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Service Manual

Model #: VIZIO L42HDTV10A VIZIO GV42L HDTV
V, Inc 320A Kalmus Drive Costa Mesa, CA 92626 TEL : +714-668-0588 FAX :+714-668-9099

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Table of Contents
CONTENTS Sections 1. Features 2. Specifications 3. On Screen Display 4. Factory Preset Timings 5. Pin Assignment 6. Main Board I/O Connections 7. Theory of Circuit Operation 8. Waveforms 9. Trouble Shooting 10. Block Diagram 11. Spare parts list 12-1. Complete Parts List (L42 HDTV10A _LG) 12-2. Complete Parts List (GV42L HDTV_LG) 1-1 2-1 3-1 4-1 5-1 6-1 7-1 8-1 9-1 10-1 11-1 12-1 12-2 PAGE

Appendix 1. Main Board Circuit Diagram 2. Main Board PCB Layout 3. Assembly Explosion Drawing Block Diagram

VIZIO L42HDTV10A,GV42L HDTV Service Manual

VINC
COPYRIGHT © 2000 V, INC. ALL RIGHTS RESERVED.

Service Manual
VIZIO L42HDTV10A,GV42L HDTV

IBM and IBM products are registered trademarks of International Business Machines Corporation. Macintosh and Power Macintosh are registered trademarks of Apple Computer, Inc. VINC and VINC products are registered trademarks of V, Inc. VESA, EDID, DPMS and DDC are registered trademarks of Video Electronics Standards Association (VESA). Energy Star is a registered trademark of the US Environmental Protection Agency (EPA). No part of this document may be copied, reproduced or transmitted by any means for any purpose without prior written permission from VINC.

FCC INFORMATION This equipment has been tested and found to comply with the limits of a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that the interference will not occur in a particular installation. If this equipment does cause unacceptable interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures -- reorient or relocate the receiving antenna; increase the separation between equipment and receiver; or connect the into an outlet on a circuit different from that to which the receiver is connected. FCC WARNING To assure continued FCC compliance, the user must use a grounded power supply cord and the provided shielded video interface cable with bonded ferrite cores. Also, any unauthorized changes or modifications to Amtrak products will void the user's authority to operate this device. Thus VINC Will not be held responsible for the product and its safety. CE CERTIFICATION This device complies with the requirements of the EEC directive 89/336/EEC with regard to "Electromagnetic compatibility." SAFETY CAUTION Use a power cable that is properly grounded. Always use the AC cords as follows USA (UL); Canada (CSA); Germany (VDE); Switzerland (SEV); Britain (BASEC/BS); Japan (Electric Appliance Control Act); or an AC cord that meets the local safety standards.

VIZIO L42HDTV10A,GV42L HDTV Service Manual

Chapter 1
1. 2. 3. 4. 5.

Features

Built in TV channel selector for TV viewing. Simulatnueous display of PC and TV images. Connectable to PC's analog RGB port . Built in S-video, HDTV, composite video, HDMI and TV out. Built in auto adjust function for automatic adjument of screen display.

6. Smoothing function enables display of smooth texts and graphics even if image withresolution lower than 1366x768 is magnified. 7. 8. Picture In Picture (PIP) funtion to show TV or VCR images. Power saving to reduce consumption power too less than 3W.

9. On Screen Display: user can define display mode (i.e. color, brightness, contrast, sharpness, backlight), sound setting, PIP, TV channel program, aspect and gamma or reset all setting.

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Chapter 2

Specification

1. LCD CHARACTERISTICS Type: 42.0 WXGA TFT LCD Size: 42.02inch Display Size: 42.02 inches (1067.308mm) diagonal Outline Dimension: 1006 mm (H) x 610 mm (V) x 56 mm (D) (Typ.) Pixel Pitch: 0.227mm x 0.681mm x RGB Pixel Format: 1366 horiz. By 768 vert. Pixels RGB strip arrangement Contrast ratio: 1.CR : 550(Typ) 2. CR WITH AI : 1100(Typ) Luminance, White: 500 cd/m2 (Typ) Display Operating Mode: normally Black Surface Treatment: Hard Coating (3H) ,Anti-glare treatment of the front polarizer. 2. OPTICAL CHARACTERISTICS Viewing Angle (CR>10) Left: 89°typ. Right: 89°typ. Top: 89°typ. Bottom: 89°typ. 3. SIGNAL (Refer to the Timing Chart) Sync Signal 1) Type: TMDS 2) Input Voltage Level: 90~240 Vac, 50/ 60 Hz 4.Input Connectors RJ11, D-SUB15PIN (MINI, 3rows), Headphone, HDMIX2, RCAX3 (component), RCAX2 (AUDIO in), RCAX3 (composite), RCAX2 (AUDIO in), S-Video, Tuner 5. POWER SUPPLY Power Consumption: 280W MAX Power OFF: to less than 3W MAX

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6.Speaker Output 10W (max) X2 7. ENVIRONMENT 5-1. Operating Temperature: 5c~35c (Ambient) 5-2. Operating Humidity: Ta= 35 C, 90%RH (Non-condensing) 5-3. Operating Altitude: 0 - 14,000 feet (4267.2m)(Non-Operating) 8. DIMENSIONS (Physical dimension) Width: 1066 mm. Depth: 269.2mm Height: 765.4mm 9. WEIGHT (Physical weight) a. Net: 36.0+/-0.5kgs b. Gross: 43+/-0.5kgs 9-1. MOUNTING PRECAUTIONS (1) You must mount a module using holes arranged in four corners or four sides. (2) You should consider the mounting structure so that uneven force (ex. Twisted stress) is not applied to the module. And the case on which a module is mounted should have sufficient strength so that external force is not transmitted directly to the module. (3) Please attach the surface transparent protective plate to the surface in order to protect the polarizer. Transparent protective plate should have sufficient strength in order to the resist external force. (4) You should adopt radiation structure to satisfy the temperature specification. (5) Acetic acid type and chlorine type materials for the cover case are not desirable because the former generates corrosive gas of attacking the polarizer at high temperature and the latter causes circuit break by electro-chemical reaction.

