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COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : CA-136
MODEL: T730BH(K) (T730BHKL-K***E*)
T730SH(K) (T730SHKL-K***E*)
( ) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
*Same looking with new chassis.
CONTENTS
SPECIFICATIONS ................................................... 2 DESCRIPTION OF BLOCK DIAGRAM................... 11
SAFETY PRECAUTIONS ........................................ 3 ADJUSTMENT ....................................................... 13
SERVICE PRECAUTION.......................................... 4 TROUBLESHOOTING GUIDE .............................. 19
TIMING CHART ....................................................... 7 EXPLODED VIEW................................................... 35
WIRING DIAGRAM ................................................. 9 REPLACEMENT PARTS LIST ............................... 37
DISASSEMBLY ....................................................... 8 SCHEMATIC DIAGRAM ......................................... 47
BLOCK DIAGRAM ................................................... 10 PRINTED CIRCUIT BOARD................................... 49
SPECIFICATIONS
1. PICTURE TUBE 3-2. Power Consumption
Size : 17 inch
MODE POWER CONSUMPTION LED COLOR
DefIection Angle : 90¡
Neck Diameter : 29.1 mm NORMAL (ON) less than 68 W BLUE
Stripe Pitch : 0.25 mm DPMS OFF less than 4 W FLASH
Face Treatment : W-ARASC (Anti-Reflection and POWER OFF less than 2 W OFF
Anti-Static Coating)
Internal : Anti-Glare
4. DISPLAY AREA
2. SIGNAL 4-1. Active Video Area :
2-1. Horizontal & Vertical Sync ¥ Max Image Size - 325.1 x 243.8 mm (12.80" x 9.60")
1) Input Voltage Level : Low=0~1.2V, High=2.5~5.5V ¥ Preset Image Size - 310 x 230 mm (12.20" x 9.06")
2) Sync Polarity : Positive or Negative 4-2. Display Color : Full Colors
4-3. Display Resolution : 1280 x 1024 / 60Hz(Max)
2-2. Video Input Signal (Non-Interlace)
1) Voltage Level : 0 ~ 0.7 Vp-p 4-4. Video Bandwidth : 110 MHz
a) Color 0, 0 : 0 Vp-p
b) Color 7, 0 : 0.467 Vp-p 5. ENVIRONMENT
c) Color 15, 0 : 0.7 Vp-p 5-1. Operating Temperature: 0¡C ~ 40¡C
2) Input Impedance : 75 (Ambient)
3) Video Color : R, G, B Analog 5-2. Relative Humidity : 10%~ 80%
4) Signal Format : Refer to the Timing Chart (Non-condensing)
5-3. Altitude : 5,000 m
2-3. Signal Connector
3 row 15-pin Connector (Attached) 6. DIMENSIONS (with TILT/SWIVEL)
Width : 400 mm (15.75 inch)
2-4. Scanning Frequency Depth : 411 mm (16.18 inch)
Horizontal : 30 ~ 71 kHz Height : 401 mm (15.79 inch)
Vertical : 50 ~ 160 Hz
7. WEIGHT (with TILT/SWIVEL)
Net Weight : 15.0 kg (33.52 lbs.)
3. POWER SUPPLY Gross Weight : 18.1 kg (39.67 lbs.)
3-1. Power Range
AC 100 - 240V~ 50 / 60Hz, 1.0A
-2-
SAFETY PRECAUTIONS
SAFETY-RELATED COMPONENT WARNING! X-RADIATION
There are special components used in this color monitor The only potential source of X-radiation is the picture tube.
which are important for safety. These parts are marked However, when the high voltage circuitry is operating
on the schematic diagram and the replacement properly there is no possibility of an X-radiation problem.
parts list. It is essential that these critical parts should be The basic precaution which must be exercised is keep the
replaced with the manufacturer's specified parts to prevent high voltage at the factory recommended level; the normal
X-radiation, shock, fire, or other hazards. Do not modify high voltage is about 25.8kV. The following steps describe
the original design without obtaining written permission how to measure the high voltage and how to prevent X-
from manufacturer or you will void the original parts and radiation.
labor guarantee.
Note : It is important to use an accurate high voltage
CAUTION: No modification of any circuit should be meter calibrated periodically.
attempted.
Service work should be performed only after · To measure the high voltage, use a high impedance
you are thoroughly familiar with all of the high voltage meter, connect () to chassis and (+) to
following safety checks and servicing the CDT anode cap.
guidelines. · Set the brightness control to maximum point at full
white pattern.
