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INTEGRATED CIRCUITS
DATA SHEET
TEA152x family STARplugTM
Product specification File under Integrated Circuits, IC11 2000 Sep 08
Philips Semiconductors
Product specification
STARplugTM
FEATURES · Designed for general purpose supplies up to 50 W · Integrated power switch: TEA1520: 48 ; 650 V TEA1521: 24 ; 650 V TEA1522: 12 ; 650 V TEA1523: 6.5 ; 650 V TEA1524: 3.4 ; 650 V. · Operates from universal AC mains supplies (80 to 276 V) · Adjustable frequency for flexible design · RC oscillator for load insensitive regulation loop constant · Valley switching for minimum switch-on loss (not implemented in TEA152xAJM versions) · Frequency reduction at low power output makes low standby power possible (<100 mW) · Adjustable overcurrent protection · Under voltage protection · Temperature protection · Short circuit winding protection · Simple application with both primary and secondary (opto) feedback · Available in 8-pin DIP, 14-pin SO and 9-pin DBS packages. GENERAL DESCRIPTION The TEA152x family is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. It is implemented in the high voltage EZ-HV SOI process, combined with a low voltage BICMOS process. The device includes a high voltage power switch and a circuit for start-up directly from the rectified mains voltage. APPLICATIONS
TEA152x family
A dedicated circuit for valley switching is built in (not implemented in TEA152xAJM versions), which makes a very efficient slim-line electronic powerplug concept possible. In its most basic version of application, the TEA152x family acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the TEA152x family renders an efficient and low cost power supply system. Table 1 RDS(on) 48 24 12 6.5 3.4 Available type numbers DIP8 TEA1520P TEA1521P TEA1522P TEA1523P TEA1524P SO14 TEA1520T TEA1521T TEA1522T TEA1523T - DBS9P - - TEA1522AJM TEA1523AJM TEA1524AJM
Typical application areas for the STARplugTM are: · Chargers · Adapters · STB (Set Top Box) · DVD · CD(R) · TV/monitor standby supplies · PC peripherals · Microcontroller supplies in home applications and small portable equipment, etc.
2000 Sep 08
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Philips Semiconductors
Product specification
STARplugTM
QUICK REFERENCE DATA SYMBOL Vdrain(max) RDS(on) PARAMETER maximum voltage at the DRAIN pin drain-source on-state resistance of TEA1520 drain-source on-state resistance of TEA1521 drain-source on-state resistance of TEA1522 drain-source on-state resistance of TEA1523 drain-source on-state resistance of TEA1524 VCC(max) fosc Idrain Tamb maximum supply voltage frequency range of oscillator supply current drawn from DRAIN no auxiliary supply pin ambient temperature CONDITIONS Tj > 0 °C Tj = 25 °C; Isource = -0.06 A Tj = 100 °C; Isource = -0.06 A Tj = 25 °C; Isource = -0.125 A Tj = 100 °C; Isource = -0.125 A Tj = 25 °C; Isource = -0.25 A Tj = 100 °C; Isource = -0.25 A Tj = 25 °C; Isource = -0.5 A Tj = 100 °C; Isource = -0.5 A Tj = 25 °C; Isource = -1.0 A Tj = 100 °C; Isource = -1.0 A MIN. - - - - - - - - - - - - 10 - -20
TEA152x family
TYP. - 48 68 24 34 12 17 6.5 9.0 3.4 4.8 - 100 1.5 -
MAX. 650 55.2 78.2 27.6 39.1 13.8 19.6 7.5 10.0 3.9 5.5 40 200 - +85
UNIT V V kHz mA °C
ORDERING INFORMATION TYPE NUMBER TEA152xP TEA152xT TEA152xAJM PACKAGE NAME DIP8 SO14 DBS9P DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14 leads; body width 3.9 mm plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad VERSION SOT97-1 SOT108-1 SOT523-1
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Philips Semiconductors
Product specification
STARplugTM
BLOCK DIAGRAM
TEA152x family
handbook, full pagewidth
VCC
1
SUPPLY
8
DRAIN
VALLEY
TEA152x
GND
2
LOGIC 100 mV
7
n.c.
PWM stop RC 3 OSCILLATOR low freq THERMAL SHUTDOWN PROTECTION LOGIC
F
6
SOURCE
POWER-UP RESET
1.8 U
blank
overcurrent 4 2.5 V 10x short circuit winding 0.75 V 0.5 V 5 AUX
REG
MGT419
The valley switching circuit is not implemented in the TEA152xAJM versions. The pinning shown in this diagram is the pinning of the DIP8 package. For the pinning of the other packages, see the relevant pinning tables and pin configurations.