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(6) Do not touch, push or rub the exposed polarizes with glass, tweezers or anything harder than HB pencil lead. And please do not rub with dust clothes with chemical treatment. Do not touch the surface of polarizer for bare hand or greasy cloth.(Some cosmetics are detrimental to the polarizer.) (7) When the surface becomes dusty, please wipe gently with absorbent cotton or other soft materials like chamois soaks with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach front / rear polarizers. Do not use acetone, toluene and alcohol because they cause chemical damage to the polarizer. (8) Wipe off saliva or water drops as soon as possible. Their long time contact with polarizer causes deformations and color fading. (9) Do not open the case because inside circuits do not have sufficient strength. 9-2. OPERATING PRECAUTIONS (1) The spike noise causes the mis-operation of circuits. It should be lower than following voltage : V= 200mV(Over and under shoot voltage) (2) Response time depends on the temperature. (In lower temperature, it becomes longer.) (3) Brightness depends on the temperature. (In lower temperature, it becomes lower.)And in lower temperature, response time (required time that brightness is stable after turned on) becomes longer. (4) Be careful for condensation at sudden temperature change. Condensation makes damage to polarizer or electrical contacted parts. And after fading condensation, smear or spot will occur. (5) When fixed patterns are displayed for a long time, remnant image is likely to occur. (6) Module has high frequency circuits. System manufacturers shall do sufficient suppression to the electromagnetic interference. Grounding and shielding methods may be important to minimize the interference.

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9-3. HANDLING PRECAUTIONS FOR PROTECTION (1) The protection film is attached to the bezel with a small masking tape. When the protection film is peeled off, static electricity is generated between the film and polarizer. This should be peeled off slowly and carefully by people who are electrically grounded and with well ion-blown equipment or in such a condition, etc. (2) When the module with protection film attached is stored for a long time, sometimes there remains a very small amount of glue still on the bezel after the protection film is peeled off. (3) You can remove the glue easily. When the glue remains on the bezel surface or its vestige is recognized, please wipe them off with absorbent cotton waste or other soft material like chamois soaked with normal-hexane.

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Chapter 3
Main unit button
Power MENU CH CH VOL + VOL Input

On Screen Display

TV Source
A. Picture Adjust a. Picture Mode (Standard/Movie /Game / Custom) b. Backlight (0~100) c. Contrast (0~100) d. Brightness (0~100) e. Color (saturation)(0~100) f. Tint (hue) (0~100) g. Sharpness (0~7) h. Color Temperature (Cool/Normal/Warm/Custom) i. Advanced Picture Adjust B. Audio Adjust a. Volume (0~100) b. Bass (0~100) c. Treble (0~100) d. Balance (0~100) e. Surround (ON/OFF) f. Speakers (ON/OFF)

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C. Special Features a. Language (English/Français/Espa ol) b. Sleep Timer (OFF/30Min/60Min/90Min/120Min) c. Analog CC (OFF/CC1~4/TT1~4) d. Digital CC (OFF/CC1~4/Service1~6) e. Digital CC Style f. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR) g. Rest All Setting D. TV Tuner Setup a. Tuner Mode (Cable/Air) b. Auto Search c. Skip Channel d. Digital Audio Out (PCM/Dolby Digital) e. Time Zone (Eastern/Indiana/Central/Mountain/Arizona/Pacific/Alaska/Hawaii) E. Parental Control a. Parental Lock Enable (ON/OFF) b. TV Rating c. Move Rating d. Block Unrated TV (NO/Yes) e. Access Code Edit

RGB Mode
A. Picture Adjust a. Auto Adjust b. Backlight (0~100) c. Contrast (0~100) d. Brightness (0~100) e. Color Temperature (9300/6300/Custom) f. Tint (0~100) g. H-Size (0~255) h. Horizontal Shift (0~63) i. Fine Tune (0~31)

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B. Audio Adjust a. Volume (0~100) b. Bass (0~100) c. Treble (0~100) d. Balance (0~100) e. Surround (ON/OFF) f. Speakers (ON/OFF)

C. Special Features a. Language (English/Français/Espa ol) b. Sleep Timer (OFF/30Min/60Min/90Min/120Min) c. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR) d. Rest All Setting

AV COMPONENT MODE
A. Picture Adjust a. Picture Mode (Standard/Movie /Game / Custom) b. Backlight (0~100) c. Contrast (0~100) d. Brightness (0~100) e. Color (saturation)(0~100) f. Tint (hue) (0~100) g. Sharpness (0~7) h. Color Temperature (Cool/Normal/Warm/Custom) i. Advanced Picture Adjust

B. Audio Adjust a. Volume (0~100) b. Bass (0~100) c. Treble (0~100) d. Balance (0~100) e. Surround (ON/OFF) f. Speakers (ON/OFF)

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C. Special Features a. Language (English/Français/Espa ol) b. Sleep Timer (OFF/30Min/60Min/90Min/120Min) c. Analog CC (OFF/CC1~4/TT1~4) d. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR) e. Rest All Setting

D. Parental Control a. Parental Lock Enable (ON/OFF) b. TV Rating c. Move Rating d. Block Unrated TV (NO/Yes) e. Access Code Edit

HDMI MODE
A. Picture Adjust a. Picture Mode (Standard/Movie /Game / Custom) b. Backlight (0~100) c. Contrast (0~100) d. Brightness (0~100) e. Color (saturation)(0~100) f. Tint (hue) (0~100) g. Sharpness (0~7) h. Color Temperature (Cool/Normal/Warm/Custom) i. Advanced Picture Adjust

B. Audio Adjust a. Volume (0~100) b. Bass (0~100) c. Treble (0~100) d. Balance (0~100) e. Surround (ON/OFF) f. Speakers (ON/OFF)

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C. Special Features a. Language (English/Français/Espa ol) b. Sleep Timer (OFF/30Min/60Min/90Min/120Min) c. PIP Position (TL/TC/TR/ML/MR/BL/BC/BR) d. Rest All Setting

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Chapter4

Factory preset timings

This timing chart is already preset for the TFT LCD analog & digital display monitors.
Refresh rate 60Hz 75Hz 60Hz 75Hz 85Hz 60Hz 75Hz 70Hz 60 P: positive Horizontal Frequency 31.5kHz 37.5kHz 37.9kHz 46.9kHz 53.7kHz 48.4kHz 60.0kHz 31.46kHz 47.7KHZ N: negative Vertical Frequency 59.94Hz 75.00Hz 60.317Hz 75.00Hz 85.06Hz 60.01Hz 75.03Hz 70.08Hz 60.00HZ Horizontal Polarity N N P P P N P N P Vertical Polarity N N P P P N P P N Pixel Rate 25.175 31.500 40.000 49.500 56.250 65.000 78.750 28.320 85.500

Resolution 640x480 640x480 800X600 800x600 800X600 1024x768 1024X768 720x400 1366X768 Remark:

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Chapter 5

Pin Assignment

The TFT LCD analog display monitors use a 15 Pin Mini D-Sub connector as video input source.

Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 Red Green Blue

Description

Ground Ground R-Ground G-Ground B-Ground +5V for DDC Ground No Connection (SDA) H-Sync (Composite Sync)

14 15

V-Sync (SCL)

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HDMI CONNECT PIN ASSIGNMENT
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 SIGNAL ASSIGNMENT TMDS Data2+ TMDS Data2 Shield TMDS Data2TMDS Data1+ TMDS Data1 Shield TMDS Data1TMDS Data0+ TMDS Data0 Shield TMDS Data0TMDS Clock+ TMDS Clock Shield TMDS ClockCEC Reserved (N.C on device) SCL SDA DDC/CEC Ground +5V Power Hot Plug Detect

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Four-Pin mini DIN S-Video Connector a. Pin Assignment

b. Signal Level Video (Y): Analog 0.1Vp-p/75 Video (C): Analog 0.286p-p/75 Sync (H+V): 0.3V below Video (Y) c. Frequency H: 15.734KHz V: 60Hz (NTSC) Signal Level Video (Y) : Analog 0.1Vp-p/75 Video (C) : Analog 0.286p-p/75 Sync (H+V): 0.3V below Video (Y) Frequency H: 15.734Khz V: 60HZ (NTSC)

F-Type TV RF connector
a. Signal Level 60dBV typical b. System NTSC c. Frequency 55~801MHz (NTSC)

PC connector 15 pin male D-sub connector
a. Pin Assignment Refer to Section 2.3.10 b. Signal Level Video (R, G, B): Analog 0.7Vp-p/75 Sync (H, V): TTL level

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RGB Signal:
a. Sync Type TTL (Separate / Composite) or Sync. On Green b. Sync polarity Positive or Negative c. Video Amplitude RGB: 0.7Vp-p d. Frequency H: support to 30K~70KHz V: support to 50~85Hz Pixel Clock: support to 110MHz

HDMI Signal (HDMI):
a. Pin Assignment Refer to HDNI Pin Assignment b. Type A c. Polarity Positive or Negative d. Frequency H: 15.734KHz V: 60Hz (NTSC-480i) H: 31KHz V: 60Hz (NTSC-480p) H: 45KHz V: 60Hz (NTSC-720p) H: 33KHz V: 60Hz (NTSC-1080i)

Component signal (Component 1 and Component 2) Component 1
a. Frequency H: 15.734KHz V: 60Hz (NTSC-480i) H: 31KHz V: 60Hz (NTSC-480p) H: 45KHz V: 60Hz (NTSC-720p) H: 33KHz V: 60Hz (NTSC-1080i) b. Signal level Y: 1Vp-p Pb: 0.350Vp-p Pr: 0.350Vp-p

c. Impedance 75

Component 2
a. Frequency H: 15.734KHz V: 60Hz (NTSC-480i) H: 31KHz V: 60Hz (NTSC-480p) H: 45KHz V: 60Hz (NTSC-720p) H: 33KHz V: 60Hz (NTSC-1080i) b. Signal level Y: 1Vp-p Pb: 0.350Vp-p Pr: 0.350Vp-p

c. Impedance 75
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Chapter 6

Main Board I/o Connections
BOTTOM)

J6 CONNECTION (TOP Pin 1 2 3 4 5 6 7 8

Description "+5V" "+3.3V" "ADCKEY" "LED" "PWR KEY" "GND" "GND" "IR"

J7 CONNECTION (TOP Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14

BOTTOM) Description "POWRSW" "+12V" "+12V" "+12V" "GND" "GND" "GND" "GND" "GND" "+5V" "+5V" +5V "PWM" "BL ON/OFF"

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Chapter 7

Theory of Circuit Operation

The operation of D-SUB 15pin route
The D-SUB 15pin is input analog signal to the MTK8202 transfer A/D converter then generates the vertical and horizontal timing signals for display device.

The operation of HDMII CON route
The HDMI 1&2 CON is input digital signal to the PI3HDMI412FT switch output signal is process to the MT8293. Then transfer to the MTK8202, the MTK8202 generates the vertical and horizontal timing signals for display device.

The operation of HDTV & Component route
HDTV & Component signal is input to the MTK8202 then MTK8202 generates the vertical and horizontal timing signals for display device.

The operation of Video 1,2,3 & S-Video route
The Video 1,2 and S-Video signal is transmission signal to the MTK8202 then MTK8202 generates the vertical and horizontal timing signals for display device.

The operation of TV route
TV signal is processes to the tuner and output to MTK8202 then MTK8202 generates the vertical and horizontal timing signals for display device. Audio is processes to the tuner output to SIF circuit and output to MTK8202.Then MTK8202 process to wm8776 and output to TDA8946J transfer to speaker

The operation of DTV route
DTV signal is processes to the tuner and transmission to MT5112 and output signal to MT5351 then MT5351 output to MT8202 generates the vertical and horizontal timing signals for display device.

The operation of keypad
There are 7 keys to control and select the function of L42 and also has one LED to indicate the status of operation. They are "Power, ,+ -, Input, OSD".

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MT8202 Application MT8202 is a highly integrated video and audio single chip processor for emerging HDTV-Ready LCD TV. It includes one 3D/2D TV Decoder recovering the best image from CVBS, and in addition, its analog input also support popular S-Video, Component, VGA video source. On-chip advanced motion adaptive de-interlacer (MDDitm) converts accordingly the interlace video into smooth non-flicking progressive motion pictures. With on-chip advanced 2D Graphic processor,MT8202 provides customers with high quality UI adding significant end product value. Flexible scalar provides wide adoption to various LCD panel for different video sources. Its on-chip audio processor decodes whole world standard audio signals from tuner with lip sync control, delivering high quality post-processed sound effect to customers. On-chip microprocessor and reference FW reduces the system BOM and shortens the schedule of UI design by high-level C program. With truly SOC design, MT8202 offers our customers the real cost-effective high performance HDTV-ready solution.
BOLOCK DIAGRAM

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1. Video input

a. Input Multiplexing
1.component X2 2.composite X2 3.s-videoX1 4.HDMI X2 5.VGA X1 6.RF&DTV X1

b. Input formats:
1.support HDTV 480i/480p/720p/1080p 2.support Y/C signal 1VP-P/75 3.support Y/C signal 1VP-P/75 4.support 480i/408p/720p/1080i/1080p 5.support VGA input up to 1366x168@60HZ 6.support RF NTSC system Frequency 55~801MHZ;DTV 480i/480p/720p/1080p 2. Decoder TVD 1.Single 2nd generation TV decoder 2.Automatic TV standard detection supporting NTSC, NTSC-4.43, PAL (B, G, D, H, M, N, I, Nc), PAL (Nc), PAL, SECAM 3.Enhanced 2nd generation NTSC/PAL Motion Adaptive 3D comb filter 4.Motion Adaptive 3D Noise Reduction 5.Embedded VBI decoder for Closed-Caption/XDS/ Teletext/WSS/VPS 6.Supporting Macro vision detection YPbPr/Scart/D-connector 1.Supporting HDTV 480i/480p/576i/576p/720p/1080i input 2.Smart detection on Scart function for European region 3.Smart detection on D-connector for Japan region 4.Supporting SCART RGB inputs mixed with composite signal by adjustable horizontal delay