SAFETY CHECK · Measure the high voltage. The high voltage meter
Care should be taken while servicing this color monitor should be indicated at the factory recommended level.
because of the high voltage used in the deflection circuits. · If the meter indication exceeds the maximum level,
These voltages are exposed in such areas as the immediate service is required to prevent the possibility
associated flyback and yoke circuits. of premature component failure.
· To prevent X-radiation possibility, it is essential to use
FIRE & SHOCK HAZARD the specified picture tube.
An isolation transformer must be inserted between the
color monitor and AC power line before servicing the
chassis.
· In servicing, attention must be paid to the original lead CAUTION:
dress specially in the high voltage circuit. If a short Please use only a plastic screwdriver to protect yourself
circuit is found, replace all parts which have been
from shock hazard during service operation.
overheated as a result of the short circuit.
· All the protective devices must be reinstalled per the
original design.
· Soldering must be inspected for the cold solder joints, Leakage Current Hot Check Circuit
frayed leads, damaged insulation, solder splashes, or
the sharp points. Be sure to remove all foreign AC Volt-meter
materials.
IMPLOSION PROTECTION
All used display tubes are equipped with an integral
Good Earth Ground
implosion protection system, but care should be taken to
such as WATER PIPE,
avoid damage and scratching during installation. Use only CONDUIT etc.
To Instrument's
same type display tubes. exposed
METALLIC PARTS
1.5 Kohm/10W
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
-4-
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500 F to 600 F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500 F to 600 F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500 F to 600 F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
-5-
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
-6-
TIMING CHART
Video
B
C
Sync
D E F
A
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
H/V Sync Active Time Video Time Blanking Time Front Porch Sync Time Back Porch
Mode Frequency (A) (B) (C) (D) (E) (F) Resolution
Sort Polarity
H - 37.50 26.67 20.32 6.35 0.51 2.03 3.81
1 640x480
V - 74.99 13.335 12.802 0.533 0.026 0.08 0.427
H + 46.88 21.33 16.16 5.17 0.32 1.62 3.223
2 800x600
V + 75.01 13.331 12.798 0.533 0.021 0.064 0.448
H + 53.68 18.63 14.22 4.41 0.57 1.14 2.70
3 800x600
V + 85.07 11.755 11.178 0.577 0.018 0.056 0.503
H + 68.677 14.561 10.836 3.725 0.508 1.016 2.201
4 1024x768
V + 85.00 11.764 11.182 0.582 0.014 0.044 0.524
H + 60.289 16.587 12.518 4.068 0.782 1.252 2.034
5 1280x768
V + 74.893 13.352 12.739 0.641 0.050 0.116 0.448
* No Composite Mode.
-7-
DIS A S S E MB LY
1. T IL T /S WIV E L & B A C K C OV E R R E MOV A L
1) S et the monitor face downward.
2) C arefully remove the T ilt/S wivel by pulling it upward.
3) Remove the screw (b), B ack cover by pus hing it upward.
4) R eleas e the latch (c). (S ee T ip S pec.)
5) S lide the B ack C over away from the F ront C abinet of the monitor.
(b)
B ac
k Co
v er
(c)
Ca
bin
et
(a)
T ip S pec .
