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Working Instruction, Electrical
Working Instruction, Electrical
Applicable for Z770i
CONTENTS
1 Moisture Sensitivity and Component Baking ...................................... 3
2 Lead-free Rework ................................................................................... 4
2.1 Lead-free Symbol .................................................................................. 4
2.2 Bottom Heat .......................................................................................... 4
2.3 Reflow Profile for BGA Rework Station ................................................. 5
2.4 Inspection .............................................................................................. 6
3 Replacement of components ................................................................ 7
3.1 X1200: Conn Antenna ........................................................................... 8
3.2 X1201: Coax Connector ........................................................................ 8
3.3 X1202:ANT GND Connector Leaf Spring 1p ....................................... 9
3.4 X2200:Battery Connector ...................................................................... 9
3.5 X2400:System connector ..................................................................... 10
3.6 X3100: Con X Keyboard connector .................................................... 10
3.7 X4200:LCM Connector ....................................................................... 11
3.8 N1400:Module Bluetooth + FM STLC2592 ........................................ 11
3.9 B4200: SMD Vibrator ......................................................................... 12
3.10 X2403:SIM Card Connector ................................................................ 12
3.11 X2405: MS-Micro Pico holder ............................................................ 13
3.12 N3101:ASIC Tjatte3 CSP20 ................................................................ 13
3.13 D2105:IC Single bus buffer gate ......................................................... 14
3.14 D2400:IC IF ISP1508 ES3 (3.5*3.5*0.8) ............................................ 14
3.15 L2401-L2404:Filter 0.0 Hz 0402 ......................................................... 15
3.16 N2203: 2ch-LDO, Vout1=2.8V, Vout2=1.8V, WL-CSP6 ................... 15
3.17 N2400: IC ............................................................................................ 16
3.18 N2402:IC ESD Prot UDFN 6 2x2 mm ................................................ 16
3.19 Ear speaker:Ear Speaker 1107.0 Rectangular ...................................... 17
3.20 Loudspeaker:Loudspeaker 1318.0 Oval .............................................. 18
3.21 V2420-V2422, V4209: Diode Zener 15, V SOD523 ........................... 18
3.22 E1000:Shield Can Closed small shielding ........................................... 19
3.23 E1001:Shield Can Fence ..................................................................... 20
3.24 N2202:IC Vreg SON-6 ........................................................................ 20
3.25 B4410:IC Lin,MR sensor .................................................................... 21
3.26 N2204: LDO1.2 V, 200mA, low noice, CS 5 ...................................... 21
3.27 B2102:Crystal 32,768 kHz .................................................................. 22
3.28 N1200: RF-Module Thor Pre-bumped................................................. 22
3.29 N1210: RF-Module Squid Pre -bumped .............................................. 23
3.30 C3137,C3141: Capacitor Ceramic 220,0 nF +/-10% 6,3 V ..................23
3.31 L2200: Ind WW 4.7 uH K3012.............................................................24
3.32 V2202: TRANS V;DUAL_PMOSFET;BYX101603_A;REQ318 .......24
3.33 V2431: Diode Protection 0.7 V SOD-882.............................................25
1208-5032 REV 4
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