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VGA 1.Supporting various VGA input timings up to SXGA (1280x1024@75Hz). 2.Supporting Separate/Composite/SOG sync types Digital port 1.1 digital port supporting DVI 24-bit RGB or CCIR-656/601 digital video input format 2.1 additional 8 bit digital port for ITU656 video format VBI 1.Dual VBI decoders for the application of V-Chip/Closed-Caption/XDS/ Teletext/WSS/VPS 2.Supporting external VBI decoder by YPrPb input 3.VBI decoder up to 1000 pages Teletext. 3. Support Formats: Support NTSC, NTSC-4.43 Automatic Luma / Chroma gain control Automatic TV standard detection NTSC Motion Adaptive 3D comb filter Motion adaptive 3D Noise Reduction VBI decoder for closed-caption/XDS/Teletext/WSS/VPS Macro vision detection

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BOLOCK DIAGRAM

4. 2D-Graphic/OSD processor Embedded two backend RGB domain OSD planes and one YUV domain OSD plane. to support Main/PIP Teletext/Close-caption functions together with setup menu 1.Supporting alpha blending among these two planes and video 2.Supporting Text/Bitmap decoder 3.Supporting line/rectangle/gradient fill 4.Supporting bitblt 5.Supporting color Key function 6.Supporting Clip Mask 7.65535/256/16/4/2-color bitmap format OSD, 8.Automatic vertical scrolling of OSD image

9.Supporting OSD mirror and upside down
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5. Microprocessor interface When power is supplied and power key is pressed then the rest circuit lets Reset to low state that will reset the MTK8202 to initial state. After that the Reset will transits to high state and the MTK8202 start to work that microprocessor executes the programs and configures the internal registers. The execution speed of CPU is 162 MHz.

1. The I/O ports are configured as follows
Pin name AD17 R3 V1 Y2 R4 AD22 AV22 W3 Y4 W4 B19 L4 Y1 T2 L2 R2 T4 Function PWM GPIO2 GPIO7 GPIO16 GPIO3 IOSCL IOSDA GPIO13 GPIO_18 GPIO_14 ADC_IN0 IR GPIO_15 GPIO_23 RESETn GPIO_1 GPIO_4 Type Output Output Output Output Output Input / Output Input / Output Output Output Output Input Input Output Output Input Output Output Description Backlight Adjust Panel on/off System power LVDS on/off ATSC POW on/off SDA SCL HDMI Switch Select MT8293 Reset MT8293 acknowledge to player Key ADC detection IR Receiver SYSTEM EEPROM Read / Write LED Backlight MT8202 RESET DTV & HDMI Select PIN DTV & ATV Select PIN

2. PIP/POP HARDWARE LIMITION:

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6. Video processor 1.Color Management Fully 10-bit processing to enhance the video quality Advanced flesh tone and multiple-color enhancement. (For skin, sky, and grass...) Gamma/anti-Gamma correction Advanced Color Transient Improvement (CTI) Saturation/hue adjustment 2.Contrast/Brightness/Sharpness Management Sharpness and DLTI/DCTI Brightness and contrast adjustment Black level extender White peak level limiter Adaptive Luma/Chroma management 3.De-interlacing 2nd generation advanced Motion adaptive de-interlacing Automatic detect film or video source 3:2/2:2 pull down source detection Main/PIP 2 independent de-interlacing processor 4.Scaling 2nd generation high resolution arbitrary ratio vertical/horizontal scaling of video, from 1/32X to 32X Advanced linear and non-linear Panorama scaling Programmable Zoom viewer Picture-in-Picture (PIP) Picture-Out-Picture (POP) 5.Display Advanced dithering processing for LCD display with 6/8/10 bit output 10bit gamma correction Supporting alpha blending for Video and two OSD planes Frame rate conversion

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6.Seamless performance comparing demonstration function Support Left/Right video processing comparing function without additional resources (DRAM...) for customers' demonstration All the video functions (De-interlace/3D comb/NR/Flesh tone/CTI) can be included 7. DRAM Usage

1.For features of 8202, Dual for enhance features support, and single 8x16 DDR for simple function support Lists are the comparison chart between function support lists of (2xDDR) and (1xDDR)

2.For single DDR, 8202 only support 1080i bob mode de-interlacing. (Non-3D de interlace)

3.With single DDR, it is suggested not to support PIP/POP features. Due to DDR Bandwidth limitation on PIP/POP when single DDR.

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8.DDR SDRAM (V58C2128164SBI5) Application

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Pin description

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Command Truth Table

1. Power-Up Functional Description The following sequence is required for POWER UP. 1. Apply power and attempt to maintain CKE at a low state (all other inputs may be undefined.) - Apply VDD before or at the same time as VDDQ. - Apply VDDQ before or at the same time as VTT & Vref. 2. Start clock and maintain stable condition for a minimum of 200us. 3. The minimum of 200us after stable power and clock (CLK, CLK), apply NOP & take CKE high. 4. Precharge all banks. 5. Issue EMRS to enable DLL.(To issue "DLL Enable" command, provide "Low" to A0, "High" to BA0 and "Low" to all of the rest address pins, A1~A11 and BA1) 6. Issue a mode register set command for "DLL reset". The additional 200 cycles of clock input is required to lock the DLL. (To issue DLL reset command, provide "High" to A8 and "Low" to BA0) 7. Issue precharge commands for all banks of the device. 8. Issue 2 or more auto-refresh commands. 9. Issue a mode register set command to initialize device operation
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2. Mode Register Set (MRS) The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for a variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after EMRS setting for proper DDR SDRAM operation. The mode register is written by asserting low on CS, RAS, CAS, WE and BA0 (The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the mode register). The state of address pins A0 ~ A11 in the same cycle as CS, RAS, CAS, WE and BA0 low is written in the mode register. Two clock cycles are required to meet tMRD spec. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2, addressing mode uses A3, CAS latency (read latency from column address) uses A4 ~ A6. A7 is a ProMOS specific test mode during production test. A8 is used for DLL reset. A7 must be set to low for normal MRS operation. Refer to the table for specific codes for various burst length, addressing modes and CAS latencies. 1. MRS can be issued only at all banks precharge state. 2. Minimum tRP is required to issue MRS command.