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
STARplugTM
PINNING PIN SYMBOL TEA152xP VCC GND RC REG SGND AUX SOURCE n.c. DRAIN 1 2 3 4 - 5 6 7 8 TEA152xT 1 2, 3, 4, 5, 9 and 10 6 7 - 8 11 12 and 13 14 TEA152xAJM 1 2 3 4 5 6 7 8 9 supply voltage ground frequency setting regulation input
TEA152x family
DESCRIPTION
signal ground; connected to exposed die pad; must be connected to pin 2 input for voltage from auxiliary winding for timing (demagnetization) source of internal MOS switch not connected drain of internal MOS switch; input for start-up current and valley sensing
handbook, halfpage
VCC 1 GND 2
8 DRAIN 7 n.c. SOURCE AUX
handbook, halfpage
VCC GND RC REG SGND
1 2 3 4 5 6 7 8 9
MGT422
TEA152xP
RC REG 3 4
MGT420
6 5
TEA152xAJM
Fig.2 Pin configuration of TEA152xP.
AUX SOURCE n.c. DRAIN
handbook, halfpage
VCC GND GND GND GND RC REG
1 2 3 4 5 6 7
MGT421
14 DRAIN 13 n.c. 12 n.c.
Fig.4 Pin configuration of TEA152xAJM.
TEA152xT 11 SOURCE
10 GND 9 GND
8 AUX
Fig.3 Pin configuration of TEA152xT.
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Philips Semiconductors
Product specification
STARplugTM
FUNCTIONAL DESCRIPTION The TEA152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and optocoupler feedback. The TEA152x family uses voltage mode control. The frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator. In the first case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it operates at a constant frequency, which can be adjusted with external components RRC and CRC. This mode is called Pulse Width Modulation (PWM). Furthermore, a primary stroke is started only in a valley of the secondary ringing. This valley switching principle minimizes capacitive switch-on losses. Start-up and under voltage lock-out Initially, the IC is self supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin VCC passes the VCC(start) level. The supply is taken over by the auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efficiency operation. When for some reason the auxiliary supply is not sufficient, the high voltage supply also supplies the IC. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching and restarts from the rectified mains voltage. Oscillator The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time. Duty factor control
TEA152x family
The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation voltage is equal to the external regulation voltage (minus 2.5 V) multiplied by the gain of the error amplifier (typical 20 dB (10 ×)). Valley switching (not implemented in TEA152xAJM versions) A new cycle is started when the primary switch is switched on (see Fig.5). After a certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately 1 --------------------------------------------------( 2 × × ( Lp × Cp ) ) where Lp is the primary self inductance and Cp is the parasitic capacitance on the drain node. As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke. Figure 5 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the RC voltage. The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies. Figure 6 shows a typical curve for a reflected output voltage N × Vo of 80 V. This voltage is the output voltage Vo (see Fig.7) transferred to the primary side of the transformer with the factor N (determined by the turns ratio of the transformer). Figure 6 shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33° before the valley. The switch-on losses are still reduced significantly. Demagnetization The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first tsuppr seconds, demagnetization recognition is suppressed. This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.
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Philips Semiconductors
Product specification
STARplugTM
TEA152x family
handbook, full pagewidth
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke A RC oscillator regulation level B
MGT423
A: Start of new cycle with valley switching. B: Start of new cycle in a classical PWM system.
Fig.5 Signals for valley switching.
MGT424
handbook, halfpage
40
phase (°) 20
0
-20
-40
0
200
400
600 f (kHz)
800
Fig.6 Typical phase of drain ringing at switch-on (at N × Vo = 80 V).
2000 Sep 08
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Philips Semiconductors
Product specification
STARplugTM
Minimum and maximum duty factor The minimum duty factor of the switched mode power supply is 0%. The maximum duty factor is set to 75% (typical value at 100 kHz oscillation frequency). Overcurrent protection The cycle-by-cycle peak drain current limit circuit uses the external source resistor to measure the current. The circuit is activated after the leading edge blanking time tleb. The protection circuit limits the source voltage to VSRC(max), and thus limits the primary peak current. Short circuit winding protection The short circuit winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short circuit winding protection voltage Vswp, the IC stops switching. Only a Power-on reset will restart normal operation. The short circuit winding protection also protects in case of a secondary diode short circuit. Overtemperature protection An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared. Overvoltage protection Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level. The current primary stroke is terminated immediately, and no new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into this pin must be limited.
