM.
During reading process, HRD_N is low and it enables reading process to flash memory and
SRAM. Each chip select signals in the OM6357 select memory among 2 flash memory and
UtRAM.
Reading or writing procedure is processed after HWR_N or HRD_N is enabled. Memories use
reset, which is VDD3 delay from PCF50601. HA[22] signal enables lower byte of SRAM and
HA[22] signal enables higher byte of SRAM.
F. OM6357
OM6357 is consisted of ARM core and DSP core. It has 8x1Kword on-chip program/data RAM,
55 Kwords on-chip program ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the
ARM core. DSP is consisted of KBS, JTAG, EMI and UART. ARM core is consisted of EMI,
PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface
Controller), eripheral bridge, PPI, SSI(Synchronous Serial Interface), ACC(Asynchronous
communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface.
KBIO(0:7), address lines of DSP core and HD[0~15]. HA[1~23], address lines of ARM core and
HD[0~15], data lines of ARM core are connected to memory, YMU762. MV317S(Camera DSP
Chip) controls the communication between ARM core and DSP core.
CS_NAND, NCSRAM, NCSFLASH in the ARM core are connected to each memory. HWR_N
and HRD_N control the process of memory. External IRQ(Interrupt Request) signals from each
units, such as, PMU need the compatible process.
KBIO[0~7] receive the status from key and RXD0/TXD0/IrDA_DOWN are used for the
communications using IRDA and data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It receives 13MHz clock
in CKI pin from external TCXO. ADC(Analog to Digital Convertor) part receives the status of
temperature, battery type and battery voltage.
G. VC_TCXO-214C6(26MHz)
This system uses the 26MHz TCXO, VC_TCXO-214C6. AFC control signal from OM6357
controls frequency from 26MHz X-tal. The clock output frequency of UAA3536HN is 13MHz.
This clock is connected to OM6357, YMU762.
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3 . SGH - X4 6 0 Ex p l o d e d V ie w and it s Pa r t s lis t
1. Cellular phone Exploded View- 1
QFU01
QLC67
QMO02
QFR01
QSP04
QKP01 QFL01
QCR04
QSC11
QMW01
QSC12
QVK01
QMP01
QME02
QIF01
QAN02
QVO01
QRE01
QRF01
QCR04
QBA18
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Exploded view and its Part list
2. Cellular phone Parts list
Location
Descr iption SEC CODE Remar k
NO.
QFU01 FOLDER UPPER GH75- 04524A
QLC67 LCD GH07- 00564A
QSP04 SPEAKER 3001- 001574
QMO02 MOTOR 3101- 001315
QFL01 FOLDER LOWER GH75- 04525A
QMW01 MAIN WINDOW LCD GH75- 04528A
QFR01 FRONT COVER GH75- 04523A
QVO01 VOLUME KEY GH75- 04529A
QKP01 KEYPAD GH75- 04527A
QMP01 MAIN PBA GH92- 01799A
QVK01 VOL KEY FPCB GH59- 01419A
QAN02 INTENNA GH42- 00425A
QME02 METAL DOME GH59- 01418A
QRE01 REAR COVER GH75- 04526A
QIF01 IF COVER GH72- 13265A
QRF01 RF COVER GH72- 15078A
QCR04 SCREW 6001- 001479
QBA18 BATTERY GH43- 01418A
QSC11 FOLDER SCREW CAP R GH74- 09038A
QSC12 FOLDER SCREW CAP L GH74- 09039A
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Exploded view and its Part list
3. Test Jig (GH80- 01909A)
3- 1. RF Test Cable 3- 2. Test Cable 3- 3. Serial Cable
(GH39- 00261A) (GH39- 00217A)
3- 4. Power Supply Cable 3- 5. DATA CABLE 3- 6. TA
(GH39- 00143B) (GH44- 00482A)
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4 . S GH - X 4 6 0 El e c t r i c a l P a r t s Li s t
SEC CODE Desig n LOC SEC CODE Desig n LOC
0403- 001427 ZD301 2007- 000162 R317, R323, R324, R501
0406- 001167 ZD604, ZD605 2007- 000162 R600, R601
0406- 001201 V501, V502, V601, V602 2007- 000171 R102, R105, R111, R112
0406- 001201 V603, ZD401, ZD402 2007- 000171 R207, R305, R403, R532
0406- 001201 ZD501, ZD502, ZD503 2007- 000172 R103
0406- 001201 ZD504, ZD505, ZD506 2007- 000173 R507, R509, R510, R511
0505- 001423 U606 2007- 000173 R512, R513, R516, R517
0601- 001790 LED500, LED501, LED502 2007- 000173 R531
0601- 001790 LED503, LED504, LED505 2007- 000174 R109
0601- 001790 LED506, LED507, LED508 2007- 000242 R502, R506
0601- 001790 LED510, LED511 2007- 000566 R106, R108, R320
0801- 002237 U301 2007- 000982 R119, R120, R122, R123