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3. Precharge

The Auto Precharge operation can be issued by having column address A10 high when a Read or Write command is issued. If A10 is low when a Read or Write command is issued, then normal Read or Write burst operation is executed and the bank remains active at the completion of the burst sequence. When the Auto Precharge command is activated, the active bank automatically begins to precharge at the earliest possible moment during the Read or Write cycle once tRAS(min) is satisfied. Read with Auto Precharge
If a Read with Auto Precharge command is initiated, the DDR SDRAM will enter the precharge operation N-clock cycles measured from the last data of the burst read cycle where N is equal to the CAS latency programmed into the device. Once the autoprecharge operation has begun, the bank cannot be reactivated until the minimum precharge time (tRP) has been satisfied.
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4. Bank Activate Command The Bank Activate command is issued by holding CAS and WE high with CS and RAS low at the rising edge of the clock. The DDR SDRAM has four independent banks, so two Bank Select addresses (BA0 and BA1) are supported. The Bank Activate command must be applied before any Read or Write operation can be executed. The delay from the Bank Activate command to the first Read or Write command must meet or exceed the minimum RAS to CAS delay time (tRCD min). Once a bank has been activated, it must be precharged before another Bank Activate command can be applied to the same bank. The minimum time interval between interleaved Bank Activate commands (Bank A to Bank B and vice versa) is the Bank to Bank delay time (tRRD min).

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5. Read Operation With the DLL enabled, all devices operating at the same frequency within a system are ensured to have the same timing relationship between DQ and DQS relative to the CK input regardless of device density, process variation, or technology generation. The data strobe signal (DQS) is driven off chip simultaneously with the output data (DQ) during each read cycle. The same internal clock phase is used to drive both the output data and data strobe signal off chip to minimize skew between data strobe and output data. This internal clock phase is nominally aligned to the input differential clock (CK, CK) by the on-chip DLL. Therefore, when the DLL is enabled and the clock frequency is within the specified range for proper DLL operation, the data strobe (DQS), output data (DQ), and the system clock (CK) are all nominally aligned. Since the data strobe and output data are tightly coupled in the system, the data strobe signal may be delayed and used to latch the output data into the receiving device. The tolerance for skew between DQS and DQ (tDQSQ) is tighter than that possible for CK to DQ (tAC) or DQS to CK (tDQSCK). 6. Precharge Timing During Read Operation For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be issued on the rising clock edge, which is CAS latency (CL) clock cycles before the end of the Read burst. A new Bank Activate (BA) command may be issued to the same bank after the RAS precharge time (tRP). A Precharge command can not be issued until tRAS(min) is satisfied.

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7.Precharge Timing During Write Operation Precharge timing for Write operations in DRAMs requires enough time to satisfy the write recovery requirement. This is the time required by a DRAM sense amp to fully store the voltage level. For DDR SDRAMs, a timing parameter (tWR) is used to indicate the required amount of time between the last valid write operation and a Precharge command to the same bank. The "write recovery" operation begins on the rising clock edge after the last DQS edge that is used to strobe in the last valid write data. "Write recovery" is complete on the next 2nd rising clock edge that is used to strobe in the Precharge command.

8. Burst Stop Command The Burst Stop command is valid only during burst read cycles and is initiated by having RAS and CAS high with CS and WE low at the rising edge of the clock. When the Burst Stop command is issued during a burst Read cycle, both the output data (DQ) and data strobe (DQS) go to a high impedance state after a delay (LBST) equal to the CAS latency programmed into the device. If the Burst Stop command is issued during a burst Write cycle, the command will be treated as a NOP command.

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9. Burst Write Operation The Burst Write command is issued by having CS, CAS, and WE low while holding RAS high at the rising edge of the clock. The address inputs determine the starting column address. The memory controller is required to provide an input data strobe (DQS) to the DDR SDRAM to strobe or latch the input data (DQ) and data mask (DM) into the device. During Write cycles, the data strobe applied to the DDR SDRAM is required to be nominally centered within the data (DQ) and data mask (DM) valid windows. The data strobe must be driven high nominally one clock after the write command has been registered. Timing parameters tDQSS(min) and tDQSS(max) define the allowable window when the data strobe must be driven high. Input data for the first Burst Write cycle must be applied one clock cycle after the Write command is registered into the device (WL=1). The input data valid window is nominally centered around the midpoint of the data strobe signal. The data window is defined by DQ to DQS setup time (tQDQSS) and DQ to DQS hold time (tQDQSH). All data inputs must be supplied on each rising and falling edge of the data strobe until the burst length is completed. When the burst has finished, any additional data supplied to the DQ pins will be ignored.

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MX29LV160BTTC (Flash) Application
The MX29LV800T/B & MX29LV800AT/AB is a 8-mega bit Flash memory organized as 1M bytes of 8 bits or 512K words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29LV800T/B & MX29LV800AT/AB is packaged in 44-pin SOP, 48-pin TSOP, and 48-ball CSP. It is designed to be reprogrammed and erased in system or in standard EPROM programmers.

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BLOCK DIAGRAM

1. COMMAND DEFINITIONS

Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 5 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress.
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2. WRITE COMMANDS/COMMAND SEQUENCES To program data to the device or erase sectors of memory, the system must drive WE and CE to VIL, and OE to VIH. The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a byte, instead of four. The "byte Program Command Sequence" section has details on programming data to the device using both standard and Unlock Bypass command sequences. An erase operation can erase one sector, multiple sectors, or the entire device. Table indicates the address space that each sector occupies. A "sector address" consists of the address bits required to uniquely select a sector. The "Writing specific address and data commands or sequences into the command register initiates device operations. Figure 1 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. Section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the auto select command sequence, the device enters the auto select mode. The system can then read auto select codes from the internal register (which is separate from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode. Refer to the Auto select Mode and Auto select Command Sequence section for more information. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification table and timing diagrams for write operations.
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Figure 1

3. READ/RESET COMMAND The read or reset operation is initiated by writing the read/reset command sequence into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid command must then be written to place the device in the desired state.