A(Width) : 5.0~15.0mm
C
B (Depth) : 0.6~0.9mm
Tip
C (Height) : 12.0mm A
B
-8-
WIRING DIAGRAM
P220
P203
P201 P202
P405
P501
P904 P701
P702
S+ S
FBT
P402
T1
AC
Socket P902
Signal
Cable
P302 P301
G2
- 9-
5V 8V 80V H.V
BRIGHTNESS
Heater ( 6.3V )
CONTR AST
H-Sync Video
MOIRE R
Signal VIDEO
DEG AUSSING V-Sync G VIDEO
H / V POSITION Pre- AMP / DY CDT
I 2C DATA(SD A) B Main AMP
H / V SIZE OSD
(IC303)
SPCC I2C CLOCK(SCL) (IC302)
TR APEZOID
G2 G1
PIN BAL ANCE
P AR ALLELOGR AM
Screen
SCL / SDA 80V CUT OFF Circuit
ROTATION (Tilt)
(IC304)
RECALL / RESET H-Sync/V-Sync
COLOR PWM Control Signal R/G/B
INFORMATION
Bias
LANGU AGE
Static Focus
OSD TIME
Dynamic Focus
TOP/BOTTO M CORNER MICOM & H/V Sync Processor
VIDEO LEVEL ( IC401 )
OSD CONTROL LOCK S AA4849 X-R AY
Protection
[ OSD Control ] Circuit Brightness Control
13V
5V
13V - 160V
I 2C V-Out 40V
-10-
E2PROM
( IC601)
6.3V (IC402)
TD A486 7J
TILT 13V FBT
TILT
Coil Control
Circuit ( T701 )
H-Out
BLOCK DIAGRAM
( Q706)
H - Drive B+
Degaussing
Circuit 13V
13V 80V
H-Linearity
Correction
50V
Degaussing Dynamic Auto
Coil SMPS FOCUS Beam
(T901) 13V DC/DC Converter 5V Circuit Limit
B-Drive
Line 50V
Filter 6.3V
D/D
5V Feed Back
Voltage
feedback
Power Input Regulation
SMPS DPM
100~240 V AC Circuit
Control Control
(50/60Hz) (IC901) Circuit
DESCRIPTION OF BLOCK DIAGRAM
1. SMPS(Switching Mode Power Supply) 6. X-RAY Protection Circuit
When you turn on the power switch, the operating When the high Voltage reaches to 29kV in an abnormal case,
fprocedure is as follows: the high voltage detector circuit, R818,D721,C739-1 R416,
1) The AC line voltage is rectified by the bridge diode C409 start operation to shut down high voltage circuit.
D900.
2) The control IC(IC901) starts switching and generates 7. Horizontal S-correction Circuit.
switch pulse in the primary turn of the SMPS This circuit corrects the horizontal linearity for each horizontal
transformer(T901) sync frequency.
3) The switching pulses of the primary turns are induced
8. Horizontal drive and Output Circuit.
to the secondary turns of the transformer by the turn
This circuit is a horizontal deflection amplifier for raster scan.
ratio. This pulses are rectified by each diode(D971,
D961(D962),D951,D942,D941)
4) Each rectified DC voltage(80V, 50V, 15V,6.3V and 5V) 9. ABL Circuit
This circuit limits the beam-current for the reliability of CDT
2. Over Voltage Protection Circuit
When the input of IC901 Vin (pin 4) is more than 22V, all the 10. Vertical Output Circuit
secondary voltages of the SMPS transformer (T901) down This circuit takes the vertical ramp wave from the TDA4867J
to low value (IC601) and perform the vertical deflection by supplying the
saw-tooth wave current to the vertical deflection yoke.
3. Display Power Management Circuit(DPM)
1) DPM OFF 11. Blanking and Brightness Control Circuit.
When no input of horizontal or vertical sync Q951, Blanking circuit eliminates the retrace line by supplying
Q941 are turned off .Then input power consumption a negative pulse wave to the G1 of the CDT.
is below 4 watts. Brightness control circuit is used for control of the screen
.
brightness by changing the DC level G1.
4. Microprocessor Control & Horizontal and Vertical Sync
Processor Circuit
The operating procedure is as follows ; 12. Image Rotation (Tilt) Circuit.
This circuit corrects the tilt of the screen by supplying
1) There is Horizontal & Vertical process function in
the image rotation signal to the tilt coil which is
Microprocessor.(IC401) attached near the deflection yoke of the CDT.
2) Microprocessor (IC401) discriminates the operating mode
from the sync polarity and resolution.
3) After microprocessor reads these adjusted mode data 13. OSD (On Screen Display) Circuit.
This circuit displays information of the monitor`s status
stored at EEPROM, it controls operating mode data through
on the screen.
IIC
4) Users can control screen condition by the OSD Select,Up, 14. Video Processor Circuit.
Down, Left, Right, Exit. Video processor circuit consists of the video drive output
block. The video drive IC(IC302) receives the video
5. D/D Converte r Circuit. signal from PC. The gain of each channel is controlled
by MICOM through IIC.
To obtain constant high voltage, this circuit supplies
The cut-off circuit compensate different voltage of each
controlled DC voltage for FBT and horizontal deflection channel between the cathode and the G1 of the CDT.
circuit according to the horizontal sync frequency.
