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Figure 1. Audio Block diagram
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The audio relevant supply voltages are shown in the following table:
7DEOH Supply Voltages
Line Symbol Vana Minimum TYP. / Nominal 2.78 Maximum Unit Notes
2.7 0,005
2.86 80
V mA V
(Mic bias buffer) Min. due to regulator stability (Buzzer and Vibra driver). Min and max due to SW cut off. (DLR3, HEADINT and HOOKINT pull up) Min. due to regulator stability Sleep (DLR3) Min. due to regulator stability (HOOKINT level shifter)
VBAT
3.1 (SW) (2.9 (HW)) 2.7
3.6
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UEM Pins Input / Output MIC1 MIC2 MIC3* HF (single ended) EAR Programmable 0 to 22.5, step 1.5dB 0 to 22.5, step 1.5dB 0 to 22.5, step 1.5dB -30 to 0, step 2dB -30 to 0, step 2dB Gain (dB) Fixed UEM 20 0 or 20 0 or 20 6 6 Total 20 to 42.5, step 1.5dB 0 to 22.5 or 20 to 42.5, step 1.5dB 0 to 22.5 or 20 to 42.5, step 1.5dB -24 to 6, step 2dB -24 to 6, step 2dB
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Gain Table UEM Signals INPUTS MIC1 MIC2 MIC3 OUTPUTS EAR HF -24 to 6, step 2dB -24 to 6, step 2dB -24 to 6, step 2dB Normal Mode Handportable Gain dB Headset Handsfree (Carkit)
20 to 42.5, step 1.5dB 20 to 42.5 step 1.5dB 0 to 22,5 step 1.5dB
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Front Holes on A-Cover
Leakage Holes on A_Cover Shielding material glued to A cover or IMD Window
Earpiece Front Volume
Leakage Between A_ and B_Covers (Not well defined)
Leakage Holes on PCB
Back Volume
Leakage Holes on PCB
Opening Between Earpiece and PCB
Figure 2. Sketch of Earpiece Acoustic Design
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Figure 3. Mechanical assembly of Earpiece and Vibra
Specified frequency response curve for the NPL-1 design (mechanics and Audio):
30 20 10 0 -10 -20 -30 100 1000 10000
SPL Response [dBPa]
Frequency [Hz]
Typical Response Upper Limit Lower limit
Figure 4. Earpiece frequency response - ERP corrected non DSP corrected
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Absolute Sensitivity (Low leak): 26 dBPa/V ±3dB @ 1kHz. (0 dB on Figure 4. Earpiece frequency response - ERP corrected non DSP corrected)
Figure 5. DAI receiving frequency response, B4.0
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Parameter Output swing @ 0dBm0, GR=-6 dB Output voltage swing VASwing With 60 dB signal to total distortion ratio PDM data with 50 % pulse ratio in the DAC input EARP to EARN EARP to EARN EARP to GND -50 VCMEAR 1.3 1.35 26 32 200 50 1.42 Test condition Min 2.36 Typ 2.5 Max Units Vpp Vpp 1.0 nF pF mV V
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Output resistance
Load capacitance Load resistance Load capacitance Differential offset voltage Common voltage level for EAR output (EARP & EARN)
50
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Systemconector sound outlet
Mic
Rubber Gasket Volume
System connector
Connection springs
Figure 7. Microphone Acoustical Design
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Figure 8. DAI Sending frequency response, B4.0
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Figure 9. Internal Microphone Electrical Interface
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Parameter Microphone amplifier input resistor Differential input voltage range for MIC1 input, G =20 dB Receive Common mode input voltage range for MIC input Common mode voltage level Differential mode voltage range for microphone amplifier, at gain = 20dB Differential load resistance for the microphone input stage Transmit gain absolute accuracy Transmit gain variation with programmed gain, temperature and supply Common mode rejection ratio Symbol RM30 VIN1 VHFCM VCM VOUT ROS GXA GXAGT V CMRR 30 1.3 Min 30 Typ 50 200
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Parameter Output switch resistance Rbuzzo Output peak sink current Iout Output peak sink voltage Uout Output pwm duty cycle Pdcyc Buzzer coil resistance Rload Battery voltage VBAT Ni or Li battery 13 3.03 16 3.6 VBAT VBAT Variable Min 1.0 120 Typ 2.7 180 0.5 Max 4.5 350 1.2 50 19 5.2 (Ni) 4.2 (Li) 0.35 0.48 2500 7751 Unit Ohm mA V % Ohm V