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4. READING ARRAY DATA The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Automatic Program or Automatic Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See Erase Suspend/Erase Resume Commands" for more information on this mode. The system must issue the reset command to re-enable the device for reading array data if Q5 goes high, or while in the auto select mode. See the "Reset Command" section, next. 5. RESET COMMAND Writing the reset command to the device resets the device to reading array data. Addresses bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an SILICON ID READ command sequence. Once in the SILICON ID READ mode, the reset command must be written to return to reading array data (also applies to SILICON ID READ during Erase Suspend). If Q5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend). WM8776 Application The WM8776 is a high performance, stereo audio codec with five channel input selector. The WM8776 is ideal for surround sound processing applications for home hi-fi, DVD-RW and other audiovisual equipment. Etch ADC channel has programmable gain control with automatic level control. Digital audio output word lengths from 16-32 bits and sampling rates from 32kHZ to 96KHZ are supported. The DAC has an input mixer allowing an external analogue signal to be mixed with the DAC signal. There are also Headphone and line outputs, with control for the headphone The WM8776 supports fully independent sample rates for the ADC and DAC. The audio data interface supports I2S, left justified, right justified and DSP formats.
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BLOCK DIAGRAM

1. Audio sample rate
The master clock forWM8776 supports DAC and ADC audio sampling rates 256fs to 768fs, where fs is the audio sample frequency (DACLRC or ADCLRC) typically 32KHZ, 44.1KHZ, 48KHZ or 96KHZ (the DAC also supports operation at 128fs and 192fs and 192KHZ sample rate). The master clock is used to operate the digital filters and the noise shaping circuits. In slave mode the WM8776 has a master detection circuit that automatically determines the relationship between the master clock frequency and the sampling rate (to within +/- 32 system clocks) If there is a greater than 32 clocks error the interface is disabled and ADCLRC/DACLRC for optical performance, although the WM8776 is tolerant of phase variations or jitter on this clock. Table shows the typical master clock frequency inputs for the WM8776

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2. DIGITAL AUDIO INTERFACE

1. Slave mode
The audio interfaces operations in either slave mode selectable using the MS control bit. In slave mode DIN is always an input to the WM8776 and DOUT is always an output. The default is Slave mode. In slave mode (ms=0) ADCLRC, DACLRC, ADCBCLK, DACBCLK are input to the WM8776 DIN and DACLRC are sampled by the WM8776 on the rising edge of DACBCLK; ADCLRC is sampled on the rising edge of ADCBCLK. ADC data is output on DOUT and changes on the falling edge of ADCBCLK. By setting control bit BCLKINV the polarity of ADCBCLK and DACBCLK may be reversed so that DIN and DACLRC are sample on the falling edge of DACBCLK, ADCLRC is sampled on the falling edge of ADCBCLK and DOUT changes on the rising of ADCBCLK Slave mode as shown in the following figure.

2. 2 Wire serial control mode
The wm8776 supports software control via a 2-wire serial bus. Many devices can be controlled by the same bus, and each device has a unique 7-bit address (this is not the same as the 7-bit address of each register in the wm8776). The wm8776 operates as a slave device only. 2-wire serial interface as shown in the following figure.
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The wm8776 has two possible device addresses, which can be selected using the CE pin In the L32 LCD TV CE pin is LOW (device address is 34h)

In the L32 wm8776 has 2-wire interface

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MT8293 Application
The MT8293 provides a complete solution for receiving HDMI compliant digital audio and video. Specialized audio and video processing is available within the MT8293 to easily and cost effectively adds HDMI capability to consumer electronics devices such as digital TVs, plasma displays, LCD TVs and projectors. BLOCK DIAGRAM

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1. TMDS Digital Core
The core performs 10-to-8-bit TMDS decoding on the audio and video received from the three TMDS differential data lines along with a TMDS differential clock. The TMDS core supports link clock rates to 165MHZ, including CE modes to 720P/1080I/1080P.

2. Active port detection
The Pane Link core detects an active TMDS clock and actively toggling DE signal. These states are accessible in register bits, useful for monitoring the status of the HDMI input or for automatically powering down the receiver. The 5V supply from the HDMI connector is used as a cable detect indicator. The MT8293 can monitor the presence of this+5V supply and, if and when necessary, provide a fast audio mute without pops when it senses the HDMI cable pulled. The microcontroller can also poll registers in the MT8293 to check whether an HDMI cable is connected.

3. HDCP Decryption The MT8293 external EEPROM for encrypt HDCP keys. HDCP decryption contains all necessary logic to decrypt the incoming audio and video data. The decryption process is entirely controlled by the host microprocessor through a set sequence of register reads and wires through the DDC channel. Pre-programmed HDCP keys and key Selection Vector are used in the decryption process. A resulting calculated to an XOR mask during each clock cycle to decrypt the audio/video data in sync with the host. 4. Video Data Conversion and Video Output
The MT8293 can output video in many different formats as shown in the following figure.

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The receiver can also process the video data before it is output as show below figure

5. I2c Interface to Display Controller
The Controller I2c interface (CSDA, CSCL) on the MT8293 is a slave interface capable of running up to 400KHZ. This bus is used to configure the MT8293 by reading/writing to the appropriate registers. The MT8293 is accessible on the local I2c bits at two-device address. The logic state of the CI2CA pin is latched on the rising edge of REST# providing a choice of two pairs of device address. Control of local I2c address with CI2CA pin

TDA8946 Application
In L32 TV the TDA8946AJ is a dual-channel audio power amplifier with DC gain control. It has an output power of 2 10 W at an 8 load and a 12 V supply.

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Block diagram

1. Input configuration
The TDA8946AJ inputs can be driven symmetrical (floating) as well as asymmetrical. In the asymmetrical mode one input pin is connected via a capacitor to the signal source and the other input is connected to the signal ground. The signal ground should be as close as possible to the SVR (electrolytic) capacitor ground. Note that the DC level of the input pins is half of the supply voltage VCC, so coupling capacitors for both pins are necessary

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2. Output power measurement
The output power as a function of the supply voltage is measured on the output pins at THD = 10%,in the L32 LCD TV Vcc=12V so we can see as shown in the following figure output about 7W.

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3. Mode selection
In the L32 LCD TV TDA8946AJ has two functional modes, which can be selected by applying the proper DC voltage to pin MODE. 1. Mute -- In this mode the amplifier is DC-biased but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 3.5 V < VMODE < (VCC VMODE<1.0V. 1.5 V). 2. Operating -- In this mode the amplifier is operating normally. The operating mode is activated at