0801- 002882 U202, U303, U602, U603 2007- 001288 R125, R129
1001- 001253 U502 2007- 001301 R514, R515
1009- 001010 SW500 2007- 001305 R113, R115
1109- 001280 U300 2007- 001313 R301
1201- 002075 U105 2007- 001325 R304
1202- 001036 U501 2007- 003001 R114
1203- 003105 U500 2007- 007001 R204
1203- 003109 U304 2007- 007008 R127, R128, R130, R131
1204- 002161 U302 2007- 007009 R117
1205- 002276 U200 2007- 007014 R300, R302
1205- 002327 U100 2007- 007100 R402
1205- 002350 U400 2007- 007107 R321, R322
1404- 001221 V300 2007- 007148 R100
1405- 001082 V301, V302, V304, V604 2007- 007311 R110, R134
1405- 001082 V605, V606, V607, V608 2007- 007334 R519
1405- 001082 V609, V610, V611, V612 2007- 007480 R521, R522
1405- 001082 V613 2007- 007489 R135, R518
2007- 000140 R104, R311 2007- 007573 R319
2007- 000141 R101, R205, R206, R314 2007- 008117 R318
2007- 000142 R116 2203- 000233 C103, C104, C121, C300
2007- 000146 R308 2203- 000233 C316
2007- 000148 R107, R118, R121, R124 2203- 000254 C125, C151, C154, C200
2007- 000148 R132, R133, R201, R400 2203- 000254 C201, C302, C405
2007- 000148 R401, R504 2203- 000278 C134, C143, C144, C501
2007- 000157 R312, R316 2203- 000278 C502, C510, C511, C601
2007- 000162 R200, R202, R203, R303 2203- 000278 C602, C603
2007- 000162 R306, R307, R313, R315 2203- 000359 C150, C310
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Electrical Parts List
SEC CODE Desig n LOC SEC CODE Desig n LOC
2203- 000425 C102, C109 2203- 006053 C425, C426, C427
2203- 000438 C123, C153, C305, C313 2203- 006093 C411, C524
2203- 000550 C127 2203- 006137 C307
2203- 000585 C126, C130, C131, C132 2203- 006208 C402, C406, C413
2203- 000585 C133 2203- 006257 C317
2203- 000609 C128 2203- 006324 C412, C415
2203- 000679 C303, C432, C604 2301- 001197 C111
2203- 000800 C117 2301- 001213 C112
2203- 000812 C137, C142, C145, C156 2404- 001105 C314
2203- 000812 C202, C207, C320, C321 2404- 001225 C418, C419, C423, C429
2203- 000812 C431, C528 2404- 001239 C136
2203- 000854 C100, C107, C129 2404- 001268 C135, C315
2203- 000940 C149, C152 2404- 001333 C500, C527
2203- 000995 C529, C530, C607, C608 2703- 001734 L104
2203- 000995 C609, C610, C611, C612 2703- 002199 L106
2203- 001153 C138, C146 2703- 002200 L101
2203- 001652 C410, C422 2703- 002203 L103
2203- 002443 C503 2703- 002208 L100, L102
2203- 002525 C110 2703- 002308 L109, L110
2203- 003054 C407, C409 2703- 002368 L112
2203- 005054 C430 2703- 002700 L108
2203- 005056 C141 2801- 004339 X1
2203- 005057 C114, C120 2806- 001329 OSC100
2203- 005065 C122, C420 2809- 001287 OSC101
2203- 005138 C108 2901- 001246 U305
2203- 005288 C139 2901- 001286 F600, F601, F602, F603
2203- 005382 C155 2904- 001469 F100
2203- 005481 C116, C118 2904- 001470 F101
2203- 005482 C105, C106, C113, C115 2909- 001216 U102
2203- 005482 C119, C203, C204, C205 3301- 001105 L400, L501, L502
2203- 005482 C206, C208, C209, C210 3301- 001362 L503
2203- 005482 C211, C212, C213, C214 3301- 001438 R503, R505
2203- 005482 C215, C216, C217, C218 3705- 001242 CON101
2203- 005482 C219, C220, C301, C304 3709- 001298 CN500
2203- 005482 C306, C309, C312, C319 3710- 002115 CN300
2203- 005482 C401, C403, C404, C408 3711- 005487 CN600
2203- 005482 C414, C417, C428, C504 3722- 002067 EAR500
2203- 005482 C505, C509 4302- 001157 BAT400
2203- 006053 C124, C308, C421, C424
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5 . SGH - X4 6 0 B lo c k D ia g r a m s
1. RF So lut ion Bloc k Diagram
HITACHI METAL ANT SWITCH
SHS-C090F
FUJITSU EGSM RX SAW Filter
FAR-F5EB-942M50-B28C Pins IA,IB,QA and QB
V Q : 1.25V ty . , 1.15V
I mi, 1.35V max
Imax = 10 mA
Freq (MHz
880 - 915
925 - 960
) Loss
1.5 dB
1.0 dB
IL=2.7dB dB
Ripple=1.7maxmax Vmod: 0.5V pp
p n
1710 -1785 1.5 dB + I OUT
1805 -1880 1.1 dB - I OUT
Atten 2xfo : 24dB,25dB(GSM,DCS)
3xfo : 24dB,25dB(GSM,DCS) QUA 10
D kHz+fmod
0
FUJITSU DCS RX SAW Filter
FAR-F6EB-1G8425-B2BC + Q OUT
IL= 3.3dB max - Q OUT
Ripple= 2.0dB max
Vcc_RF_LO VREG DIV
VC1 VC2
Vcc_RF_VCO Frac
Vcc_SYN
FESW1 ~ GSM/DCS
N
DIV
VREG
f compRF26MHz
=
Vcc_REF(2.4V typ.)
