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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D TABLE OF CONTENTS D
1. COVER PAGE 36. DDR2 POWER
2. BLOCK DIAGRAM 37. CPU POWER
3. POWER DIAGRAM 38. 1.2VA/1.5VA/1.8V/2.5V/12V
39. MICOM / SWITCHED POWER
MONACO 4. BOARD INFORMATION
5. CLOCK DIAGRAM 40. CPU VID TRANSLATION
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6. RESET DIAGRAM 41. EXT GFX CONN
7. CPU (1/3) 42. TEST POINTS
8. CPU (2/3)
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9. CPU (3/3)
CPU :AMD SEMPRON 10. DDR2 - SODIMM
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11. DDR2 - TERMINATION
12. THERMAL SENSOR / FAN CONTROL
Chip Set :NVIDIA C51MV & MCP51
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13. NORTH BRIDGE (1/3)
14. NORTH BRIDGE (2/3)
Remarks :17"LCD 15. NORTH BRIDGE (3/3)
16. SOUTH BRIDGE (1/3)
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17. SOUTH BRIDGE (2/3)
18. SOUTH BRIDGE (3/3)
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19. FWH
Model Name : MONACO 20. CRT PORT
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21. LCD / TV-OUT
PBA Name : MAIN 22. MINI PCI A
23. MINI PCI B
PCB Code : BA41-00687A 24. AUDIO CODEC
25. AUDIO AMP
Dev. Step : MP
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26. AUDIO / MDC CONN
B 27. HDD / ODD / DMB B
Revision : 1.0 28. MICOM
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29. 5-IN-1 CONTROLLER(1/2)
T.R. Date : 2006.07.05 30. 5-IN-1 CONTROLLER(2/2)
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31. LAN CONTROLLER
32. USB PORTS
33. KBD / TOUCH PAD / LED / SWITCH
34. 3.3V_ALW / 5V_ALW POWER
DRAW CHECK APPROVAL 35. VCC_NB / 1.2V_HT POWER
A A
SON,C.W LEE,S.P LIM,J.G SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
FAN CPU
D VRM D
PG 12 PG 37
Mobile Processor DDR II 667/533/400 DDR II PG 10 DDR II Switched PWR
SODIMM 0 VRM
AMD SEMPRON PG 36
PG 39
CPU
(KEENE) DDR II 667/533/400 DDR II PG 10
Thermal
LCD Sensor
SODIMM 1
PG 12 L2 Cache : 256 / 512 KB
PG 7,8,9 638pin
PG 21 DDR II
HyperTransport Thermistor
OUT IN 16 x 16 PG 12
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LVDS 2ch LINK0
CRT/TV
North Bridge
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PG 20 CRT
DEMUX
C51MV
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PG 21 TV
SVHS / Composit Internal Graphics 468 BGA
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C C
PG 13,14,15 ANT
HyperTransport
LINK1 OUT IN 8x8 Wireless LAN
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Mini PCI CONN.
PG 22
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South Bridge 33MHz, 3.3V PCI
USB 0,1,2,3 PG 32
USB 0,1,2,3
4,5 Mini PCI CONN.
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PG 23
AUDIO MCP51 33MHz, 3.3V PCI
Audio 508 BGA
AZALIA AZALIA Primary
AMP
Codec
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ALC260 12P
B PG 25 PG 24 AZALIA B
AZALIA Secondary
RJ11 PG 16,17,18 PCI 10/100 LOM
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MDC 1.5 RTL8100CL RJ45
HP
PG 26 PG 31
PG 26 MIC-IN PG 31
C
FWH
4P
PG 19
PG 25
SATA
PG 27 HDD
PG 33
SPKR R
Touch
MICOM PAD
PATA 3.3V LPC, 33MHz
PG 27 ODD Hitachi H8S
2110B
SPKR L KBD
PG 28
PG 33
A A
SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
Power Diagram
KBC3_SUSPWRON KBC3_PWRON KBC3_VRON KBC3_HTPON
D D
AC Adapter CPU_CORE
P1.2V P1.2V_HT
SEMPRON
VDC VCC_NB
(1.2V)
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P1.8V_AUX
P12V
SODIMM (DDR II)
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u tiMICOM SB
P0.9V_AUX DDR II-Termination
DDR II for PEG (TBD)
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C C
MICOM_P3V
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P5V_ALW P5V
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P3.3V_ALW P3.3V
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P1.5V_ALW