MT5351 Application :
MediaTek MT5351 is a DTV Backend Decoder SOC which support flexible transport demux , HD MPEG-2 video decoder , JPEG decoder , MPEG1,2,MP3,AC3 audio decoder , HDTV encoder . The MT5351 enables consumer electronics manufactures to build high quality , feature-rich DTV , STB or other home entertainment audio/video device.World-Leading Technology : HW support worldwide major broadcast network and CA standards , include ATSC , DVB , OpenCable , DirectTV , MHP.Rich Feature for high value product : To enrich the feature of DTV , the MT5351 support 1394-5C component to external DVHS . Dual display , PIP/POP and quad pictures provide user a whole new viewing experience.Credible Audio/Video Quality : The MT5351 use advanced motion-adaptive de-interlace algorithm to achieve the best movie/video playback , The embedded 4X over-sample video DAC could generate very fine display quality . Also , the audio 3D surround and equalizer provide professional entertainment.
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General Feature List :
1 . Host CPU: 1. ARM 926EJ 2.16K I-Cache and 16K D-Cache 3. 8K Data TCM and 8K instruction 4. JTAG ICE interface 5. Watch Dog timers 2 . Transport Demuxer : 1. Support 3 independent transport stream inputs 2. Support serial/parallel interface for each transport stream input 3. Support ATSC , DVB , and MPEG2 transport stream inputs. 4. Programmable sync detection. 5. Support DES/3-DES De-scramble. 6. 96 PID filter and 128 section filters. 7. Support TS recording via IEEE1394 interface. 3 . MPEG2 Decoder : 1. Support dual MPEG-2 HD decoder or up to 8 SD decoder. 2. Complaint to MP@ML , MP@HL and MPEG-1 video standards. 4 . JPEG Decoder : 1. Decode Base-line or progressive JPEG file. 5 . 2D Graphics : 1. Support multiple color modes. 2. Point , horizontal/vertical line primitive drawing. 3. Rectangle fill and gradient fill functions. 4. Bitblt with transparent , alpha blending , alpha composition and stretch. 5. Font rendering by color expansion. 6. Support clip masks. 7. YCrCb to RGB color space transfer. 6 . OSD Display : 1. 3 linking list OSDs with multiple color mode. 2. OSD scaling with arbitary ratio from 1/2x to 2x. 3. Square size , 32x32 or 64x64 pixel , hardware cursor.
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7 . Video Processing : 1. Advanced Motion adaptive de-interlace on SDTV resolution. 2. Support clip 3. 3:2/2:2 pull down source detection. 4. Arbitrary ratio vertical/horizontal scaling of video , from 1/15X to 16X. 5. Support Edge preserve. 6. Support horizontal edge enhancement. 7. Support Quad-Picture. 8 . Main Display : 1. Mixing two video and three OSD and hardware cursor. 2. Contrast/Brightness adjustment. 3. Gamma correction. 4. Picture-in-Picture( PIP ). 5. Picture-Out-Picture( POP ). 6. 480i/576i/480p/576p/720p/1080i output 9 . Auxiliary Display : 1. Mixing one video and one OSD. 2. 480i/576i output. 10 . TV Encoder : 1. Support NTSC M/N , PAL M/N/B/D/G/H/I 2. Macrovision Rev 7.1.L1 3. CGMS/WSS. 4. Closed Captioning. 5. Six 12-bit video DACs for CVBS , S-video or RGB/YPbPr output. 11 . Digital Video Interface : 1. Support SAV/EAV. 2. Support 8/16 for SD/HD digital video input. 3. Support 8/16/24 bits digital output for main display. 4. Support 8 bits digital output for aux display.

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12 . DRAM Controller : 1. Support 64Mb to 1Gb DDR DRAM devices. 2. Configurable 32/64 bit data bus interface.

3. Support DDR266 , DDR333 , DDR400 , JEDEC specification compliant SDRAM.
13 . Peripheral Bus Interface : 1. Support NOR/NAND flash. 2. Support CableCard host control bus. 14 . Audio : 1. Support Dolby Digital AC-3 decoding. 2. MPEG-1 layer I/II , MP3 decoding. 3. Dolby prologic II. 4. Main audio output : 5.1ch + 2ch ( down mix ) 5. Auxiliary audio output : 2ch. 6. Pink noise and white noise generator. 7. Equalizer. 8. Bass management. 9. 3D surround processing include virtual surround. 10. Audio and video lip synchronization. 11. Support reverberation. 12. SPDIF out. 13. I2S I/F. 15 . Peripherals : 1. Three UARTs with Tx and Rx FIFO , two of them have hardware flow control. 2. Two serial interfaces , one is master only the other can be set to master mode or slave mode. 3. Two PWMs. 4. IR blaster and receiver. 5. IEEE1394 link controller. 6. IDE bus : ATA/ATAPI7 UDMA mode 5 , 100MB/s. 7. Real-time clock and watchdog controller. 8. Memory card I/F : MS/MS-pro ,SD ,CF ,and MMC 9. PCMCIA/POD/CI interface
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16 . IC Outline : 1. 471 Pin BGA Package.

2. 3.3V/1.2V dual Voltage. MX29LV320BTTC (Flash) Application :
The MX29LV320AT/B is a 32-mega bit Flash memory organized as 4M bytes of 8 bits and 2M words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29LV320AT/B is packaged in 48-pin TSOP and 48-ball CSP. It is designed to be reprogrammed and erased in system or in standard EPROM programmers. The standard MX29LV320AT/B offers access time as fast as 70ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29LV320AT/B has separate chip enable (CE) and output enable (OE) controls. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29LV320AT/B uses a command register to manage this functionality. MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and program mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and programming operations produces reliable cycling. The MX29LV320AT/B uses a 2.7V to 3.6V VCC supply to perform the High Reliability Erase and auto Program/Erase algorithms. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamperes on address and data pin from -1V to VCC + 1V.

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BLOCK DIAGRAM

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BUS OPERATION--1

Legend: L=Logic LOW=VIL, H=Logic High=VIH, VID=12.0 AIN=Address IN, DIN=Data IN,DOUT=Data OUT Notes: 1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See "Accelerated Program Operations" for more information. 2.The sector group protect and chip unprotect functions may also be implemented via programming equipment. See the "Sector Group Protection and Chip Unprotection" section. 3.If WP/ACC=VIL, the two outermost boot sectors remain protected. If WP/ACC=VIH, the two outermost boot sector protection depends on whether they were last protected or unprotected using the method described in "Sector/Sector Block Protection and Unprotection". If WP/ACC=VHH, all sectors will be unprotected. 4.DIN or Dout as required by command sequence, data polling, or sector protection algorithm. 5.Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL). 0.5V, VHH=11.5-12.5V, X=Don't Care,

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BUS OPERATION--2

Notes: 1.Code=00h means unprotected, or code=01h protected. 2.Code=99 means factory locked, or code=19h not factory locked.

WRITE COMMANDS/COMMAND SEQUENCES
To program data to the device or erase sectors of memory , the system must drive WE and CE to VIL, and OE to VIH.An erase operation can erase one sector, multiple sectors , or the entire device. A "sector address" consists of the address bits required to uniquely select a sector. Writing specific address and data commands or sequences into the command register initiates device operations. Table A defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. Section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the Automatic Select command sequence, the device enters the Automatic Select mode. The system can then read Automatic Select codes from the internal register (which is separate from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode. Refer to the Automatic Select Mode and Automatic Select Command Sequence section for more information.ICC2 in the DC Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification table and timing diagrams for write operations.