- 11
-
15. Video Pre-Amp Circuit. 16. Video Output Amp Circuit.
This circuit amplifies the analog video signal from 0~0.7 V This circuit amplifies the video signal which comes from the
to 0~4 V. It is operated by taking the clamp, R,G,B drive video pre-amp circuit and amplified it to applied the CDT
and contrast signal from the MICOM (IC401) cathode
- 12 -
ADJUSTMENT
1. Preparation for Service Adjustment 2. Adjustment by Service Hot key
GENERAL INFORMATION How to enter SVC HOT KEY
1. Press Menu and OSD window will appear.
All adjustment are thoroughly checked and corrected 2. While OSD window is displayed, is seen on the
when the monitor leaves the factory, but sometimes left bottom of OSD window.
several adjustments may be required. 3. Press + power switch simultaneously and the
Adjustment should be following procedure and after screen will immediately refresh.
warming up for a minimum of 30 minutes. 4. Press Menu and make sure that is changed to
1 2.
· Alignment appliances and tools. 5. Follow the menu on the left of OSD window to find 12
- IBM compatible PC. and OSD will change as shown in the figure.
- Programmable Signal Generator. 6. Select Degauss in the above figure and then press
(eg. VG-819 made by Astrodesign Co.) Select and to enter the screen of the SUB menu.
- EPROM or EEPROM with saved each mode data. (Back Raster for Pattern)
- Alignment Adaptor and Software.
- Digital Voltmeter. FOS SPEC
- White Balance Meter.
- Luminance Meter. 1. Size
- High-voltage Meter. H : 310 4mm
V : 230 4mm
AUTOMATIC AND MANUAL DEGAUSSING Scanning frequency : All Mode (Mode 1~4)
The degaussing coil is mounted around the CDT so that Display image : Cross hatch pattern
automatic degaussing when turn on the monitor. But a
monitor is moved or faced in a different direction, become 2. Centering
Scanning frequency : All Mode (Mode 1~4)
poor color purity cause of CDT magnetized, then press
Display image : Crosshatch pattern
DEGAUSSING on the OSD menu.
Horizontal : 10 Row
Vertical : 8 Row
ADJUSTMENT PROCEDURE & METHOD U
- Install the cable for adjustment such as Figure 1and run
the alignment program on the DOS for IBM L R
compatible PC.
- Set external Brightness and Contrast volume to max D
position.
1. Adjustment for B+ Voltage. H: L-R 4mm, V : U-D 4mm
1) Display cross hatch pattern at Mode 4. 3. Tilt
2) Check D961 cathode voltage within 50V ± 1V . Scanning frequency : All Mode (Mode 1~4)
Display image : Crosshatch pattern
2. Adjustment for High-Voltage. Horizontal : 10 Row
1) Display cross hatch pattern at Mode 4. Vertical : 8 Row
2) Enter the SVC SUB menu as the following instruction.
3) Adjust H/Voltage to 25.8kV¡À0.1 kV by adjust 1-P value.
E F
Tilt : E-F 2.0mm
- 13 -
4. Distortion 10. Parallelogram
Scanning frequency : All Mode (Mode 1~4)
Display image : Crosshatch pattern
Horizontal : 10 Row
Vertical : 8 Row
A B
4mm
E G
11. Adjustment of white balance (Adjustment of
F H chromaticity diagram)
C D *(Adjustment of white balance must be made after
entering Hot Key Mode and DEGAUSS.)
A-B 2.0mm, C-D 2.0mm
CONDITIONS
E-F 2.0mm, G-H 2.0mm
Signal: 69 kHz / 85 Hz
Display image: Back raster (Color 0,0)
5. Displa Size drift Contrast: Maximum
4mm : 25 Standard, 10 35 Brightness: Maximum
0.5mm : 180V ~ 264V Color temperature: 9300K
6. Linearity 11-1. Adjustment of cut off (Adjustment of back raster)
Y1 11-1(a). Before adjustment, press Menu and Degauss
Y2 to remove.
=> Enter hot key mode.
Y3 Adjust Brightness and Contrast to Max in OSD
Y4 window.
X1 X2 X3 X4
(1) Adjust cut off (back raster) first. Enter DEGAUSS in
the Menu and modify the following data.
Formula : (Max - Min) / Max x 100(%) Modify RCUT to Min ,
Criteria : H - 10% Max. (Upper 40kHz) Modify GCUT To Min ,
14% Max. (Less 40kHz) Adjust to BCUT Data = 127 (7F (h)) ,
V - 8% Max. Adjust to SBRT Data = 205 ( CD (h)).
(2) Turn FBT screen volume on "CRT COLOR
7. Regulation ANALYZER CA-100" equipment to adjust
Luminance 2mm Brightness to 0.4 0.05FL.