TEA152x family
Output characteristics of complete powerplug OUTPUT POWER A wide range of output power levels can be handled by choosing the RDS(on) and package of the TEA152x family. Power levels up to 50 W can be realised. ACCURACY The accuracy of the complete converter, functioning as a voltage source with primary sensing, is approximately 8% (mainly dependent on the transformer coupling). The accuracy with secondary sensing is defined by the accuracy of the external components. For safety requirements in case of optocoupler feedback loss, the primary sensing remains active when an overvoltage circuit is connected. EFFICIENCY An efficiency of 75% at maximum output power can be achieved for a complete converter designed for universal mains. RIPPLE A minimum ripple is obtained in a system designed for a maximum duty factor of 50% under normal operating conditions, and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output current level and the value and ESR of the output capacitor. Input characteristics of complete powerplug INPUT VOLTAGE The input voltage range comprises the universal AC mains (80 to 276 V).
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Philips Semiconductors
Product specification
STARplugTM
TEA152x family
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to ground; positive currents flow into the device; pins VCC and RC are not allowed to be current driven, pins REG and AUX are not allowed to be voltage driven. SYMBOL Voltages VCC VRC Vsource Vdrain Currents IREG IAUX Isource regulation input current auxiliary winding input current source current of TEA1520 TEA1521 TEA1522 TEA1523 TEA1524 Idrain drain current of TEA1520 TEA1521 TEA1522 TEA1523 TEA1524 General Ptot total power dissipation TEA152xP TEA152xT TEA152xAJM Tstg Tamb Tj Vesd storage temperature ambient temperature junction temperature electrostatic discharge voltage human body model; note 1 machine model; note 2 Notes 1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. All pins are 2500 V maximum, except pin DRAIN, which is 1000 V maximum. 2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 series resistor. Tamb < 45 °C Tamb < 50 °C - - -55 -20 -20 - - 1.0 1.0 1.5 +150 +85 +145 2500 200 W W W °C °C °C V V -0.25 -0.5 -1 -2 -3 +0.25 A +0.5 +1 +2 +3 A A A A -0.25 -0.5 -1 -2 -3 +0.25 A +0.5 +1 +2 +3 A A A A - -10 6 +5 mA mA low supply voltage oscillator input voltage source of the DMOS power transistor voltage drain of the DMOS power transistor voltage continuous -0.4 -0.4 -0.4 -0.4 +40 +3 +5 +650 V V V V PARAMETER CONDITIONS MIN. MAX. UNIT
Tamb < 45 °C without heatsink -
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Philips Semiconductors
Product specification
STARplugTM
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TEA152xP TEA152xT TEA152xAJM Note PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 in free air in free air in free air
TEA152x family
VALUE 100 91 65
UNIT K/W K/W K/W
1. Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the printed-circuit board. See the TEA152x application notes for details. QUALITY SPECIFICATION In accordance with "SNW-FQ-611 part E". CHARACTERISTICS Tamb = 25 °C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. SYMBOL Supply ICC(operate) ICC(startup) Idrain ICC(ch) VCC(start) VCC(stop) supply current start-up supply current supply current drawn from DRAIN pin VCC pin charging current VCC start voltage VCC stop voltage (under voltage lock-out) normal operation start-up no auxiliary supply; Vdrain > 60 V with auxiliary supply; Vdrain > 60 V Vdrain > 60 V - - - - -6 9 7.0 1.3 180 1.5 30 -4 9.5 7.5 1.9 400 2 125 -3 10 8.0 mA µA mA µA mA V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pulse width modulator min max SOPS Vdemag tsuppr demagnetization recognition voltage level suppression of transformer ringing at start of secondary stroke 50 1.0 100 1.5 150 2.0 mV µs minimum duty factor maximum duty factor f = 100 kHz - - 0 75 - - % %
RC oscillator VRC(min) VRC(max) tRC(ch) fosc minimum voltage of RC oscillator setting maximum voltage of RC oscillator setting RC charging time frequency range of oscillator 60 2.4 - 10 75 2.5 1 100 90 2.6 - 200 mV V µs kHz
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Philips Semiconductors
Product specification
STARplugTM
TEA152x family
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Duty factor regulator (pin REG) VREG GV(erroramp) VREG(clamp) dV/dtvalley fvalley input voltage voltage gain of error amplifier clamping voltage at pin REG IREG = 6 mA 2.4 - - -102 N × Vo = 100 V 200 - 2.5 20 - - 550 150 2.6 - 7.5 V dB V