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TABLE A. MX29LV320AT/B COMMAND DEFINITIONS

Legend:
X=Don't care RA=Address of the memory location to be read. RD=Data read from location RA during read operation. PA=Address of the memory location to be programmed. Addresses are latched on the falling edge of the WE or CE pulse. PD=Data to be programmed at location PA. Data is latched on the rising edge of WE or CE pulse. SA=Address of the sector to be erased or verified. Address bits A20-A12 uniquely select any sector. ID=22A7h(Top), 22A8h(Bottom)

Notes:
1.All values are in hexadecimal. 2.Except when reading array or Automatic Select data, all bus cycles are write operation. 3.The Reset command is required to return to the read mode when the device is in the Automatic Select mode or if Q5 goes high. 4.The fourth cycle of the Automatic Select command sequence is a read cycle. 5.The data is 99h for factory locked and 19h for not factory locked. 6.The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector block. In the third cycle of the command sequence, address bit A20=0 to verify sectors 0~31, A20=1 to verify sectors 32~70 for Top Boot device. 7.Command is valid when device is ready to read array data or when device is in Automatic Select mode. 8.The system may read and program functions in non-erasing sectors, or enter the Automatic Select mode, when in the erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation. 9.The Erase Resume command is valid only during the Erase Suspend mode.
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STANDBY MODE
MX29LV320AT/B can be set into Standby mode with two different approaches. One is using both CE and RESET pins and the other one is using RESET pin only. When using both pins of CE and RESET, a CMOS Standby mode is achieved with both pins held at Vcc ±0.3V. Under this condition, the current consumed is less than 0.2uA (typ.). If both of the CE and RESET are held at VIH, but not within the range of VCC ± 0.3V, the device will still be in the standby mode, but the standby current will be larger. During Auto Algorithm operation, Vcc active current (ICC2) is required even CE = "H" until the operation is completed. The device can be read with standard access time (tCE) from either of these standby modes. When using only RESET, a CMOS standby mode is achieved with RESET input held at Vss 0.3V, Under this condition the current is consumed less than 1uA (typ.). Once the RESET pin is taken high, the device is back to active without recovery delay.In the standby mode the outputs are in the high impedance state, independent of the OE input.MX29LV320AT/B is capable to provide the Automatic Standby Mode to restrain power consumption during readout of data. This mode can be used effectively with an application requested low power consumption such as handy terminals. To active this mode, MX29LV320AT/B automatically switch themselves to low power mode when MX29LV320AT/B addresses remain stable during access time of tACC+30ns. It is not necessary to control CE, WE, and OE on the mode. Under the mode, the current consumed is typically 0.2uA (CMOS level). RESET OPERATION 01The RESET pin provides a hardware method of resetting the device to reading array data. When the RESET pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. Current is reduced for the duration of the RESET pulse. When RESET is held at VSS device draws CMOS standby current (ICC4). If RESET is held at VIL but not within VSS 0.3V, the 0.3V, the

standby current will be greater.The RESET pin may be tied to system reset circuitry. A system reset would that also reset the Flash memory, enabling the system to read the boot-up firm-ware from the Flash memory.

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If RESET is asserted during a program or erase operation, the RY/BY pin remains a "0" (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY to determine whether the reset operation is complete. If RESET is asserted when a program or erase operation is not executing (RY/BY pin is "1"), the reset operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET pin returns to VIH. Refer to the AC Characteristics tables for RESET parameters and to Figure 14 for the timing diagram.

WRITE PROTECT (WP)
The write protect function provides a hardware method to protect boot sectors without using VID. If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions in the two "outermost" 8 Kbyte boot sectors independently of whether those sectors were protected or unprotected using the method described in Sector/Sector Group Protection and Chip Unprotection". The two outermost 8 Kbyte boot sectors are the two sectors containing the lowest addresses in a bottom-boot-configured device, or the two sectors containing the highest addresses in a top-boot-configured device. If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost 8K Byte boot sectors were last set to be protected or unprotected. That is, sector protection or unprotection for these two sectors depends on whether they were last protected or unprotected using the method described in "Sector/Sector Group Protection and Chip Unprotection". Note that the WP/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result.

SOFTWARE COMMAND DEFINITIONS :
Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 3 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. Either of the two reset command sequences will reset the device (whenapplicable). All addresses are latched on the falling edge of WE or CE, whichever happens later. All data are latched on rising edge of WE or CE, whichever happens first.

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WRITE OPERATION STATUS
The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/BY.Table B and the following subsections describe the functions of these bits. Q7, RY/BY, and Q6 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first.

Table B. Write Operation Status

Notes: 1.Performing successive read operations from the erase-suspended sector will cause Q2 to toggle. 2.Performing successive read operations from any address will cause Q6 to toggle. 3.Reading the byte/word address being programmed while in the erase-suspend program mode will indicate logic "1" at the Q2 bit. However, successive reads from the erase-suspended sector will cause Q2 to toggle.

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Fig C. COMMAND WRITE OPERATION

Fig D. READ TIMING WAVEFORMS

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Fig E. RESET TIMING WAVEFORM

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DDR SDRAM (NT5DS16M16CS-5T) Application:
Functional Description The 256Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 268, 435, 456 bits. The 256Mb DDR SDRAM is internally configured as a quad-bank DRAM. The 256Mb DDR SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 256Mb DDR SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the I/O pins. Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst access.Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.

Block Diagram (16Mb x 16)

Note: This Functional Block Diagram is intended to facilitate user understanding of the operation of the device; it does not represent an actual circuit implementation. Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the bidirectional DQ and DQS signals.
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Pin Configuration - 400mil TSOP II (x4 / x8 / x16)

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Mode Register Operation

Operating Mode
The normal operating mode is selected by issuing a Mode Register Set Command with bits A7-A12 to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a Mode Register Set command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and bits A0-A6 set to the desired values. A Mode Register Set command issued to reset the DLL should always be followed by a Mode Register Set command to select normal operating mode. All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test modes and reserved states should not be used as unknown operation or incompatibility with future versions may result.

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Extended Mode Register
The Extended Mode Register controls functions beyond those controlled by the Mode Register; these additional functions include DLL enable/disable, bit A0; output drive strength selection, bit A1; and QFC output enable/disable, bit A2 (NTC optional). These functions are controlled via the bit settings shown in the Extended Mode Register Definition. The Extended Mode Register is programmed via the Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the stored information until it is programmed again or the device loses power. The Extended Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating any subsequent operation. Violating either of these requirements result in unspecified operation.

Extended Mode Register Definition

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Truth Table a: Commands

1. CKE is high for all commands shown except Self Refresh. 2. BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0,