P2.5V
P1.2V_ALW
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P1.8V
B P12V_ALW B
State
Full On
S3
S4
S5
Rail
+V*Always +V*AUX
ON
ON
ON
ON
ON
ON
OFF
OFF
+V
ON
OFF
OFF
OFF
SUSPWR PWRON
H
H
L
L
H
L
L
L
VRON
H
L
L
L Co P1.5V
S5 / S4 S3 S0
A A
SAMSUNG
ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D SCHEMATIC ANNOTATIONS AND BOARD INFORMATION D
PCI Devices Crystal / Oscillator
Devices IDSEL# REQ/GNT# Interrupts TYPE FREQUENCY DEVICE USAGE
MINIPCI A AD21 0 A,B
MINIPCI B AD22 1 C,D Crystal 25MHz MCP51 MCP51 REF CLOCK
AD23 2 Crystal 32.768KHz MCP51 Real Time Clock
LAN D
5-IN-1 AD24 3 B Crystal 10MHz MICOM H8S-2110B
Crystal 27MHz C51MV TV OUT
USB AD30(internal)
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Crystal 25MHz LAN RTL8110CL
Hub to PCI AD31(internal)
LPC bridge/IDE/AC97/SMBUS AD31(internal)
Internal MAC AD31(internal)
Voltage Rails
VDC
CPU_CORE
Primary DC system power supply (7 to 21V)
Core voltage for AMD SEMPRON (1.308~1.068V)
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C VCC_NB SEMPRON Processor Hyper Trasnport (1.2V) C
North Bridge Core Voltage
CPU Core Voltage Table
P0.9V_AUX 0.9V switched power rail (off in S4-S5) VID(5:0) Voltage VID(5:0) Voltage
P1.2V 1.2V switched power rail (off in S3-S5)
P1.5V 1.5V switched power rail (off in S3-S5) 0 0 0 0 0 0 1.5500 V 1 0 0 0 0 0 0.7625 V
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P1.8V 1.8V switched power rail (off in S3-S5) 0 0 0 0 0 1 1.5250 V 1 0 0 0 0 1 0.7500 V
P1.8V_AUX 1.8V power rail(off in S4-S5) 0 0 0 0 1 0 1.5000 V 1 0 0 0 1 0 0.7375 V
P2.5V 2.5V switched power rail (off in S3-S5) 0 0 0 0 1 1 1.4750 V 1 0 0 0 1 1 0.7250 V
0 0 0 1 0 0 1.4500 V 1 0 0 1 0 0 0.7125 V
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MICOM_P3V 3.3V always on power rail for MICOM 0 0 0 1 0 1 1.4250 V 1 0 0 1 0 1 0.7000 V
P3.3V 3.3V switched power rail (off in S3-S5) 0 0 0 1 1 0 1.4000 V 1 0 0 1 1 0 0.6875 V
0 0
- 0 1 1 1 1.3750 V 1 -
0 0 1 1 1 0.6750 V
0 0 1 0 0 0 1.3500 V 1 0 1 0 0 0 0.6625 V
0 0 1 0 0 1 1.3250 V 1 0 1 0 0 1 0.6500 V
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P5V 5.0V switched power rail (off in S3-S5) 0 0 1 0 1 0 1.3000 V 1 0 1 0 1 0 0.6375 V
0 0 1 0 1 1 1.2750 V 1 0 1 0 1 1 0.6250 V
0 0 1 1 0 0 1.2500 V 1 0 1 1 0 0 0.6125 V
P5V_ALWS 5V power rail (Always On) 0 0 1 1 0 1 1.2250 V 1 0 1 1 0 1 0.6000 V
P3.3V_ALWS 3.3V power rail (Always On) 0 0 1 1 1 0 1.2000 V 1 0 1 1 1 0 0.5875 V
0 0 1 1 1 1 1.1750 V 1 0 1 1 1 1 0.5750 V
P1.5V_ALWS 1.5V power rail (Always On)
0 1 0 0 0 0 1.1500 V 1 1 0 0 0 0 0.5625 V
0 1 0 0 0 1 1.1250 V 1 1 0 0 0 1 0.5500 V
2 0 1 0 0 1 0 1.1000 V 1 1 0 0 1 0 0.5375 V
0 1 0 0 1 1 1.0750 V 1 1 0 0 1 1 0.5250 V
I C / SMB Address
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0 1 0 1 0 0 1.0500 V 1 1 0 1 0 0 0.5125 V
Devices Address Hex Bus 0 1 0 1 0 1 1.0250 V 1 1 0 1 0 1 0.5000 V
B 0 1 0 1 1 0 1.0000 V 1 1 0 1 1 0 0.4875 V B
MCP51 Master - SMBUS Master 0 1 0 1 1 1 0.9750 V 1 1 0 1 1 1 0.4750 V
0 1 1 0 0 0 0.9500 V 1 1 1 0 0 0 0.4625 V
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W83L786NG(CPU Thermal Sensor) 1001 110X 9Ch Thermal Sensor 0 1 1 0 0 1 0.9250 V 1 1 1 0 0 1 0.4500 V
0 1 1 0 1 0 0.9000 V 1 1 1 0 1 0 0.4375 V
0 1 1 0 1 1 0.8750 V 1 1 1 0 1 1 0.4250 V
0 1 1 1 0 0 0.8500 V 1 1 1 1 0 0 0.4125 V
0 1 1 1 0 1 0.8250 V 1 1 1 1 0 1 0.4000 V
C
0 1 1 1 1 0 0.8000 V 1 1 1 1 1 0 0.3875 V
0 1 1 1 1 1 0.7750 V 1 1 1 1 1 1 0.3750 V
USB PORT Assign
PORT NUMBER ASSIGNED TO
0 SYSTEM PORT A
2, 3 SYSTEM PORT B
4, 5 SYSTEM PORT C
6 DMB
System Power States
A CHP3_SLPS1* S1, Powered-On-Suspend(POS) : In this state, all clocks(except the 32.768KHz clock) are stopped. A
The system context is maintained in system DRAM. Power is maintained to PCI, the CPU, memory controller, memory, and all other criticial subsystems.