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Parameter Output swhich resistance Rvibra Output average current Ivibra Output peak current Ipeak Output frequency Fvibra Output duty cycle Dvibra Reverse diode peak current Iforw Motor average dc Udc_motor Output current high imp Ihiz tp = 10 us VBAT=3.0 ... 4.5 V V_ANA, VBAT 1.0 -1 1.5 VBAT VBAT 64 2.9 129 47 Variable Min 1.4 50 Typ 4.2 80 Max 7.5 135 300 520 96.9 0.30 2.3 1 Unit Ohm mA mA Hz % A Vdc uA
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Object Receiver input impedance Maximum Sound pressure level Transmitter output impedance Transmitter sensitivity XMIC bias voltage XMIC bias current Specification 150 Ohm +/- 25 % 106 dB SPL 2200 Ohm +/- 30 % - 43.5 dBV/Pa +/- 3 dB 1.5 V 1.5 mA Notes @ 390 mV at 1 kHz at 1 mW at 1 kHz at 1 kHz Typical Maximum
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Object Receiver input impedance Transmitter output impedance XMIC bias voltage XMIC bias current Specification 100k Ohm +/- 5 % 1600 Ohm +/- 30 % 1.3 V 400 uA Notes Magnetic loop at 1 kHz Maximum Maximum
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Parameter Microphone amplifier gain for MIC 2 / Handsfree Microphone amplifier gain for MIC 2 / Headset Microphone amplifier input resistor Differential input voltage range for MIC2 input, G =20 dB Differential input voltage range for MIC2 input, G =0 dB Receive Common mode input voltage range for MIC input Common mode voltage level Differential mode voltage range for microphone amplifier, gain 20 dB Differential load resistance for the microphone input stage Transmit gain absolute accuracy Transmit gain variation with programmed gain, temperature and supply Common mode rejection ratio VINCMR VCM VOUT RGS GXA GXAGTV 30 1.3 100 m VPP 1.4 V m VPP 450 kOhm VIN2 2.0 VPP Symbol MicG2 MicG2 RMIC VIN2 Min 0 22.5 30 50 200 Typ Max 22,5 42,5 Unit dB dB kOhm m VPP
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Parameter Output voltage swing single ended mode Output voltage swing fully differential mode Output resistance to 4 kHz) (0 Hz Test condition with 60 dB signal to total distortion ratio with 60 dB signal to total distortion ratio PDM Data with 50 % pulse ratio in the DAC input HF to HFCM (with external audio circuitry) HF to HFCM or VSA (with headset) 30 Min 1.0 Typ Max Unit VPP VPP 1 Ohm
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Test condition
Min -50
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Max 2.2 1
Unit k Vpp V V µA Vpp
Notes Input AC impedance Maximum signal level Mute (output DC level) Unmute (output DC level) Bias current from UEM Microphone signal (Gain 0 dB) Connected to UEM MIC3P + MIC2P input Resistance to phone ground, return path for XMIC. When the DLR-3 datacable is connected, SGND swhiches to be a supply line for the cable (2.8V) Output AC impedance (ref. LGND) Series output capacitance Load AC impedance to GND (Headset) pin #14 Load AC impedance to GND (Accessory) pin #14 Maximum output level (no load) Load DC resistance to GND (Accessory) pin #14 Load DC resistance to GND (Headset) pin #14 DC voltage (47k pull-up to Vflash1) Earphone signal Connected to UEM HF output Serial bi-directional control bus. Baud rate 9600 Bit/s Phone has 4.7k pull up resistor in UEM Fbus receive. Serial Data Baud rate 9.6k-230.4kBit/s Phone has 220k pull down resistor Fbus transmit. Serial Data Baud rate 9.6k-230.4kBit/s Phone has 47k pull up resistor in UEM Supply ground
0 2.5 100
1.55 2.9 600 2
9
SGND
330
10
XEAR
47 10 16 4.7 10 1.0 6.8 16 2.78 2.8 14 1500 2.86 220 300
µF
k Vpp k
V mV
HEAR
0
11
MBUS
0 2.0
0.8 2.8 0.8 2.8 0.8 2.8 0
V
12
FBUS_R X FBUS_TX
0 2.0 0.1 1.7
V
13
V
14
L-GND
0
V
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26 dB
Control circuit
Audio Interface HFM-8
30 dB
System connector
MBUS
MBUS
UEM
External audio sheet
MCC-1
System connector MBUS EMI Filter MBUS
Figure 18. Carkit audio interface. Block diagram.
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