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2. ESD PRECAUTIONS
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
(1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
(2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
(4) Use only an anti-static solder removal device. Some solder removal devices not classified as