Note that this state does not preclude power being removed from non-essential devices, such as disk drives. During this state, CPU can be selected
for either Deep Sleep or Deeper Sleep.
In Deeper Sleep, CPU voltage reduced in this state to reduce the leakage power. SAMSUNG
CHP3_SLPS3* S3, Suspend-To-RAM(STR) : The system context is maintained in system DRAM, but power is shut off to non-critical circuits.
Memory is retained, and refreshes continue. All clocks stop except RTC clock. ELECTRONICS
CHP3_SLP4S* S4, Suspend-To-Disk(STD) : The Context of the system is maintained on the disk. All power is then shut off to the system except for the logic required to resume.
Externally appears same as S5, but may have different wake events.
CHP3_SLPS5* S5, Soft Off(SOFF) : System context is not maintained. All power is shut off except for the logic required to restart. A full boot is required when waking.
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS 200/266/333MHz
EXCEPT AS AUTHORIZED BY SAMSUNG.
200/266/333MHz# SODIMM 0
D
CPU 200/266/333MHz
D
200/266/333MHz# SODIMM 1
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200MHZ
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C 200MHZ# C
NORTH
BRIDGE
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S f
27 MHZ
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33MHZ
B MINI PCI A B
32.768KHZ
200MHZ
200MHZ#
25MHZ
Co
SOUTH
BRIDGE
33MHZ
33MHZ
33MHZ
MINI PCI B
LAN
FWH
25MHZ
33MHZ
MICOM 10MHZ
25MHZ 33MHZ
A 5-IN-1 A
AC_BITCLK SAMSUNG
AUDIO ELECTRONICS
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SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
23
MINIPCI A PCIRST_MINIA*
PCIRST_MINIB*
22 HTMCP_PWRGD
D D
PCIRST_DEV*
SB 24 HTMCP_RST*
23
MINIPCI B
PCIRST_IDE*
PLT3_RST*
23 11 10
LAN / 5-IN-1
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KBC3_PWRBTN*
KBC3_RSMRST*
MCP3_SLPS3*
MCP3_SLPS5*
23
ODD
FWH
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21
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C 9 6 C
VDC 1
KBC3_SUSPWR* 7
MICOM_P3V 2 MAX8734 6
12 MICOM KBC3_PWRSW* NB
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4 KBC3_PWRON
P3.3V_ALW
P5V_ALW 4 PAGE 48
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PAGE 8
KBC3_RST*
MCP3_PWRGD
15 12
CPU1_PWRGD
CPU1_RESET*
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3
MICOM
5 P1.5V_ALW RESET
MIC5219 LOGIC HT_PWRGD
20 14
25 26
MIC5219
13 P1.5V 18
KBC3_HTPON VCC_NB
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5 P1.2V_ALW
ISL6227 13
12
B MIC5219
8 P1.8V_AUX
KBC3_PWRON P1.2V
CPU B
13
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MAX8632
8 KBC3_VRON P1.2V_HT
P0.9V_AUX
U600 19
PAGE 12
17
C
VRM3_CPU_PWRGD 16
13 P12V
CPU_CORE
LM2941 PAGE 45
13 P5V
SI4435
13 P3.3V
FDS6680
13 P2.5V
SC3381 13 P1.8V
A A
MIC5219
13 P1.5V SAMSUNG
ELECTRONICS
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THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS CO'S PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.
D D
J510-2
AMD_S1_638P_Socket 2 OF 5
7-A4 10-C4 Y16 10-D4
MEM1_ADATA(63:0)
CLK1_AMCLK2 7-A4 10-C4 AA16
MA0_CLK_H_2
AA12 63
CLK1_AMCLK2* 7-A4 10-C4 E16
MA0_CLK_L_2 MA_DATA_63
AB12 62