FESW2
Discrete
rd
3 Order CP PFD
REFIN
VTCX
Loop Filter FESW1 26MH
z
O
FESW2
I+
DIV
OFFSET Mixer input power QUA 1:1/2 REF_13M
-16dBm max, -22dBm min D
pi -
PAD I- fmod
VBAT
Vcc_Tx_BURST
Discrete
rd
3 Order
GSM IN
Loop Filter f TXIF
3W
BUS
DATA
VRAMP
pi -
PAD ~ CP PFD
60/114MHz Q+
CT
RE
L
CLK
EN
G
~ Q-
PWR
RXON
GSM S/W Philips Transceiver TXON
EN SYNON
UAA3536
TX ENABLE DCS S/W FESWON
BAND SELECT
DCS IN pi -
MURATA
TX VCO VBat (3.6V typ 3.0V min)
PAD
MQW510C869M
GSM 915 MHz V )
824= ~ 3.0
~ PON_TX
RFMD PAM
RF3146 (Vt=0.5V1910 MHz VCC_SYN (2.7V , 100mA ) PON_SYNT
GSM: Pout = 35.0 dBm E = 55% 1710
DCS = ~ ~ 3.0 V )
(Vt=0.5V VCC_RX_TX (2.7V ,100mA )
RF1_VDD
RF2_VDD
DCS: Pout = 33.0 dBm E = 60% PMU
Harmonics <= -15dBc
Pout= 4.0~9.5dBm typ.,Ic <= 25mA VCC_RF_VCO (2.70V , 100mA )
VCC_TX_BURST(2.7V , 100mA )
RF1_VDDS
RF2_VDDS
V_MODE
VCC_CP (4.0V , 25mA ) HV AVDD(1.35V min 2.65V max , 100mA )
S
VDD1 (1.35V min 2.95V max , 150mA )
VDD2 (1.35V min 3.45V max , 150mA )
VDD3 (1.35V min 3.45V max , 100mA )
VDD4 (1.35V min 3.45V max , 150mA )
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Block Diagrams
2. Base Band Solut ion Blo ck Diagr am
MIC
Battery
BB INTERFACE
Type
Serial Data
RECEIVER Battery
Interface
Voltage
SPEAKER
I/O Battery
Interface Temperature
A/D VCC_CP
Interface
VIBRATOR OM6357
VCC_SYN
MELODY IC VCC_RX_TX
(40 Poly) RF INTERFACE
VCC_RF_VCO
SYSTEM CLOCK
(26MHz) AFC
VCC_TX_BURST
VDD1
SRAM
(32M bit) RAMP
VDD2
FLASH
VDD3
(256M bit)
VDD_VIB
MIC_BIAS
Li-Ion Battery
PMU
(Slim)
KEY_BOARD VDD_KEY
VDD_AMP
AVDD
Charging RTC_CLOCK
LCD SIM CARD
Circuit (32.768KHz)
AVDD_TEMP
5- 2
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6 . SGH - X4 6 0 PC B D ia g r a m s
1. Main PCB Top Diagr am
6- 1
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PCB Diagrams
2. Main PCB Bot t om Diagr am
6- 2
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7 . S GH - X 4 6 0 Fl o w C h a r t o f Tr o u b le s h o o t in g
1. Power On
' Power O ' does not work
n
Yes
Check the B attery Voltage No
is m than 3.4V
ore Change the Battery
Yes
No
C410(V P) = 2.7V
_ISU ? Check the PM related to V P
U _ISU
Yes
Check the C at
lock No
R402=32K Z
H Resolder X1
Yes
No
C (V D = " "
427 D 1) H? Check the V D circuit
D1
Yes
C426(V D &C
D 2) D 3)
425(V D No
= 2.8V? Check the V D D 3 circuit
D 2,V D
Yes
Check for the clock at C121 No Check the clock generation circuit
= 26M zH (related to O 101)
SC
Yes
Check the initial operation
Yes
ED
N
7- 1
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VDD1
Baseband power supply SIM
R400 VBAT
10K
IT_PMU
JIG_REC
RECO1
JACK_IN C431
32K 33PF
RSTON
ONKEY_N
CHARGER_OK C428 100NF
REF_ON
uClamp0501H
PMU (IC)
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C401 H5 D10 K3 H3 D9 A9 J2 K2
K1 C10 B2 A2 B1A1
This Document can not be used without Samsung's authorization
SIMVBAT
100NF
SIMSCN
SLPMOD
ONKEY
SIMGND
RSTO
REC1
REC3
P
ZD402
SIMSC
N
INT
TM
AUXO
SIM_VCC
CLK32
REC2
SIM_RST CN500