Valley switching (not implemented in TEA152xAJM versions) dV/dt for valley recognition ringing frequency for valley switching 102 800 - V/µs kHz ns
td(valley-swon) delay from valley recognition to switch-on Current and short circuit winding protection Vsource(max) maximum source voltage dV/dt = 0.1 V/µs dV/dt = 0.5 V/µs dV/dt = 0.5 V/µs
0.47 - 0.7 250
0.50 160 0.75 350
0.53 185 0.8 450
V ns V ns
td(propagation) delay from detecting VSRC(max) to switch-off Vswp tleb short circuit winding protection voltage blanking time for current and short circuit winding protection
Output stage (FET) IL(drain) V(BR)drain RDS(on) drain leakage current drain breakdown voltage drain-source on-state resistance of TEA1520 drain-source on-state resistance of TEA1521 drain-source on-state resistance of TEA1522 drain-source on-state resistance of TEA1523 drain-source on-state resistance of TEA1524 tdrain(f) drain fall time Vdrain = 650 V Tj > 0 °C Tj = 25 °C; Isource = -0.06 A Tj = 100 °C; Isource = -0.06 A Tj = 25 °C; Isource = -0.125 A Tj = 100 °C; Isource = -0.125 A Tj = 25 °C; Isource = -0.25 A Tj = 100 °C; Isource = -0.25 A Tj = 25 °C; Isource = -0.5 A Tj = 100 °C; Isource = -0.5 A Tj = 25 °C; Isource = -1.0 A Tj = 100 °C; Isource = -1.0 A Vi = 300 V; no external capacitor at drain - 650 - - - - - - - - - - - - - 48 68 24 34 12 17 6.5 9.0 3.4 4.8 75 125 - 55.2 78.2 27.6 39.1 13.8 19.6 7.5 10.0 3.9 5.5 - µA V ns
Temperature protection Tprot(max) Tprot(hys) maximum temperature threshold hysteresis temperature 150 - 160 2 170 - °C °C
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Philips Semiconductors
Product specification
STARplugTM
APPLICATION INFORMATION
TEA152x family
handbook, full pagewidth
LF Z1 CF1 CF2 D1
D5 C5 Vo
mains R1 R2 D2
CVCC
VCC GND
1 2 TEA152xP 3 4
8 7 6 5
DRAIN n.c. SOURCE AUX RI RAUX
C6 - Ycap
RRC RC R4 CRC R3 REG
MGT425
Fig.7 Primary sensed application; configuration for TEA152xP.
Further application information can be found in the TEA152x application notes.
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Philips Semiconductors
Product specification
STARplugTM
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TEA152x family
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 w M (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 EIAJ SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 95-02-04 99-12-27
2000 Sep 08
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Philips Semiconductors
Product specification
STARplugTM
TEA152x family
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE v M A
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 w M L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Sep 08
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Philips Semiconductors
Product specification
STARplugTM
TEA152x family
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave x Eh
q1
Dh D D1 P k view B: mounting base side A2 q2
E
B
q
L2 L
L3
L1
1 Z e DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh e e1
9 w M 0 5 scale e1 e2 k L L1 L2 L3 4.5 3.7 m 2.8 P Q q q1 q2 v 0.8 w x Z(1) 1.65 1.10 10 mm Q m e2 c v M
bp
2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8
6.2 14.7 3.0 12.4 11.4 6.7 3.5 3.5 2.54 1.27 5.08 5.8 14.3 2.0 11.0 10.0 5.5
3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6
0.3 0.02
Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION SOT523-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 98-11-12 00-07-03
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Philips Semiconductors
Product specification
STARplugTM
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TEA152x family
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: · Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. · For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. · For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 16
2000 Sep 08
Philips Semiconductors
Product specification
STARplugTM
Suitability of IC packages for wave, reflow and dipping soldering methods
TEA152x family
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
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Philips Semiconductors
Product specification
STARplugTM
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TEA152x family
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Sep 08
18
Philips Semiconductors
Product specification
STARplugTM
NOTES
TEA152x family
2000 Sep 08
19
Philips Semiconductors a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 © Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
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Printed in The Netherlands
613502/01/pp20
Date of release: 2000
Sep 08
Document order number:
9397 750 07242
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