Dynamic(lode) 2mm (3) Adjust RCUT, GCUT, and SBRT to set chromaticity
Scanning frequency : All Mode (Mode 1~4) diagram at :
x: 0.283 0.005
8. Trapezoid
y: 0.298 0.005
U-D < 4mm Y: 0.40 0.05FL
U U
* If color values would not be matched desirable values,
repeat sequence 1 and 2 after readjusting "GREEN
CUTOFF" control a little different.
D D
9. Pin Balance
L1 R1 2.0mm
L1 R1
R1 L1
- 14 -
11-2. Adjustment of White Balance PROCEDURE
After finishing adjustment of cut off (back raster), For trained and experienced service technicians only.
approve "Color(15.0) Full white pattern". Use the following procedure to correct minor color
Adjust BDRV Data = 85 purity problems:
SCON=127.
Adjust RDRV and GDRV to set chromaticity diagram at : 1. Make sure the display is not affected by external
x: 0.283 0.005 magnetic fields.
y: 0.298 0.005
Approve "Window pattern (70x70mm)" to adjust 2. Very carefully break the glue seal between the 2-pole
S-CON to Y : 50 1FL. purity convergence magnets (PCM), the band and
Approve "Color (15.0) Full white pattern" again and the spacer.
adjust ABL Data to Y : 32 1FL
3. Make sure the spacing between the PCM assembly
12. Focus Adjustment and the CRT stem is 29 mm 1 mm.
CONDITIONS 4. Display a green pattern over the entire display area.
Scanning frequency : All Mode (Mode 1~4)
Display image: "H" character pattern 5. Adjust the purity magnet rings on the PCM assembly
Brightness: Cut off point to display a pure green pattern.
Contrast: Maximum (Optimum setting: x = 0.295 0.015,
y = 0.594 0.015)
PROCEDURE
1. Adjust the Focus VR on the FBT to display the 6. Repeat steps 4 and 5 using a red pattern and then
sharpest image possible. again, using a blue pattern.
2. Use Locktite to seal the Focus VR in position.
Table 4-6. Color Purity Tolerances
13. Color Purity Adjustment
Color purity is the absence of undesired color.
Red: x=0.620 0.015 y=0.334 0.015
Conspicuous mislanding (unexpected color in a uniform
field) within the display area shall not be visible at a Green: x=0.620 0.015 y=0.334 0.015
distance of 50 cm from the CRT surface.
Blue: x=0.620 0.015 y=0.334 0.015
CONDITIONS
Orientation: Monitor facing east (For 9300K color adjustment: x = 0.283 0.02,
Scanning Frequency: 1024 x 768@85Hz(69kHz/85Hz) y = 0.298 0.02)
Display image: White flat field
Luminance: Cut off point at the center of the 7. When you have the PCMs properly adjusted,
display area carefully glue them together to prevent their
movement during shipping.
Note : Color purity adjustments should only be
attempted by qualified personnel.
- 15 -
3. Adjustment Using Service software Program 2. Adjustment for White Balance and Luminance.
(Adjustment Program)
1) Set the White Balance Meter.
1. Adjustment for Factory Mode (Preset Mode). 2) Press the DEGAUSSING on the OSD menu for
demagnetization of the CDT.
1) Display cross hatch pattern at Mode All. 3) Display color 0,0 pattern at Mode 4.
2) Run alignment program for T730BHKL/T730SHKL 4) COMMAND PRESET START Y(Yes)
on the IBM compatible PC. command.
3) EEPROM ALL CLEAR Y(Yes) command. 5) Set Bightness and Contrast to max position.
Do not run this procedure unless the 6) COLOR ADJ. LUMINANCE command of the
EEPROM is changed. All data in EEPROM (mode alignment program.
data and color data) will be erased. 7) COLOR ADJ. BIAS ADJ. command of the
4) COMMAND PRESET START Y(Yes) alignment program.
command. 8) Check whether blue color or not at R-BIAS and G-
5) DIST. ADJ. FOS. ADJ command. BIAS to min position, Sub-Brightness to 205
6) Adjust H-POSITION as arrow keys to center of the (CD(h))position, B-Bias to 127(7F(h))position. If it's not
screen. blue color, the monitor must repair.
7) Adjust H-SIZE as arrow keys to 310 ± 2mm. 9) Adjust Screen control on the FBT to 0.4 ± 0.05FL
8) Adjust V-POSITION as arrow keys to center of the of the raster luminance.
screen. 10) Adjust R-BIAS and G-BIAS command to x=0.283 ±
9) Adjust V-SIZE as arrow keys to 230 ± 2mm. 0.006 and y=0.298 ± 0.006 on the White Balance
10) Adjust TRAPEZOID as arrow keys to be the best Meter with PC arrow keys.
condition. 11) Display color 15,0 Full White(70x70mm) at mode 4.
11) Adjust SIDE PINCUSHON as arrow keys to be the 12) DRIVE ADJ command.
best condition. 13) Set B-DRIVE to 85(55(h) at DRIVE of the alignment
12) Adjust TILT as arrow keys to be the best condition. program.
13) Display cross hatch pattern at Mode 4. 14) Adjust R-DRIVE and G-DRIVE command to white
14) DIST. ADJ. BALANCE DATA command. balance x=0.283 ± 0.003 and y=0.298 ± 0.003 on
15) Adjust balance of Pin-Balance as arrow keys to be the White Balance Meter with PC arrow keys.
the best condition. 15) Adjust SUB-CONTRAST command to 50±1FL of the
16) Adjust parallelogram as arrow keys to be the best raster luminance.
condition. 16) Display color 15,0 full white patten at Mode 4.
17) Save of the Mode. 17) COLOR ADJ. LUMINANCE ABL command.
18) Save of the System. 18) Adjust ABL to 32 ± 1FL of the luminance.
19) Display from Mode 4 and repeat above from number 19) Exit from the program.
6) to 16).
20) COMMAND PRESET EXIT Y (Yes) command.
- 16 -
4. EDID Data Edit Using Service software Program
4.1 Read and Modify EDID Data
1) Connector the monitor and adjust device as Figure1
2) Display color 15,0 cross hatch pattern at Mode 4.
3) Use EDIT MODEL SEL. command to select the right model info file.
4) Use EDIT EDID INFO command and return to read the EDID Data.
5) Modify the EDID Data if needed and using F10 to save the change and exit.
4.2 Write EDID Data.
1) Display color 15,0 cross hatch pattern at Mode 4.
2) Use EEPROM -- Write EDID command and confirm
"EDID Write OK!!" message of monitor.
3) Exit from the alignment program.
4) Power switch OFF/ON for EDID data save.
T730BHKL
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 | 00 FF FF FF FF FF FF 00 1E 6D C2 43 *01 *00 *00 *00
10 | **01 0E 01 03 18 21 18 B5 EA F6 29 A2 53 47 99 25
20 | 10 48 4C FF FE 80 31 59 71 4F 45 59 61 59 81 80
30 | 81 4A 01 01 01 01 EA 24 00 60 41 00 28 30 30 60
40 | 13 00 36 E6 10 00 00 1E 00 00 00 FD 00 32 A0 1E
50 | 47 0B 00 0A 20 20 20 20 20 20 00 00 00 FC 00 54
60 | 37 33 30 42 48 0A 20 20 20 20 20 20 00 00 00 FC
70 | 00 0A 20 20 20 20 20 20 20 20 20 20 20 20 00 ***
T730SHKL
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 | 00 FF FF FF FF FF FF 00 1E 6D CB 43 *01 *00 *00 *00
10 | **01 0E 01 03 18 21 18 B5 EA F6 29 A2 53 47 99 25
20 | 10 48 4C FF FE 80 31 59 71 4F 45 59 61 59 81 80
30 | 81 4A 01 01 01 01 EA 24 00 60 41 00 28 30 30 60
40 | 13 00 36 E6 10 00 00 1E 00 00 00 FD 00 32 A0 1E
50 | 47 0B 00 0A 20 20 20 20 20 20 00 00 00 FC 00 54
60 | 37 33 30 53 48 0A 20 20 20 20 20 20 00 00 00 FC
70 | 00 0A 20 20 20 20 20 20 20 20 20 20 20 20 00 ***
-1 7-
Figure 1. Cable Connection
A
VIDEO IBM
Compatible PC 9 6
SIGNAL 5 1
15 11
GENERATOR 10
- 18 -
6
5 1
C
d
se
PARALLEL PORT
tu
13 1
C
No
32
2
25
RS
14
OFF ON
L
5V
Control Line
LE
C
L
F
RA
PA
Power inlet (required)
220 5V
VG
Power Select Switch
ER
4.7K
S
(110V/220V)
W
PO
ON 5V 4.7K
A MO Power LED E
T
CS
NIT
74LS06
YN
OR